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81.
公开(公告)号:US08185286B2
公开(公告)日:2012-05-22
申请号:US12162626
申请日:2006-02-08
申请人: Shunsaku Ono , Takahiro Ogawa , Helge Westerfeld , Manabu Kanno
发明人: Shunsaku Ono , Takahiro Ogawa , Helge Westerfeld , Manabu Kanno
IPC分类号: G06F7/70
CPC分类号: B60T8/3225 , B60T8/1706 , B60T8/1766 , B60T8/261 , B60T8/5006 , B60T2240/06
摘要: To reliably prevent re-lifting of a rear wheel immediately after landing of the rear wheel.When it is determined that output of a detection signal corresponding to detection of lifting of a rear wheel has ended (S102), brake pressure—and specifically a pressure increase gradient of a wheel cylinder pressure of a front wheel—is reduced, and the pressure increase gradient that has been reduced is maintained until it is determined that vehicle body deceleration has fallen below a predetermined value K1 (S108, S110), whereby re-lifting of the rear wheel caused by an increase in brake pressure at a high pressure increase gradient after landing of the rear wheel can be reliably prevented.
摘要翻译: 为了可靠地防止在后轮着陆后立即重新提升后轮。 当确定与后轮的提升检测相对应的检测信号的输出结束时(S102),制动压力(具体地说是前轮的轮缸压力的增压梯度)减小,并且压力 在确定车身减速度已经下降到预定值K1以下(S108,S110)之前,已经减小的增加梯度被维持,由此在高压增加梯度下由制动压力的增加引起的后轮的再提升 可以可靠地防止后轮落地。
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82.
公开(公告)号:US20110313536A1
公开(公告)日:2011-12-22
申请号:US13131013
申请日:2009-11-24
申请人: Takahiro Ogawa
发明人: Takahiro Ogawa
CPC分类号: A61F2/30767 , A61F2/3094 , A61F2002/0086 , A61F2002/30906 , A61F2002/30925 , A61F2002/3093 , A61F2310/00017 , A61F2310/00023 , A61F2310/00029 , A61F2310/00047 , A61F2310/00071 , A61F2310/00089 , A61F2310/00095 , A61F2310/00107 , A61F2310/00131 , A61F2310/00149 , A61F2310/00155 , A61F2310/00616 , A61F2310/00976 , A61L27/06 , A61L27/50 , A61L2400/18 , C23F1/26
摘要: It is provided a method for functionalizing an implant comprising treating the implant surface thereby causing the surface to be electro-positively charged. The implant has enhanced tissue-implant integration and/or bone-implant integration.
摘要翻译: 提供了一种用于使植入物官能化的方法,包括处理植入物表面,从而使表面被带电电荷。 植入物具有增强的组织植入物整合和/或骨 - 植入物整合。
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83.
公开(公告)号:US07938130B2
公开(公告)日:2011-05-10
申请号:US11730309
申请日:2007-03-30
申请人: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
发明人: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
IPC分类号: B08B3/02
CPC分类号: H01L21/68728 , B24B37/345 , B24B41/06 , H01L21/67219 , H01L21/68707 , Y10S134/902 , Y10T29/53091 , Y10T29/5313 , Y10T29/53174 , Y10T29/53196
摘要: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.
摘要翻译: 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴,分别安装在主轴上的用于保持基板周边的夹紧辊,用于使至少一个夹紧辊旋转的旋转装置,至少一个基座部件 所述主轴中的至少一个被安装,以及适于允许所述基座构件旋转的旋转机构。
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公开(公告)号:US20090324669A1
公开(公告)日:2009-12-31
申请号:US12374475
申请日:2007-07-25
申请人: Takahiro Ogawa , Anahid Jewett
发明人: Takahiro Ogawa , Anahid Jewett
CPC分类号: A61K31/197 , A61K31/573 , A61K35/32 , A61K38/00 , A61K45/06 , A61L24/0015 , A61L27/54 , A61L2300/112 , A61L2300/41 , A61L2300/414 , A61L2300/428 , A61L2300/43 , A61L2300/64 , A61L2430/02 , A61K2300/00
摘要: An osteogenic enhancer composition for bone and cartilage repair and methods of using the same are described.
