公开(公告)号：US06191604B1

公开(公告)日：2001-02-20

申请号：US09238172

申请日：1999-01-28

申请人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

发明人： Makoto Haseyama ,  Shigeyuki Maruyama ,  Naomi Miyaji ,  Susumu Moriya

IPC分类号： G01R3102

CPC分类号： G01R31/2886 ,  G01R1/07357

摘要： An integrated circuit testing device includes a flexible base of an insulating material, the base having a first surface and a second surface opposite to each other, an integrated circuit to be tested being bonded to the first surface. A conductive wiring layer is provided on the first or second surface of the base, the wiring layer including a plurality of projecting contacts over the first surface at positions which electrodes of the integrated circuit are connected to. An elastic member is provided beneath the second surface of the base opposite to the first surface, the elastic member having a first level of hardness. A flexible film member is provided between the second surface of the base and the elastic member, the film member having a second level of hardness higher than the first level of hardness of the elastic member.

摘要翻译： 集成电路测试装置包括绝缘材料的柔性基座，该基座具有彼此相对的第一表面和第二表面，待测试的集成电路与第一表面接合。 在基座的第一或第二表面上设置有导电布线层，布线层包括在集成电路的电极连接的位置上的第一表面上的多个突出接点。 弹性构件设置在基座的与第一表面相对的第二表面下方，弹性构件具有第一水平的硬度。 柔性膜构件设置在基座的第二表面和弹性构件之间，膜构件具有比弹性构件的第一硬度高的第二硬度水平。

公开(公告)号：US6046598A

公开(公告)日：2000-04-04

申请号：US852159

申请日：1997-05-06

申请人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Naomi Miyaji ,  Susumu Moriya ,  Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R1/04 ,  H05K3/32 ,  G01R1/06 ,  G01R31/26

CPC分类号： H05K3/326 ,  G01R1/0408

摘要： A test board includes an insulating part provided to face a semiconductor device when the semiconductor device is mounted on the test board, a sloped connection hole formed in the insulating part for accepting a projection electrode when the semiconductor device is mounted on the test board, and a conductive part formed in the insulating part so as to be in contact with and electrically connected to the projection electrode. When the semiconductor device is mounted on the test board, the semiconductor device or the projection electrode is supported by the insulating part.

摘要翻译： 测试板包括当半导体器件安装在测试板上时面向半导体器件的绝缘部分，当半导体器件安装在测试板上时用于接受投影电极的绝缘部分中形成的倾斜连接孔，以及 导电部分形成在绝缘部分中以与突起电极接触并电连接。 当半导体器件安装在测试板上时，半导体器件或突起电极由绝缘部分支撑。

公开(公告)号：US07174629B2

公开(公告)日：2007-02-13

申请号：US10369711

申请日：2003-02-21

申请人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

发明人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

IPC分类号： H01R9/00 ,  H05K3/00 ,  B23K31/00 ,  B23K31/02

CPC分类号： H01L24/11 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/749 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81345 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01R4/26 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49162 ,  H01L2224/48 ,  H01L2924/00

摘要： An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

摘要翻译： 集成电路接触器包括绝缘材料的基部，该基部可弹性变形。 第一导电材料的多个焊盘在与集成电路上的端子的位置对应的位置处接合到基座。 第二导电材料的多个触点分别结合到多个焊盘，只有当集成电路的端子对触点施加压力时，集成电路的端子才电连接到触点，每个触点 具有突出边缘，其具有通过在将导线接合到相应的焊盘之后将第二导电材料的导线与多个焊盘中的相应的一个焊盘相分离而产生的粗糙度。

公开(公告)号：US06555764B1

公开(公告)日：2003-04-29

申请号：US09267928

申请日：1999-03-10

申请人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

发明人： Shigeyuki Maruyama ,  Makoto Haseyama ,  Futoshi Fukaya ,  Susumu Moriya ,  Naomi Miyaji

