公开(公告)号：US20120331433A1

公开(公告)日：2012-12-27

申请号：US13568720

申请日：2012-08-07

申请人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

发明人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

IPC分类号： G06F17/50

CPC分类号： H01L25/0657 ,  H01L23/473 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06589

摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).

摘要翻译： 本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。 使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。 本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。

公开(公告)号：US08268544B2

公开(公告)日：2012-09-18

申请号：US11721199

申请日：2005-12-01

申请人： Heinz Schmid ,  Bruno Michel ,  Urs Kloter ,  Gerhard Keller ,  Jean-Paul Cano

发明人： Heinz Schmid ,  Bruno Michel ,  Urs Kloter ,  Gerhard Keller ,  Jean-Paul Cano

IPC分类号： G03F7/26 ,  B41F31/00 ,  B29C47/00

CPC分类号： B41F17/001 ,  B29C43/003 ,  B29C43/021 ,  B29C43/12 ,  B29C2043/025 ,  B29C2043/3647 ,  B41F17/30 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  G03F7/0002

摘要： A stamp for patterning onto a receiving surface of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface is planar at rest. The pattern is reproduced on the stamping surface and the diaphragm is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm can move along a direction perpendicular to the stamping surface. The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

摘要翻译： 用于根据限定图案（P）图案化到物体（101）的接收表面上的印模包括弹性隔膜（20）的冲压表面（21）。 冲压表面是平面的静止。 图案在冲压表面上再现，​​并且隔膜沿着周边边缘固定到刚体（13），使得隔膜的中间部分可以沿着垂直于冲压表面的方向移动。 隔膜（20）在周边边缘比在中间部分更加柔软。 然后，使用印模印刷在伪球形接收表面（103）上的图案（P）显示出很小的变形。

公开(公告)号：US08267011B2

公开(公告)日：2012-09-18

申请号：US12748624

申请日：2010-03-29

申请人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

发明人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

IPC分类号： B41K1/02 ,  B41K1/36

CPC分类号： B01J19/0093 ,  B01J2219/00382 ,  B01J2219/00527 ,  B01J2219/0072 ,  B01J2219/0074 ,  B01J2219/00745 ,  B01J2219/00747 ,  B01J2219/00783 ,  B01J2219/00833 ,  B01L3/0293 ,  B01L2300/0819 ,  B41K1/30 ,  B41M3/006 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/1002 ,  G01N2035/1034 ,  H05K3/12 ,  Y10S977/887

摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.

摘要翻译： 描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。 在印模和基板之间实现接近接触。 将印模和基板之间的第三介质层控制到预定厚度。 还描述了用于执行该方法的邮票。

公开(公告)号：US20120189243A1

公开(公告)日：2012-07-26

申请号：US13010184

申请日：2011-01-20

申请人： Harry Barowski ,  Thomas Brunschwiler ,  Roger F. Dangel ,  Hubert Harrer ,  Andreas Huber ,  Norbert M. Meier ,  Bruno Michel ,  Tim Niggemeier ,  Stephan Paredes ,  Jochen Supper ,  Jonas R. Weiss

发明人： Harry Barowski ,  Thomas Brunschwiler ,  Roger F. Dangel ,  Hubert Harrer ,  Andreas Huber ,  Norbert M. Meier ,  Bruno Michel ,  Tim Niggemeier ,  Stephan Paredes ,  Jochen Supper ,  Jonas R. Weiss

IPC分类号： G02B6/12 ,  G06F17/50

CPC分类号： H01L23/367 ,  G02B6/12 ,  G02B6/122 ,  G02B6/4269 ,  G02B6/4272 ,  G02B6/43 ,  G02B2006/12147 ,  G06F17/5022 ,  G06F17/5068 ,  G06F17/5077 ,  H01L2224/16225 ,  H01L2924/15311

摘要： An integrated circuitry structure includes at least first and second regions. An optical layer includes optical waveguides. A heat-conductive material transfers heat from at least the second region through the optical layer to a heat sink.

摘要翻译： 集成电路结构至少包括第一和第二区域。 光学层包括光波导。 导热材料将热量从至少第二区域传递通过光学层到散热器。

公开(公告)号：US20120105144A1

公开(公告)日：2012-05-03

申请号：US12914644

申请日：2010-10-28

申请人： Harry Barowski ,  Thomas Brunschwiler ,  Hubert Harrer ,  Andreas Huber ,  Bruno Michel ,  Tim Niggemeier ,  Stephan Paredes ,  Jochen Supper

发明人： Harry Barowski ,  Thomas Brunschwiler ,  Hubert Harrer ,  Andreas Huber ,  Bruno Michel ,  Tim Niggemeier ,  Stephan Paredes ,  Jochen Supper

IPC分类号： H01L25/00 ,  H01L21/50

CPC分类号： H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2225/06513 ,  H01L2225/06589 ,  H01L2225/1052 ,  H01L2225/1088 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/41 ,  H01L2924/00

摘要： A mechanism is provided for optimizing semiconductor packing in a three-dimensional (3D) very-large-scale integration (VLSI) device. The 3D VLSI device comprises a processor layer coupled, via a first set of coupling devices, to at least one signaling and input/output (I/O) layer. The 3D VLSI device further comprises a power delivery layer coupled, via a second set of coupling devices, to the processor layer. In the 3D VLSI device the power delivery layer is dedicated to only delivering power and does not provide data communication signals to the elements of the three-dimensional VLSI device, and the at least one signaling and input/output (I/O) layer is dedicated to only transmitting the data communication signals to and receiving the data communications signals from the processor layer and does not provide power to the elements of the processor layer.

