公开(公告)号：US20060255355A1

公开(公告)日：2006-11-16

申请号：US11487742

申请日：2006-07-17

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

IPC分类号： H01L33/00 ,  H01L23/29 ,  H01L29/22

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： A radiation-emitting semiconductor component, comprising a semiconductor body which emits a primary light, a luminescent conversion element which emits fluorescent light, in which the luminescent conversion element comprises a suspension of a luminous substance in a matrix material, wherein the luminescent conversion element is in direct contact with a part of the surface of said semiconductor body, and wherein the fluorescent light emitted from said luminescent conversion element is approximately half the total emission of the light of the radiation-emitting semiconductor component.

摘要翻译： 一种辐射发射半导体部件，包括发射一次光的半导体本体，发射荧光的发光转换元件，其中发光转换元件包括基质材料中的发光物质的悬浮液，其中发光转换元件为 与所述半导体本体的表面的一部分直接接触，并且其中从所述发光转换元件发射的荧光大约是辐射发射半导体部件的光的总发射的一半。

公开(公告)号：US20050014302A1

公开(公告)日：2005-01-20

申请号：US10918100

申请日：2004-08-13

申请人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

发明人： Herbert Brunner ,  Alexandra Debray ,  Harald Jager ,  Gunther Waitl

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L21/00

CPC分类号： H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2224/4554

摘要： The invention describes a radiation-emitting semiconductor component with a luminescent conversion element, at which the semiconductor body is placed in a recess of the base body. A cup-like area is molded inside of the recess around the semiconductor body, which contains the luminescent conversion element and coats the semiconductor body. The cup-like portion is formed as indentation inside of the recess or as annular border on the base of the recess.

摘要翻译： 本发明描述了具有发光转换元件的辐射发射半导体部件，半导体本体被放置在基体的凹部中。 在包含发光转换元件并涂覆半导体主体的半导体主体周围的凹部内部模制杯状区域。 杯状部分形成为凹陷内部的凹陷或凹陷的基部上的环形边界。

公开(公告)号：US20090011527A1

公开(公告)日：2009-01-08

申请号：US12211256

申请日：2008-09-16

申请人： Herbert Brunner ,  Klaus Hohn ,  Harald Jager ,  Josef Schmid

发明人： Herbert Brunner ,  Klaus Hohn ,  Harald Jager ,  Josef Schmid

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4848 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A radiation-emitting surface-mountable component has a light-emitting diode chip mounted on a leadframe. A molding material encapsulates the leadframe and the light emitting diode chip.

摘要翻译： 辐射发射表面可安装部件具有安装在引线框架上的发光二极管芯片。 成型材料封装引线框和发光二极管芯片。

公开(公告)号：US20080197376A1

公开(公告)日：2008-08-21

申请号：US11885374

申请日：2006-02-28

申请人： Braune Bert ,  Herbert Brunner ,  Harald Jager ,  Jorg Sorg

发明人： Braune Bert ,  Herbert Brunner ,  Harald Jager ,  Jorg Sorg

IPC分类号： H01L33/00 ,  H01L27/15

CPC分类号： C08G59/4215 ,  B29C45/0001 ,  B29C45/02 ,  B29K2083/00 ,  B29K2105/0005 ,  B29L2011/00 ,  C08G59/3245 ,  C08G77/06 ,  C08G77/42 ,  C08G77/455 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/12044 ,  C08L2666/14 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention related to a method for producing an optical and a radiation-emitting component by a molding process, and to an optical and a radiation-emitting component having well-defined viscosity.

摘要翻译： 本发明涉及通过模塑方法制造光学和辐射发射部件的方法以及具有明确界定的粘度的光学和发射辐射的部件。

公开(公告)号：US20070131957A1

公开(公告)日：2007-06-14

申请号：US10578854

申请日：2004-12-14

申请人： Herbert Brunner ,  Harald Jager ,  Jorg Sorg

发明人： Herbert Brunner ,  Harald Jager ,  Jorg Sorg

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/56 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/501 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00014

摘要： A radiation-emitting and/or radiation-receiving semiconductor component comprising a radiation-emitting and/or radiation-receiving semiconductor chip, a molded plastic part which is transparent to an electromagnetic radiation to be emitted and/or received by the semiconductor component and by which the semiconductor chip is at least partially overmolded, and external electrical leads that are electrically connected to electrical contact areas of the semiconductor chip. The molded plastic part is made of a reaction-curing silicone molding compound. A method of making such a semiconductor component is also specified.