IPC分类号： H01R1204

CPC分类号： H01L24/11 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06761 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/4853 ,  H01L24/13 ,  H01L24/45 ,  H01L24/78 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13173 ,  H01L2224/45144 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45173 ,  H01L2224/749 ,  H01L2224/78301 ,  H01L2224/78302 ,  H01L2224/81345 ,  H01L2224/85207 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15173 ,  H01R4/26 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49162 ,  H01L2224/48 ,  H01L2924/00

摘要： An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

摘要翻译： 集成电路接触器包括绝缘材料的基部，该基部可弹性变形。 第一导电材料的多个焊盘在与集成电路上的端子的位置对应的位置处接合到基座。 第二导电材料的多个触点分别结合到多个焊盘，只有当集成电路的端子对触点施加压力时，集成电路的端子才电连接到触点，每个触点 具有突出边缘，其具有通过在将导线接合到相应的焊盘之后将第二导电材料的导线与多个焊盘中的相应的一个焊盘相分离而产生的粗糙度。

公开(公告)号：US07028398B2

公开(公告)日：2006-04-18

申请号：US10629800

申请日：2003-07-30

申请人： Makoto Haseyama ,  Shigeyuki Maruyama

发明人： Makoto Haseyama ,  Shigeyuki Maruyama

IPC分类号： H01R9/00

CPC分类号： G01R1/06761 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  Y10T29/49147 ,  Y10T29/49151

摘要： A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.

公开(公告)号：US06882169B2

公开(公告)日：2005-04-19

申请号：US10685542

申请日：2003-10-16

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama

IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02 ,  H01R9/00

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed there in at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置相对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 至少所述连接部分可变形并延伸到所述开口中。

公开(公告)号：US06630839B1

公开(公告)日：2003-10-07

申请号：US09531686

申请日：2000-03-20

申请人： Makoto Haseyama ,  Shigeyuki Maruyama

发明人： Makoto Haseyama ,  Shigeyuki Maruyama

IPC分类号： G01R3126

CPC分类号： G01R1/06761 ,  G01R1/0735 ,  G01R3/00 ,  H05K3/244 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  Y10T29/49147 ,  Y10T29/49151

摘要： A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.

摘要翻译： 接触器用于测试设置有多个电极的集成电路电子部件。 接触器包括：绝缘基材，在与电极对应的位置形成有孔，第一导电层具有第一导电层的塑性变形部分的触点，以及设置在触点的第一表面上的触点上的加强部件。 触点的第一表面朝向孔。 触点设置在与电极对应的位置处，用于能够与电子部件电连接并从绝缘基材突出。

公开(公告)号：US07112889B1

公开(公告)日：2006-09-26

申请号：US09577932

申请日：2000-05-25

申请人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

发明人： Shigeyuki Maruyama ,  Yasuyuki Itoh ,  Tetsurou Honda ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Kenichi Nagashige ,  Yoshiyuki Yoneda ,  Hirohisa Matsuki

IPC分类号： H01L23/544

CPC分类号： H01L22/12 ,  G01R31/2891 ,  H01L21/67282 ,  H01L21/6838 ,  H01L22/32 ,  H01L23/544 ,  H01L24/97 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2223/5448 ,  H01L2223/54493 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  Y10T29/49998 ,  Y10T279/11 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.

公开(公告)号：US20050162180A1

公开(公告)日：2005-07-28

申请号：US11046883

申请日：2005-02-01

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R31/302 ,  G01R31/308 ,  H05K3/32 ,  G01R31/02

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。

公开(公告)号：US06661247B2

公开(公告)日：2003-12-09

申请号：US09828221

申请日：2001-04-09

申请人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

发明人： Shigeyuki Maruyama ,  Kazuhiro Tashiro ,  Makoto Haseyama ,  Futoshi Fukaya

IPC分类号： G01R3126

CPC分类号： G01R31/308 ,  G01R31/302 ,  H01L2924/0002 ,  H05K3/326 ,  H01L2924/00

摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.

摘要翻译： 半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。 该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部， 所述连接部分至少可变形并延伸到所述开口中。