公开(公告)号：US08049207B2

公开(公告)日：2011-11-01

申请号：US11866478

申请日：2007-10-03

申请人： Siegfried F. Karg ,  Bruno Michel ,  Heike E. Riel ,  Walter H. Riess

发明人： Siegfried F. Karg ,  Bruno Michel ,  Heike E. Riel ,  Walter H. Riess

IPC分类号： H01L51/00

CPC分类号： H01L51/0004 ,  Y10T428/14 ,  Y10T428/1419 ,  Y10T428/1429 ,  Y10T428/1438

摘要： A method for manufacturing an organic electronic device including a stack of layers including a release layer, the stack having a lateral structure on a substrate, at least one of the layers being an organic material layer. A method includes with the step of providing a stamp with at least one protrusion of the surface area corresponding to the lateral structure. The stack of layers is deposited with a first face on the surface area of the protrusion of the stamp. A second face of the stack that is opposite to the first face is brought into adhesive contact with the substrate. The stamp is released from the stack.

摘要翻译： 一种制造有机电子器件的方法，该有机电子器件包括一层包括剥离层的层，所述堆叠在衬底上具有侧向结构，所述层中的至少一层是有机材料层。 一种方法包括以下步骤：提供具有对应于横向结构的表面区域的至少一个突起的印模。 层叠堆叠在印模的突起的表面区域上的第一面。 与第一面相对的堆叠的第二面与基底粘合接触。 邮票从堆栈中释放。

公开(公告)号：US07891295B2

公开(公告)日：2011-02-22

申请号：US12249322

申请日：2008-10-10

申请人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

发明人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

IPC分类号： B41M9/00

CPC分类号： B01J19/0093 ,  B01J2219/00382 ,  B01J2219/00527 ,  B01J2219/0072 ,  B01J2219/0074 ,  B01J2219/00745 ,  B01J2219/00747 ,  B01J2219/00783 ,  B01J2219/00833 ,  B01L3/0293 ,  B01L2300/0819 ,  B41K1/30 ,  B41M3/006 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/1002 ,  G01N2035/1034 ,  H05K3/12 ,  Y10S977/887

摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.

摘要翻译： 描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。 在印模和基板之间实现接近接触。 将印模和基板之间的第三介质层控制到预定厚度。 还描述了用于执行该方法的邮票。

公开(公告)号：US20100290188A1

公开(公告)日：2010-11-18

申请号：US12678298

申请日：2008-09-17

申请人： Thomas J. Brunschwiler ,  Ryan Joseph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

发明人： Thomas J. Brunschwiler ,  Ryan Joseph Linderman ,  Bruno Michel ,  Hugo E. Rothuizen

IPC分类号： H05K7/20

CPC分类号： H01L25/0657 ,  H01L23/473 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06589

摘要： The invention relates to an integrated circuit stack (1) comprising a plurality of integrated circuit layers (2) and at least one cooling layer (3) arranged in a space between two circuit layers (2). The integrated circuit stack (1) is cooled using a cooling fluid (10) pumped through the cooling layer (3). The invention further relates to a method for optimizing a configuration of such an integrated circuit stack (1).

摘要翻译： 本发明涉及包括多个集成电路层（2）和布置在两个电路层（2）之间的空间中的至少一个冷却层（3）的集成电路堆叠（1）。 使用泵送通过冷却层（3）的冷却流体（10）来冷却集成电路堆（1）。 本发明还涉及一种用于优化这种集成电路堆叠（1）的配置的方法。

公开(公告)号：US20100241278A1

公开(公告)日：2010-09-23

申请号：US12793905

申请日：2010-06-04

申请人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

发明人： Thomas J. Brunschwiler ,  Ryan J. Linderman ,  Bruno Michel ,  Erich M. Ruetsche

IPC分类号： G05D23/19 ,  G06F1/20 ,  G05D7/06

CPC分类号： G06F1/20 ,  G06F2200/201 ,  H05K7/20772 ,  Y10S165/908

摘要： Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.

公开(公告)号：US20100180782A1

公开(公告)日：2010-07-22

申请号：US12748624

申请日：2010-03-29

申请人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

发明人： Alexander Bietsch ,  Emmanuel Delamarche ,  Bruno Michel ,  Heinz Schmid ,  Heiko Wolf

IPC分类号： B41K1/42

CPC分类号： B01J19/0093 ,  B01J2219/00382 ,  B01J2219/00527 ,  B01J2219/0072 ,  B01J2219/0074 ,  B01J2219/00745 ,  B01J2219/00747 ,  B01J2219/00783 ,  B01J2219/00833 ,  B01L3/0293 ,  B01L2300/0819 ,  B41K1/30 ,  B41M3/006 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/1002 ,  G01N2035/1034 ,  H05K3/12 ,  Y10S977/887

摘要： A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.

摘要翻译： 描述了在存在第三介质的情况下将图案从弹性印模转印到基板上的方法。 在印模和基板之间实现接近接触。 将印模和基板之间的第三介质层控制到预定厚度。 还描述了用于执行该方法的邮票。