摘要翻译： 包含辐射发射和/或辐射接收半导体芯片的辐射发射和/或辐射接收半导体部件，对半导体部件要发射和/或接收的电磁辐射透明的模制塑料部件 半导体芯片至少部分地包覆成型，以及电连接到半导体芯片的电接触区域的外部电引线。 模制塑料部件由反应固化硅树脂模塑料制成。 还规定了制造这种半导体部件的方法。

公开(公告)号：US07109590B2

公开(公告)日：2006-09-19

申请号：US10296405

申请日：2001-05-10

申请人： Herbert Brunner ,  Thomas Hofer ,  Harald Jager

发明人： Herbert Brunner ,  Thomas Hofer ,  Harald Jager

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49805 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2224/854 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/181 ,  H05K1/0271 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： The invention relates to a semiconductor component comprising surface metallization and having at least one semiconductor body (3) and a package base body (2) on whose surface conductor path structures (7) are formed by means of surface metallization. A subregion of the conductor path structure (7) constitutes the solder connections of the semiconductor component. The solder connections (1) are combined to form rows, the individual rows of solder connections being arranged at a very small, predetermined spacing from one another.

摘要翻译： 本发明涉及包括表面金属化并且具有至少一个半导体本体（3）和封装基体（2）的半导体部件，其表面上通过表面金属化形成导体路径结构（7）。 导体路径结构（7）的一个子区域构成半导体元件的焊料连接。 焊接连接（1）被组合以形成行，各行焊接连接以彼此非常小的预定间隔布置。

公开(公告)号：US20050196886A1

公开(公告)日：2005-09-08

申请号：US10735507

申请日：2003-12-11

申请人： Harald Jager ,  Herbert Brunner

发明人： Harald Jager ,  Herbert Brunner

IPC分类号： B29C45/14 ,  H01L33/52 ,  H01L21/00

CPC分类号： B29C45/14639 ,  B29L2011/00 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A plurality of light-emitting diode light sources of the same kind are produced simultaneously. Each light source includes a light-emitting diode chip and a luminescence conversion element, which converts the wavelength of at least part of an electromagnetic radiation emitted by the light-emitting diode chip. In a first process, a layer composite with a light-emitting diode layer sequence applied to a carrier substrate is provided. The wafer is provided with trenches and then inserted into a cavity of a mold. A molding compound, which contains a luminescence conversion material, is driven in, so that the trenches are at least partly filled with the molding compound. The mold is then removed and the light-emitting diode light sources are separated from the layer composite. In a second process, instead of the layer composite, a plurality of light-emitting diode chips which are applied to a common carrier in a regular arrangement are provided.

摘要翻译： 同时产生同一种类的多个发光二极管光源。 每个光源包括发光二极管芯片和发光转换元件，其转换由发光二极管芯片发射的电磁辐射的至少一部分的波长。 在第一种方法中，提供了一种施加到载体衬底的发光二极管层序列的层复合物。 晶片设置有沟槽，然后插入模具的空腔中。 包含发光转换材料的模塑料被驱入，使得沟槽至少部分地被模塑料填充。 然后去除模具，并且发光二极管光源与层复合物分离。 在第二过程中，提供以规则排列施加到公共载体的多个发光二极管芯片代替层复合物。

公开(公告)号：US20080203410A1

公开(公告)日：2008-08-28

申请号：US11576057

申请日：2005-08-04

申请人： Herbert Brunner ,  Dieter Eissler ,  Berthold Hahn ,  Volker Harle ,  Harald Jager ,  Gertrud Krauter ,  Gunter Waitl

发明人： Herbert Brunner ,  Dieter Eissler ,  Berthold Hahn ,  Volker Harle ,  Harald Jager ,  Gertrud Krauter ,  Gunter Waitl

IPC分类号： H01L33/00

CPC分类号： H01L33/508 ,  H01L2933/0041

摘要： The invention relates to a method of making LED chips provided with a luminescence conversion material containing at least one phosphor. In the method, a layer composite is prepared that includes an LED layer sequence for a multiplicity of LED chips and comprises on a main surface at least one electrical contact surface for each LED chip, for electrically connecting said chip. A layer of adhesion promoter is applied to the main surface and selectively removed from at least portions of the contact surfaces. At least one phosphor is then applied to the main surface. Alternatively, a luminescence conversion material is applied to the main surface and selectively removed from at least portions of the contact surfaces. The invention also relates to an LED chip provided with a luminescence conversion material.

