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91 条记录 (耗时 0.035 秒)

    IC socket, a test method using the same and an IC socket mounting mechanism
    85.
    发明授权
    IC socket, a test method using the same and an IC socket mounting mechanism 有权
    IC插座，使用其的测试方法和IC插座安装机构

    公开(公告)号：US06535002B2

    公开(公告)日：2003-03-18

    申请号：US09809204

    申请日：2001-03-16

    申请人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Masataka Mizukoshi ,  Futoshi Fukaya

    发明人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Masataka Mizukoshi ,  Futoshi Fukaya

    IPC分类号： G01R3102

    CPC分类号： G01R1/0466 ,  G01R1/0483 ,  G01R1/06738 ,  G01R31/2863 ,  G01R31/2886 ,  H01L2924/00013 ,  H01L2224/29099

    摘要： An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.

    摘要翻译： 将被测试的具有焊锡凸块的IC安装在安装在测试板上的IC插座上。 IC插座设置有接触单元，该接触单元包括多个直接接触针，每个具有连接到测试板的下端和连接到焊料凸块的上端，并且还包括用于支撑多个接触针的弹性构件。 多个接触针的直径被构造成足够小以使多个接触针刺穿相应的焊料凸块，使得通过多个焊料凸块中的每一个的上端穿过相关联的一个焊接凸块来建立电连接 焊锡凸块。

    Device testing contactor, method of producing the same, and device testing carrier
    86.
    发明授权
    Device testing contactor, method of producing the same, and device testing carrier 有权
    设备测试接触器，其制造方法和设备测试载体

    公开(公告)号：US06512386B2

    公开(公告)日：2003-01-28

    申请号：US09333984

    申请日：1999-06-16

    申请人： Makoto Haseyama ,  Shigeyuki Maruyama

    发明人： Makoto Haseyama ,  Shigeyuki Maruyama

    IPC分类号： G01R3102

    CPC分类号： G01R1/0433 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49208 ,  Y10T29/4922

    摘要： A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

    摘要翻译： 提供了用于测试半导体器件的接触器。 半导体器件测试接触器电连接到要测试的半导体器件的电极。 这种接触器包括布线板和用于加强布线板的第一加强件。 接触器具有柔性基膜和与半导体器件的电极电连接的器件连接焊盘。 第一加强构件设置在与布线板的半导体器件连接表面相对的表面上。 接线板和第一加强件共同接合。

    Integrated circuit testing device
    89.
    发明授权
    Integrated circuit testing device 有权
    集成电路测试装置

    公开(公告)号：US06191604B1

    公开(公告)日：2001-02-20

    申请号：US09238172

    申请日：1999-01-28

    申请人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

    发明人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

    IPC分类号： G01R3102

    CPC分类号： G01R31/2886 ,  G01R1/07357

    摘要： An integrated circuit testing device includes a flexible base of an insulating material, the base having a first surface and a second surface opposite to each other, an integrated circuit to be tested being bonded to the first surface. A conductive wiring layer is provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to. An elastic member is provided beneath the second surface of the base opposite to the first surface, the elastic member having a first level of hardness. A flexible film member is provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member.

    摘要翻译： 集成电路测试装置包括绝缘材料的柔性基座，该基座具有彼此相对的第一表面和第二表面，待测试的集成电路与第一表面接合。 在基座的第一或第二表面上设置有导电布线层，布线层包括在集成电路的电极连接的位置上的第一表面上的多个突出接点。 弹性构件设置在基座的与第一表面相对的第二表面下方，弹性构件具有第一水平的硬度。 柔性膜构件设置在基座的第二表面和弹性构件之间，膜构件具有比弹性构件的第一硬度高的第二硬度水平。

    Integrated circuit bare chip carrier
    90.
    发明授权
    Integrated circuit bare chip carrier 失效
    集成电路裸芯片载体

    公开(公告)号：US5534785A

    公开(公告)日：1996-07-09

    申请号：US495149

    申请日：1995-06-27

    申请人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

    发明人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

    IPC分类号： H01L21/66 ,  B65D85/30 ,  G01R1/04 ,  H01L23/12 ,  H01L23/32 ,  G01R1/073 ,  G01R31/02

    CPC分类号： G01R1/0483

    摘要： An IC bare chip carrier installs an IC bare chip for performing a burn-in test and a functional examination of the bare chip. The carrier consists of an installing unit for installing the bare chip and an interconnecting unit for electrically interconnecting chip electrodes of the bare chip with output electrodes of the interconnecting unit, to be connected to apparatus for the burn-in test and the functional examination. The installing unit is made of aluminium nitride having an expansion rate near of material, ceramic, of the IC bare chip, for making fabrication of installing surface of the IC bare chip easy. The interconnecting unit has an air exchange mechanism by which the IC bare chip can be laid in a space, made by combining the installing unit and the interconnecting unit, constantly filled with inert gas such as nitrogen. The IC bare chip is transported anytime and anywhere as installed in the carrier without being contaminated.

    摘要翻译： IC裸芯片载体安装用于进行裸芯片的老化测试和功能检查的IC裸芯片。 载体由用于安装裸芯片的安装单元和用于将裸芯片的芯片电极与互连单元的输出电极互连的互连单元连接到用于老化测试和功能检查的设备。 该安装单元由具有IC裸芯片材料（陶瓷）附近的膨胀率的氮化铝制成，用于制造IC裸芯片的安装表面。 互连单元具有空气交换机构，通过该空气交换机构，IC裸芯片可以放置在通过组合安装单元和互连单元而形成的空间中，该空间不断地填充有惰性气体例如氮气。 集成电路裸芯片随时随地运送到载体上，不受污染。