摘要翻译: 描述了用于骨和软骨修复的成骨增强剂组合物及其使用方法。
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公开(公告)号:US20090283701A1
公开(公告)日:2009-11-19
申请号:US11885474
申请日:2006-03-03
申请人: Takahiro Ogawa
发明人: Takahiro Ogawa
IPC分类号: G21K5/00
CPC分类号: A61F2/30767 , A61B17/68 , A61B17/80 , A61B17/866 , A61C8/0006 , A61F2/0077 , A61F2/186 , A61F2/2803 , A61F2/3094 , A61F2/32 , A61F2/36 , A61F2/38 , A61F2/4261 , A61F2/44 , A61F2002/183 , A61F2002/30031 , A61F2002/30062 , A61F2002/3084 , A61F2002/30906 , A61F2002/30925 , A61F2002/3097 , A61F2002/3625 , A61F2210/0004 , A61F2250/0056 , A61F2310/00011 , A61F2310/00017 , A61F2310/00023 , A61F2310/00029 , A61F2310/00041 , A61F2310/00047 , A61F2310/00059 , A61F2310/00071 , A61F2310/00089 , A61F2310/00095 , A61F2310/00107 , A61F2310/00131 , A61F2310/00149 , A61F2310/00155 , A61F2310/00179 , A61F2310/00293 , A61F2310/00329 , A61F2310/00353 , A61L24/02 , A61L24/046 , A61L24/06 , A61L27/50 , A61L31/14 , A61L2400/12 , A61L2400/18 , B23K26/355 , B82Y40/00 , Y10S977/901 , Y10S977/904 , C08L67/04 , C08L33/12
摘要: Provided herein is methods of treating a medical implant and methods of using the same.
摘要翻译: 本文提供了治疗医疗植入物的方法及其使用方法。
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公开(公告)号:US07508067B2
公开(公告)日:2009-03-24
申请号:US11546976
申请日:2006-10-13
申请人: Hiroaki Arai , Takahiro Ogawa , Mitsuhara Inagaki
发明人: Hiroaki Arai , Takahiro Ogawa , Mitsuhara Inagaki
CPC分类号: H01L23/473 , H01L23/4334 , H01L24/48 , H01L24/72 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01082 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor insulation structure is disclosed for a semiconductor module, incorporating therein a semiconductor element, with which an electrically conductive structural body is held in pressured contact via an intervening insulation member. The semiconductor insulation structure includes a deformation preventing structure to avoid the insulation member from deforming when applied with load thereto. In one aspect, the deformation preventing structure includes a deformation resistant abutment surface, formed on the semiconductor module, and a readily deforming abutment surface formed on the electrically conductive structural body. In another aspect, the deformation preventing structure includes a reinforcement formed on a cooler and held in contact with the insulation member in an area placed in opposition to an outer circumferential periphery of the semiconductor module.
摘要翻译: 公开了一种用于半导体模块的半导体绝缘结构,其中结合有半导体元件,通过该半导体元件,导电结构体经由中间绝缘构件保持压力接触。 半导体绝缘结构包括防变形结构,以避免绝缘构件在施加负载时变形。 在一个方面,变形防止结构包括形成在半导体模块上的抗变形抵接表面和形成在导电结构体上的容易变形的邻接表面。 在另一方面,变形防止结构包括形成在冷却器上并在与半导体模块的外周边相对置的区域中与绝缘构件保持接触的加强件。
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公开(公告)号:US20080218978A1
公开(公告)日:2008-09-11
申请号:US12074158
申请日:2008-02-29
申请人: Takahiro Ogawa , Takahito Yamanaka
发明人: Takahiro Ogawa , Takahito Yamanaka
IPC分类号: H05K7/20
CPC分类号: H01L23/4006 , H01L2023/4031 , H01L2023/405 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要: The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate.
