公开(公告)号：US07666715B2

公开(公告)日：2010-02-23

申请号：US10578854

申请日：2004-12-14

申请人： Herbert Brunner ,  Harald Jäger ,  Jörg Erich Sorg

发明人： Herbert Brunner ,  Harald Jäger ,  Jörg Erich Sorg

IPC分类号： H01L23/31

CPC分类号： H01L33/56 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/501 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014

摘要： A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

摘要翻译： 包含辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体部件，对半导体部件要发射和/或接收的电磁辐射透明的模制塑料部件 半导体芯片至少部分地包覆成型，以及电连接到半导体芯片的电接触区域的外部电引线。 模制塑料部件由反应固化硅树脂模塑料制成。 还规定了制造这种半导体部件的方法。

公开(公告)号：US20090197361A1

公开(公告)日：2009-08-06

申请号：US12421814

申请日：2009-04-10

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/56

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US07436002B2

公开(公告)日：2008-10-14

申请号：US10747703

申请日：2003-12-29

申请人： Herbert Brunner ,  Klaus Höhn ,  Harald Jäger ,  Josef Schmid

发明人： Herbert Brunner ,  Klaus Höhn ,  Harald Jäger ,  Josef Schmid

IPC分类号： H01L33/00 ,  H05K3/34

CPC分类号： H01L33/486 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light-emitting diode chip.

摘要翻译： 辐射发射表面可安装部件具有安装在引线框架上的发光二极管芯片。 成型材料封装引线框和发光二极管芯片。

公开(公告)号：US07319245B2

公开(公告)日：2008-01-15

申请号：US11487742

申请日：2006-07-17

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jäger ,  Günther Waitl

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.

摘要翻译： 一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为 与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

公开(公告)号：US07288831B2

公开(公告)日：2007-10-30

申请号：US11463127

申请日：2006-08-08

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495 ,  H01L31/0203

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向突出，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US20070034885A1

公开(公告)日：2007-02-15

申请号：US10572891

申请日：2004-09-24

申请人： Bert Braune ,  Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Martin Zachau

发明人： Bert Braune ,  Herbert Brunner ,  Tim Fiedler ,  Frank Jermann ,  Martin Zachau

IPC分类号： H01L33/00 ,  H01J1/62 ,  H01L29/22 ,  H01J63/04 ,  H01L29/227

CPC分类号： H01L33/502 ,  C09K11/0883 ,  C09K11/7734 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： Phosphor from the class of the oxynitridosilicates, having a cation M which is doped with divalent europium and having the empirical formula M(1-c)Si2O2N2:DC, where M=Sr or M=Sr(1-x-y)BaYCax with x+y

摘要翻译： 具有掺杂有二价铕的阳离子M并具有经验式M（1-c）2 Si 2 O 2的氧氮硅酸盐类的荧光体 其中M = Sr或M = Sr（1-xy）Ba Y，其中M = Sr或M = 使用x + y <0.5的氧化硅酸盐，完全或主要包含高温稳定的改性HT的氧氮化硅酸盐。

公开(公告)号：US20060284287A1

公开(公告)日：2006-12-21

申请号：US11463127

申请日：2006-08-08

申请人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

发明人： Guenther Waitl ,  Franz Schellhorn ,  Herbert Brunner

IPC分类号： H01L23/495

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/3426 ,  H05K2201/10454 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/613 ,  H01L2924/00014

摘要： In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

摘要翻译： 在用于半导体部件的引线框架技术的两极SMT微型外壳中，半导体芯片安装在一个引线框架部分上并与另外的引线框部分接触。 另外的引线框架部分被从芯片封装的壳体中导出，作为焊接端子。 不需要修整或成形工艺，并且外壳紧凑并且能够进一步小型化。 作为引线框架的冲压部分的焊接端子从彼此相对的壳体侧壁横向进行，至少直到形成部件安装表面的壳体底板。 芯片安装表面和部件的安装表面彼此成直角。

公开(公告)号：US20060255355A1

公开(公告)日：2006-11-16

申请号：US11487742

申请日：2006-07-17

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

IPC分类号： H01L33/00 ,  H01L23/29 ,  H01L29/22

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.

摘要翻译： 一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为 与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

公开(公告)号：US20060003477A1

公开(公告)日：2006-01-05

申请号：US10532848

申请日：2003-10-21

申请人： Bert Braune ,  Herbert Brunner

发明人： Bert Braune ,  Herbert Brunner

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L33/38 ,  H01L2224/11 ,  H01L2933/0016 ,  H01L2933/0041

摘要： The invention describes a method for producing a light-emitting-diode (LED) light source, particularly comprising mixed-color LEDs, wherein at least a portion of primary radiation emitted by a chip is transformed by luminescence conversion. Said chip comprises a front-side (i.e., the side facing in the direction of radiation) electrical contact to whose surface a luminescence conversion material is applied in the form of a thin layer. Prior to coating, the front-side electrical contact is raised by the application of an electrically conductive material to the electrical contact surface. The method enables specific color coordinates to be adjusted selectively by monitoring the color coordinates (IEC chromaticity diagram) and thinning the layer of luminescence conversion material. In addition, the method is suited in particular for simultaneously producing a plurality of LED light sources from a multiplicity of similar chips in a wafer composite.

摘要翻译： 本发明描述了一种用于制造发光二极管（LED）光源的方法，特别地包括混合彩色LED，其中由芯片发射的初级辐射的至少一部分通过发光转换而变换。 所述芯片包括前表面（即面向辐射方向的一侧）电接触，其表面以薄层的形式施加发光转换材料。 在涂覆之前，通过将导电材料施加到电接触表面来提高前侧电接触。 该方法通过监视颜色坐标（IEC色度图）和稀释发光转换材料层来选择性地调整特定的颜色坐标。 此外，该方法特别适用于从晶片复合材料中的多个类似的芯片同时制造多个LED光源。

公开(公告)号：US06946714B2

公开(公告)日：2005-09-20

申请号：US10439695

申请日：2003-05-16

申请人： Günter Waitl ,  Robert Lutz ,  Herbert Brunner

发明人： Günter Waitl ,  Robert Lutz ,  Herbert Brunner

IPC分类号： H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/48 ,  H01L33/58

CPC分类号： H01L33/486 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/58 ,  H01L2224/48247 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.

摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。