-
公开(公告)号：US07675132B2
公开(公告)日：2010-03-09
申请号：US11202424
申请日：2005-08-11
申请人： Günter Waitl , Robert Lutz , Herbert Brunner
发明人： Günter Waitl , Robert Lutz , Herbert Brunner
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.
摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。
-
公开(公告)号：US06946714B2
公开(公告)日：2005-09-20
申请号：US10439695
申请日：2003-05-16
申请人： Günter Waitl , Robert Lutz , Herbert Brunner
发明人： Günter Waitl , Robert Lutz , Herbert Brunner
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L33/48 , H01L33/58
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A method for producing a surface mounting optoelectronic component comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, whereby the optical device comes into contact with the casting compound.
摘要翻译： 一种用于制造表面安装光电子部件的方法包括以下步骤：利用布置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部， 并将光学装置放置在基体上，由此光学装置与铸塑料接触。
-
公开(公告)号：US06610563B1
公开(公告)日：2003-08-26
申请号：US09581585
申请日：2000-10-05
申请人： Günter Waitl , Robert Lutz , Herbert Brunner
发明人： Günter Waitl , Robert Lutz , Herbert Brunner
IPC分类号： H01L2120
CPC分类号： H01L33/486 , H01L31/0203 , H01L31/02325 , H01L33/58 , H01L2224/48247 , H01L2224/48091 , H01L2924/00014
摘要： A method for producing a surface mounting optoelectronic component having comprises the following steps: readying a base body with the optoelectronic transmitter and/or receiver arranged in a recess of the base body, filling the recess of the base body with a transparent, curable casting compound, and placing the optical device onto the base body, so whereby the optical device comes into contact with the casting compound.
摘要翻译： 一种用于制造表面安装光电子部件的方法，包括以下步骤：用设置在基体的凹部中的光电发射器和/或接收器准备基体，用透明的可固化铸塑料填充基体的凹部 并且将光学装置放置在基体上，由此光学装置与铸塑料接触。
-
公开(公告)号：US06927469B2
公开(公告)日：2005-08-09
申请号：US10173055
申请日：2002-06-17
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L33/00 , H01L23/29 , H01L27/14 , H01L23/795 , H01L31/08
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。
-
公开(公告)号：US07199454B2
公开(公告)日：2007-04-03
申请号：US11002959
申请日：2004-12-02
IPC分类号： H01L23/497
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。
-
6.发明授权公开(公告)号：US06975011B2
公开(公告)日：2005-12-13
申请号：US10819638
申请日：2004-04-06
IPC分类号： H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/48 , H01L33/60 , H01L33/64 , H01L23/29 , H01L33/00 , H01L27/14 , H01L23/795 , G03F7/075
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/024 , H01L33/60 , H01L33/642 , H01L33/647 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.
摘要翻译： 辐射发射和/或辐射接收半导体部件，其中辐射发射和/或辐射接收半导体芯片固定在引线框架的芯片载体部分上。 芯片载体部分在其中固定半导体芯片的区域中形成槽，其中槽的内表面被设计成使得其构成用于由半导体芯片发射和/或接收的辐射的反射器。
-
公开(公告)号：US07688401B2
公开(公告)日：2010-03-30
申请号：US11748058
申请日：2007-05-14
IPC分类号： G02F1/1335
CPC分类号： G02B6/0018 , G02B6/00 , G02B6/0001 , G02B6/0043 , G02B6/0068 , G02B6/4298 , G02F1/133615 , G09F9/35
摘要： A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.
摘要翻译： 光源元件采用液晶显示器的背光，并且包括倾斜放置的光出射面和/或光入射面。 在其表面处，光波导被反射器包围，其中可能形成适当的孔径区域。 提供了多个光源和/或更直观的视图，并因此提供亮度结果的相应增加。 还提供了一种用于制造具有集成反射器的光源元件的方法。
-
公开(公告)号：US07688400B1
公开(公告)日：2010-03-30
申请号：US09868364
申请日：1999-12-29
IPC分类号： G02F1/1335
CPC分类号： G02B6/0018 , G02B6/00 , G02B6/0001 , G02B6/0043 , G02B6/0068 , G02B6/4298 , G02F1/133615 , G09F9/35
摘要： A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.
摘要翻译： 光源元件采用液晶显示器的背光，并且包括倾斜放置的光出射面和/或光入射面。 在其表面处，光波导被反射器包围，其中可能形成适当的孔径区域。 提供了多个光源和/或更直观的视图，并因此提供亮度结果的相应增加。 还提供了一种用于制造具有集成反射器的光源元件的方法。
-
公开(公告)号：US07510888B2
公开(公告)日：2009-03-31
申请号：US11686525
申请日：2007-03-15
IPC分类号： H01L21/00
CPC分类号： H01L33/56 , H01L25/0753 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.
摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。
-
10.发明授权Optoelectronic device with patterned-metallized package body, method for producing such a device and method for the patterned metallization of a plastic-containing body 有权具有图案化金属化封装体的光电器件，用于制造这种器件的方法和用于含塑料体的图案化金属化的方法公开(公告)号：US07247940B2
公开(公告)日：2007-07-24
申请号：US10792538
申请日：2004-03-01
申请人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
发明人： Thomas Höfer , Herbert Brunner , Frank Möllmer , Günter Waitl , Rainer Sewald , Markus Zeiler
IPC分类号： H01L23/03
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01079 , H01L2924/12041 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.
摘要翻译： 一种光电子器件，包括封装主体（57）和布置在封装主体（57）上的至少一个半导体芯片（50）。 封装主体（57）的表面具有金属化子区域（15）和非金属化子区域（20）。 包装体（57）包括至少两种不同的塑料（53,54），塑料中的一种是不可金属化的（54），该塑料确定非金属化子区域（20）。 还提供了用于制造这种组分的方法和用于含塑料体的图案化金属化的方法。
-
-
-
-
-
-
-
-
-
搜索结果
125 条记录 (耗时 0.021 秒)
