中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

129 records (took 0.097 seconds)

    Thermoelectric-enhanced, inlet air-cooled thermal conductors
    84.
    发明授权
    Thermoelectric-enhanced, inlet air-cooled thermal conductors 有权
    热电增强型入口风冷导热体

    公开(公告)号：US09504189B1

    公开(公告)日：2016-11-22

    申请号：US14824401

    申请日：2015-08-12

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Milnes P. David ,  Dustin W. Demetriou ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  F25B21/02

    CPC classification number: H05K7/20754 ,  F25B21/02 ,  F25B2321/021 ,  H01L35/00 ,  H05K7/20127 ,  H05K7/20436 ,  H05K7/20545 ,  H05K7/20727

    Abstract: A cooling apparatus is provided, which includes: a thermal conductor to cool a heat-dissipating component(s) of an electronics enclosure, the enclosure including an air inlet side through which airflow ingresses. The thermal conductor includes a first conductor portion coupled to the heat-dissipating component(s), and a second conductor portion positioned along the enclosure's air inlet side. The apparatus further includes one or more air-cooled heat sinks coupled to the second conductor portion to facilitate transfer of heat from the second conductor portion to the airflow ingressing into the enclosure, and one or more thermoelectric devices coupled to at least one of the first or second conductor portions to selectively provide auxiliary cooling. A controller controls operation of the thermoelectric device(s) and selectively switches operation of the cooling apparatus between an active cooling mode, where the thermoelectric device(s) is active, and a passive cooling mode, where the thermoelectric device is inactive.

    Abstract translation: 提供了一种冷却装置，其包括：用于冷却电子设备外壳的散热部件的热导体，所述外壳包括气流入口的空气入口侧。 热导体包括耦合到散热部件的第一导体部分和沿壳体的空气入口侧定位的第二导体部分。 该装置还包括一个或多个空气冷却的散热器，其联接到第二导体部分，以便于将热量从第二导体部分传递到进入外壳的气流，以及耦合到第一导体部分 或第二导体部分以选择性地提供辅助冷却。 控制器控制热电装置的操作，并且在热电装置有效的主动冷却模式和热电装置不活动的被动冷却模式之间选择性地切换冷却装置的操作。

    Pump-enhanced, immersion-cooling of electronic component(s)
    85.
    发明授权
    Pump-enhanced, immersion-cooling of electronic component(s) 有权
    泵增强型，电子部件的浸入式冷却

    公开(公告)号：US09357675B2

    公开(公告)日：2016-05-31

    申请号：US14058530

    申请日：2013-10-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: H05K7/20 ,  B23P15/26

    CPC classification number: H05K7/20318 ,  B23P15/26 ,  B23P2700/10 ,  H05K7/203 ,  H05K7/20781 ,  H05K7/2079 ,  Y10T29/49361

    Abstract: Cooling apparatuses and methods of fabricating thereof are provided which facilitate pumped immersion-cooling of an electronic component(s). The cooling apparatus includes an enclosure having a compartment accommodating the electronic component(s), and dielectric fluid within the compartment at least partially immersing the electronic component(s). A liquid-cooled heat sink is associated with the enclosure to cool at least one cooling surface associated with the compartment, and facilitate heat transfer to the heat sink from the electronic component(s) via the dielectric fluid. A pump is disposed external to the compartment and in fluid communication therewith to facilitate pumped dielectric fluid flow through the compartment. The pumped dielectric fluid flow through the compartment enhances heat transfer from the electronic component(s) to the liquid-cooled heat sink via the cooling surface(s). In one implementation, the pumped dielectric fluid flow provides two-phase cooling to the electronic component(s) via flow boiling.