摘要翻译： 本发明涉及制造具有含有至少一种荧光体的发光转换材料的LED芯片的方法。 在该方法中，制备层复合物，其包括用于多个LED芯片的LED层序列，并且在主表面上包括用于每个LED芯片的至少一个电接触表面，用于电连接所述芯片。 将一层粘合促进剂施加到主表面并且从至少部分接触表面选择性地除去。 然后将至少一种荧光体施加到主表面。 或者，将发光转换材料施加到主表面并且从至少部分接触表面选择性地去除。 本发明还涉及具有发光转换材料的LED芯片。

公开(公告)号：US4941384A

公开(公告)日：1990-07-17

申请号：US320640

申请日：1989-03-08

申请人： Harald Jager

发明人： Harald Jager

IPC分类号： G10D3/04 ,  G10D3/12

CPC分类号： G10D3/12

摘要： The invention relates to a guitar comprising a releasable device for clamping the strings to the nut, the ball ends being secured to a base part movable around a knife edge and disposed in a recess in the body and comprising an adjustable prism and adjustable spring riders and tension springs engaging the base part. The clamping device comprises clamping jacks (2), an adjustable end pressure plate (3) with a set screw (7) and an eccentric pressure plate (4) movable by an eccentric lever (8) and between which the strings are clamped. Also, the base part (20) has string riders (23), spacer plates (26), through bores (31) for the strings and an adjustable spring-retaining block (21) at which tension springs (39) engage, the ball ends being disposed between the through bores and the spring-retaining block. Also, the other spring ends are secured to a spring-holding bracket (35) connected to a tightening nut (40) by a spring-adjusting screw (37) with interposition of a tension casing (34) (FIG. 9).

摘要翻译： 本发明涉及一种吉他，其包括用于将琴弦夹紧到螺母的可释放装置，该球头固定到可围绕刀刃移动的基座部分，并设置在主体的凹部中，并包括可调节棱镜和可调弹簧骑手， 拉伸弹簧接合基部。 夹紧装置包括夹紧千斤顶（2），具有固定螺钉（7）的可调节的端部压板（3）和可由偏心杆（8）移动的偏心压板（4），并在其间夹紧琴弦。 此外，基部（20）具有绳杆（23），间隔板（26），用于绳索的通孔（31）和拉伸弹簧（39）接合的可调节弹簧保持块（21），球 端部设置在通孔和弹簧保持块之间。 此外，其他弹簧端部通过插入张力壳体34（图9）的弹簧调节螺钉（37）固定到与紧固螺母（40）连接的弹簧保持支架（35）。

公开(公告)号：US20060244000A1

公开(公告)日：2006-11-02

申请号：US11456301

申请日：2006-07-10

申请人： Harald Jager ,  Klaus Hohn ,  Reinhold Brunner

发明人： Harald Jager ,  Klaus Hohn ,  Reinhold Brunner

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/501 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A surface-mountable light-emitting diode light source is described, in which the leadframe-bends toward the rear side of the package that are required for surface mounting lie within a transparent plastic molded body. Also described is a method of producing a mixed-light, preferably white-light source on the basis of a UV- or blue-emitting semiconductor LED. The LED is mounted on a leadframe, a transparent plastics molding composition is mixed with a conversion substance and possibly further fillers to form a molding composition. The leadframe is encapsulated, preferably by the injection-molding process, with the molding composition in such a way that the LED is surrounded on its light-exiting sides by the molding composition.

摘要翻译： 描述了一种可表面安装的发光二极管光源，其中引线框架朝向表面安装所需的封装的后侧弯曲在透明塑料模制体内。 还描述了基于UV或蓝色发光半导体LED来生产混合光，优选白光源的方法。 LED安装在引线框架上，透明塑料模塑组合物与转化物质和可能的其它填料混合以形成模塑组合物。 引线框架优选地通过注射成型工艺被封装成模制组合物，使得LED在其光出射侧被模制组合物包围。