公开(公告)号：US20080144316A1

公开(公告)日：2008-06-19

申请号：US11967842

申请日：2007-12-31

Applicant: James Newton ,  Bijan Bayat

Inventor： James Newton ,  Bijan Bayat

IPC: F21V21/00

CPC classification number: H05K3/301 ,  F21K9/00 ,  F21L14/023 ,  F21V14/02 ,  F21Y2107/50 ,  F21Y2115/10 ,  H05K1/148 ,  H05K1/18 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2201/2027

Abstract: An LED lighting array is disclosed wherein a plurality of light emitting devices disposed in at least first and second columns are mounted on a planar mounting surface to form an emission plane. The emission axes of all the LEDs in a first column are parallel with each other and lie in a first plane. The emission axes of the LEDs in an adjacent, second column are also parallel, but a second plane containing the emission axes of the second column is disposed at a predetermined, non-zero angle with respect to the first plane. The non-zero angle is a function of the LED beam width and the distance to a lighting target. This configuration of the LEDs provides an optimum balance at a predetermined target distance between the size of the area illuminated and the brightness of the illumination of the target. In one aspect of the invention the LED lighting array includes at least first, second and third columns of LEDs. In another aspect of the invention an LED task light includes a transparent tube and an LED lighting array disposed within the tube. An electrical drive circuit associated with the mounting substrate within the tube provides pulsed direct current for driving the LED's.

Abstract translation: 公开了一种LED照明阵列，其中设置在至少第一和第二列中的多个发光器件安装在平面安装表面上以形成发射平面。 第一列中的所有LED的发射轴彼此平行并且位于第一平面中。 相邻的第二列中的LED的发射轴也是平行的，但是包含第二列的发射轴的第二平面相对于第一平面设置在预定的非零角度。 非零角度是LED光束宽度和到照明目标的距离的函数。 LED的这种配置在照明区域的尺寸和目标照明的亮度之间的预定目标距离处提供最佳平衡。 在本发明的一个方面，LED照明阵列至少包括第一，第二和第三列的LED。 在本发明的另一方面，LED任务灯包括透明管和设置在管内的LED照明阵列。 与管内的安装基板相关联的电驱动电路提供用于驱动LED的脉冲直流电。

公开(公告)号：US07355874B2

公开(公告)日：2008-04-08

申请号：US11461265

申请日：2006-07-31

Applicant: Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

Inventor： Robert F. Wallace ,  Robert D. Norman ,  Eliyahou Harari

IPC: G11C5/00 ,  G11C16/04 ,  H01L23/02

CPC classification number: G06F3/0601 ,  G06F13/385 ,  G06F2003/0694 ,  G06K7/0047 ,  G06K19/07732 ,  G06K19/07741 ,  G06K19/07743 ,  G11C5/04 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H05K1/141 ,  H05K3/3421 ,  H05K7/1431 ,  H05K2201/10159 ,  H05K2201/10462 ,  H05K2201/10484 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A very small computer memory card is densely packed with a large number of flash EEPROM integrated circuit chips. A computer memory system provides for the ability to removably connect one or more of such cards with a common controller circuit that interfaces between the memory cards and a standard computer system bus. Alternately, each card can be provided with the necessary controller circuitry and thus is connectable directly to the computer system bus. An electronic system is described for a memory system and its controller within a single memory card. In a preferred physical arrangement, the cards utilize a main circuit board with a plurality of sub-boards attached thereto on both sides, each sub-board carrying several integrated circuit chips.

Abstract translation: 一个非常小的电脑记忆卡密集地装有大量的闪存EEPROM集成电路芯片。 计算机存储器系统提供了将一个或多个这样的卡可拆卸地连接到存储卡与标准计算机系统总线之间接口的公共控制器电路的能力。 或者，每个卡可以提供必要的控制器电路，并且因此可以直接连接到计算机系统总线。 描述了一种用于存储系统及其控制器在单个存储卡内的电子系统。 在优选的物理布置中，卡片利用其两侧附着有多个子板的主电路板，每个子板承载多个集成电路芯片。

公开(公告)号：US20070284414A1

公开(公告)日：2007-12-13

申请号：US11748109

申请日：2007-05-14

Applicant: Christophe KOPP ,  Francois Baleras ,  Christophe Martinez

Inventor： Christophe KOPP ,  Francois Baleras ,  Christophe Martinez

IPC: A47J36/02

CPC classification number: G02B6/423 ,  B23K1/0016 ,  H01L23/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/06181 ,  H01L2224/16105 ,  H01L2224/1703 ,  H01L2224/81192 ,  H01L2224/81194 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15151 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/10454 ,  H05K2201/10484 ,  Y02P70/613 ,  H01L2924/00

Abstract: This assembly of an object and a support is achieved by using solder bumps. At least two wettability areas are made respectively on object and on support. Each solder bump ensures electrical contact and mechanical fixing firstly to one of the wettability areas of object and secondly to one of the wettability areas of support. The melting temperature of solder bumps is lower than the melting temperature of each of the wettability areas. Each wettability area of object forms an angle of 70° to 110° with respect to each wettability area of support. Object and support are mutually distant.