    Abstract translation: 提供冷却装置及其制造方法，其有助于电子部件的抽吸浸没冷却。 所述冷却装置包括具有容纳所述电子部件的隔室的外壳和所述隔室内的介电流体，至少部分地浸没所述电子部件。 液体冷却散热器与外壳相关联，以冷却与隔室相关联的至少一个冷却表面，并且便于通过介电流体从电子部件传递到散热器。 泵设置在隔室的外部并与其流体连通以便于泵送的介电流体流过隔间。 泵送的电介质流体流过隔室增强了通过冷却表面从电子部件到液体冷却的散热器的热传递。 在一个实施方案中，泵送介质流体流通过沸腾流向电子部件提供两相冷却。

    Controlled cooling of an electronic system based on projected conditions
    86.
    发明授权
    Controlled cooling of an electronic system based on projected conditions 有权

    公开(公告)号：US09342079B2

    公开(公告)日：2016-05-17

    申请号：US13775545

    申请日：2013-02-25

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Milnes P. David ,  Madhusudan K. Iyengar ,  Roger R. Schmidt

    IPC: G05D23/00 ,  G05D23/19 ,  H05K7/20

    CPC classification number: G05D23/00 ,  G05D23/1919 ,  H05K7/20836

    Abstract: Energy efficient control of a cooling system cooling an electronic system is provided based, in part, on projected conditions. The control includes automatically determining an adjusted control setting(s) for an adjustable cooling component(s) of the cooling system. The automatically determining is based, at least in part, on projected power consumed by the electronic system at a future time and projected temperature at the future time of a heat sink to which heat extracted is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on an experimentally obtained model(s) relating the targeted temperature and power consumption of the adjustable cooling component(s) of the cooling system.

    Thermostat-controlled coolant flow within a heat sink
    87.
    发明授权
    Thermostat-controlled coolant flow within a heat sink 有权
    散热片内的恒温控制冷却液流

    公开(公告)号：US09285050B2

    公开(公告)日：2016-03-15

    申请号：US13783628

    申请日：2013-03-04

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: F16K31/70 ,  F16K31/00 ,  F28F27/02 ,  F28F27/00 ,  F28F3/12 ,  H05K7/20

    CPC classification number: F16K31/002 ,  F28F3/12 ,  F28F27/00 ,  F28F27/02 ,  H05K7/20781 ,  H05K7/20836

    Abstract: Methods are presented for facilitating dissipation of heat generated by one or more electronic components. The methods include providing a coolant-cooled heat sink and a thermostat-controlled valve. The heat sink includes one or more coolant-carrying channels and one or more valve wells intersecting the channels. The thermostat-controlled valve is disposed, at least partially, within a respective valve well so as to intersect a respective coolant-carrying channel, and includes a valve disk and a thermal-sensitive actuator mechanically coupled to rotate the valve disk. The valve disk is rotatable between an open position where coolant is allowed to flow through the respective coolant-carrying channel, and a closed position where coolant is blocked from flowing through the respective channel. The actuator rotates the valve disk between the open position and the closed position, dependent on heating of the thermal-sensitive actuator by the electronic component(s).

    Abstract translation: 提出了用于促进由一个或多个电子部件产生的热量消散的方法。 这些方法包括提供冷却剂冷却的散热器和恒温控制阀。 散热器包括一个或多个冷却剂承载通道和与通道相交的一个或多个阀井。 恒温控制阀至少部分地设置在相应的阀井内，以与相应的冷却剂承载通道相交，并且包括阀盘和机械耦合以旋转阀盘的热敏致动器。 阀盘可以在允许冷却剂流过相应的冷却剂输送通道的打开位置和阻止冷却剂流过相应通道的关闭位置之间旋转。 执行器根据电子部件对热敏致动器的加热，使阀盘在打开位置和关闭位置之间旋转。

    Pump-enhanced, sub-cooling of immersion-cooling fluid
    88.
    发明授权
    Pump-enhanced, sub-cooling of immersion-cooling fluid 有权
    泵增强，浸入冷却液的次冷却

    公开(公告)号：US09261308B2

    公开(公告)日：2016-02-16

    申请号：US13671857

    申请日：2012-11-08

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: F28D15/00 ,  H05K7/20 ,  F28D15/02 ,  F28F3/04 ,  F28F3/12

    CPC classification number: F28D15/02 ,  F28F3/048 ,  F28F3/12 ,  F28F2250/08 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49359

    Abstract: Cooling apparatuses and methods of fabrication thereof are provided to facilitate two-phase, immersion-cooling of one or more electronic components. The cooling apparatus includes a housing having a compartment within which dielectric fluid is disposed which facilitates immersion-cooling of the electronic component(s). A liquid-cooled heat sink is associated with the housing and cools a cooling surface exposed within the compartment. One or more pumps are disposed within the compartment and configured to pump dielectric fluid liquid within the compartment towards the cooling surface to facilitate cooling the liquid within the compartment below a saturation temperature of the dielectric fluid. The heat sink includes or is coupled to condensing and sub-cooling regions exposed within the compartment.