摘要翻译: IC固定部件包括容纳IC的锁定壳体,使得IC的与散热板的面对面接触的一侧与锁定壳体进行面对面接触, 以及插入到旋转限制孔中的通孔和旋转止动突起。 在IC被容纳在锁定壳体中之后,插入通孔的螺钉构件被拧入散热板的螺纹孔中,使得与锁定壳体面对面接触的IC侧是 由锁定壳体按压而与散热板进行面对面的接触。
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公开(公告)号:US20080068367A1
公开(公告)日:2008-03-20
申请号:US11901429
申请日:2007-09-17
申请人: Takahiro Ogawa
发明人: Takahiro Ogawa
IPC分类号: G09G5/00
CPC分类号: H02M3/33523 , G09G3/296 , G09G2330/026 , G09G2330/028
摘要: The present invention discloses a power supply circuit initiating an oscillation on a primary side of the power supply circuit upon receipt of a startup signal, comprising: a detecting module receiving an output voltage from the power supply circuit for detecting whether the output voltage is below a predetermined voltage; a power supply switching module turning OFF a main power supply of the power supply circuit when the detecting module determines the output voltage to be below the predetermined voltage; and a detection invalidating module invalidating the detecting of the detecting module from the receipt of the predetermined startup signal to the output voltage becomes above or equal the predetermined voltage.
摘要翻译: 本发明公开了一种在接收到启动信号时在电源电路的初级侧启动振荡的电源电路,包括:检测模块,接收来自电源电路的输出电压,用于检测输出电压是否低于 预定电压; 当检测模块确定输出电压低于预定电压时,电源切换模块关闭电源电路的主电源; 检测无效模块使检测模块从接收到预定的启动信号到输出电压的检测无效,变得高于或等于预定电压。
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89.
公开(公告)号:US20070226992A1
公开(公告)日:2007-10-04
申请号:US11730309
申请日:2007-03-30
申请人: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
发明人: Hiroyuki Kaneko , Takahiro Ogawa , Kenichi Sugita
CPC分类号: H01L21/68728 , B24B37/345 , B24B41/06 , H01L21/67219 , H01L21/68707 , Y10S134/902 , Y10T29/53091 , Y10T29/5313 , Y10T29/53174 , Y10T29/53196
摘要: A substrate holding rotating mechanism is used to hold and rotate a substrate to be processed. The substrate holding rotating mechanism according to the present invention includes at least three spindles, clamp rollers mounted respectively on the spindles for holding a periphery of a substrate, a rotating device for rotating at least one of the clamp rollers, at least one base member on which at least one of the spindles is installed, and a rotational mechanism adapted to allow the base member to be rotatable.
摘要翻译: 使用基板保持旋转机构来保持和旋转待处理的基板。 根据本发明的基板保持旋转机构包括至少三个主轴,分别安装在主轴上的用于保持基板周边的夹紧辊,用于使至少一个夹紧辊旋转的旋转装置,至少一个基座部件 所述主轴中的至少一个被安装,以及适于允许所述基座构件旋转的旋转机构。
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公开(公告)号:US20060214599A1
公开(公告)日:2006-09-28
申请号:US11442412
申请日:2006-05-25
申请人: Takahiro Ogawa
发明人: Takahiro Ogawa
CPC分类号: H02M1/32 , G09G2330/04 , H02M3/33507
摘要: At a primary power-supply board 40, a Vsus power supply and a Vadd power supply of prescribed voltages are derived and outputted to a plasma display panel 11. Secondary power supplies Vsub1, Vsub2, and Vsub3 are derived from prescribed voltage levels of a transformer 42 for deriving Vsus and Vadd power supplies at the primary power-supply board 40. The secondary power supplies Vsub1, Vsub2, and Vsub3 are outputted to a secondary power-supply board 20 which is a board different from the primary power-supply board 40. Vset, Ve, and Vscan power supplies which can be used by the plasma display panel 11 are derived by regulating the secondary power supplies Vsub1, Vsub2, and Vsub3. Thus, since the primary power-supply board 40 and the secondary power-supply board 20 are provided separately, the secondary power-supply board 20 alone can be replaced to cope with the changes of the plasma display panel 11.
摘要翻译: 在主电源板40处,导出规定电压的V SUB电源和V SUB电源,并将其输出到等离子体显示面板11.次级电源 从变压器42的规定的电压电平导出供给V Sub1,V Sub2,V Sub3,以及V Sub3 < SUB>和V SUB在主电源板40上添加 SUB>电源。次级电源V SUB1,V SUB22和V < SUB> sub3 SUB>被输出到与主电源板40不同的板的辅助电源板20上。V&lt;&lt;&lt; 和等离子体显示面板11可以使用的V SUB扫描电源是通过调节辅助电源V Sub1,V Sub2 SUB> ,和V sub 3 3。 因此,由于主电源板40和二次电源板20分开设置,所以可以更换二次电源板20以应对等离子体显示面板11的变化。
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