    Abstract translation: 提供冷却装置及其制造方法以便于一个或多个电子部件的两相浸没冷却。 冷却装置包括壳体，该壳体具有隔室，在该隔室中布置介质流体，其有利于电子部件的浸入冷却。 液体冷却散热器与壳体相关联并且冷却暴露在隔间内的冷却表面。 一个或多个泵设置在隔室内，并且构造成将腔室内的介质流体液体朝向冷却表面泵送，以便于冷却介质流体的饱和温度以下室内的液体。 散热器包括或耦合到暴露在隔室内的冷凝和次冷却区域。

    Effectiveness-weighted control of cooling system components
    89.
    发明授权
    Effectiveness-weighted control of cooling system components 有权
    冷却系统组件的有效加权控制

    公开(公告)号：US09218008B2

    公开(公告)日：2015-12-22

    申请号：US13706543

    申请日：2012-12-06

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

    IPC: G05D23/19 ,  H05K7/20

    CPC classification number: H05K7/20836 ,  G05B15/02 ,  G05D23/1932 ,  H05K7/2079

    Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

    Abstract translation: 部分地基于组件的加权冷却效率来提供电子系统的冷却系统冷却的能量效率控制。 该控制包括自动确定冷却系统的多个可调冷却部件的速度控制设置。 所述自动确定至少部分地基于所述冷却系统的组件的加权冷却效果，并且所述确定操作以限制至少所述冷却系统的功率消耗，同时确保与至少一个 冷却系统或电子系统在所需的范围内，通过基于加权的冷却效果，提供冷却系统的多个可调冷却部件之间的期望的目标温度变化。 供应包括至少部分地通过所确定的控制设置向多个可调冷却部件供应应用的功率。

    Valve controlled, node-level vapor condensation for two-phase heat sink(s)
    90.
    发明授权
    Valve controlled, node-level vapor condensation for two-phase heat sink(s) 有权
    气门控制，两相散热器的节点级蒸气冷凝

    公开(公告)号：US09201474B2

    公开(公告)日：2015-12-01

    申请号：US14519422

    申请日：2014-10-21

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

    IPC: H05K7/20 ,  G06F1/20

    CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

    Abstract: Methods of facilitating cooling an electronic system are provided, which include: providing a heat sink(s) configured to cool an electronic component(s), the heat sink(s) including a coolant-carrying channel for a first coolant, the first coolant providing two-phase cooling to the electronic component(s) and being discharged from the heat sink(s) as coolant exhaust with coolant vapor; providing a node-level condensation module coupled in fluid communication with the heat sink(s), the condensation module receiving first coolant exhaust from the heat sink(s) and being liquid-cooled via a second coolant to condense coolant vapor before return to a rack-level return manifold; automatically controlling at least one of liquid-cooling of the heat sink(s), or liquid-cooling of the condensation module(s); and providing a control valve for adjusting flow rate of the second coolant to the condensation module(s), the control valve being automatically controlled based on a characterization of the coolant vapor in the coolant exhaust.

    Abstract translation: 提供了方便冷却电子系统的方法，其包括：提供被配置为冷却电子部件的散热器，所述散热器包括用于第一冷却剂的冷却剂传送通道，所述第一冷却剂 向电子部件提供两相冷却，并以冷却剂蒸气作为冷却剂排出从散热器排出; 提供与所述散热器流体连通的节点级冷凝模块，所述冷凝模块从所述散热器接收第一冷却剂排出物，并经由第二冷却剂进行液冷，以冷却冷却剂蒸汽，然后返回到 机架式回流歧管; 自动控制散热器的液体冷却中的至少一个或冷凝模块的液体冷却; 并且提供用于调节第二冷却剂到冷凝模块的流量的控制阀，基于冷却剂排气中的冷却剂蒸汽的表征来自动控制控制阀。

Patent Agency Ranking