Abstract translation: 通过使用焊料凸块来实现对象和支撑件的这种组装。 分别在物体上和支撑物上至少形成两个润湿性区域。 每个焊料凸块确保电接触和机械固定首先到物体的润湿性区域之一，其次是支撑体的润湿性区域之一。 焊锡凸块的熔化温度低于每个润湿性区域的熔化温度。 物体的每个润湿性区域相对于载体的每个润湿性区域形成70°至110°的角度。 对象和支持是相互遥远的。

公开(公告)号：US20070228396A1

公开(公告)日：2007-10-04

申请号：US11727156

申请日：2007-03-23

Applicant: Naofumi Sumitani

Inventor： Naofumi Sumitani

IPC: H01L33/00 ,  H01L31/12 ,  H01L27/15 ,  H01L29/267

CPC classification number: H05K1/18 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H04N1/0083 ,  H04N1/02815 ,  H04N1/0282 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A light emitting unit, comprises: a light emitting element; a plurality of lead frames to which said light emitting element is electrically connected; and a package in which said lead frames are inserted so that at least one end thereof protrudes, and on which a light emitting window is arranged for luminous light from the light emitting element, wherein at least the distal ends at said one end of the lead frames are inclined with respect to the light emitting window.

Abstract translation: 发光单元，包括：发光元件; 所述发光元件电连接到的多个引线框架; 以及其中所述引线框架被插入以使其至少一个端部突出并且其上布置有用于来自所述发光元件的发光的发光窗口的封装，其中所述引线的所述一端处的至少远端 框架相对于发光窗口倾斜。

公开(公告)号：US07016802B2

公开(公告)日：2006-03-21

申请号：US10656431

申请日：2003-09-05

Applicant: Richard Charles Flaherty

Inventor： Richard Charles Flaherty

IPC: G01R31/00 ,  G01R31/14

CPC classification number: H05B37/0218 ,  G01J1/02 ,  G01J1/0242 ,  H05K1/18 ,  H05K2201/10121 ,  H05K2201/10484 ,  H05K2203/171 ,  Y02B20/46

Abstract: Methods for calibrating a photocontrol device having at least one flexible mounting leg mounting the photosensor to a circuit board and being electrically coupled to activate a switching device and calibrated photocontrol devices are provided. A photocontrol device is positioned proximate a light source. An aperture is positioned between the photosensor and the light source and an angle between the at least one flexible mounting leg and the circuit board is adjusted to calibrate a sensitivity of the photocontrol device to light from the light source passing through the aperture.

Abstract translation: 提供了一种用于校准具有至少一个柔性安装腿的光控制装置的方法，所述至少一个柔性安装腿将光电传感器安装到电路板上并被电耦合以激活开关装置和校准的光控制装置。 光控制装置位于光源附近。 孔被定位在光传感器和光源之间，并且调整至少一个柔性安装腿和电路板之间的角度，以校准光控制装置对来自穿过孔的光源的光的灵敏度。

公开(公告)号：US20050255786A1

公开(公告)日：2005-11-17

申请号：US11186042

申请日：2005-07-21

Applicant: Peter Lun

Inventor： Peter Lun

IPC: A63H30/00 ,  H01H35/02 ,  H05K1/18

CPC classification number: H01H35/025 ,  H05K1/18 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10484 ,  H05K2201/10522

Abstract: A sensor for use in an interactive electronic device. The sensor is operative to generate a plurality of different output signals corresponding to respective positions of the sensor relative to a reference plane. The movement of the sensor relative to the reference plane facilitates the movement of one or more actuation balls of respective switches of the sensor, which in turn results in the generation of differing conditions or output signals corresponding to closed or open circuit conditions selectively created by the switches.

Abstract translation: 用于交互式电子设备的传感器。 传感器可操作以产生对应于传感器相对于参考平面的相应位置的多个不同的输出信号。 传感器相对于参考平面的移动便于传感器各个开关的一个或多个致动球的移动，这进而导致产生对应于由所述传感器选择性地创建的闭合或开路状态的不同条件或输出信号 开关。

公开(公告)号：US20040182913A1

公开(公告)日：2004-09-23

申请号：US10775395

申请日：2004-02-10

Applicant: JDS Uniphase Corporation ,  JDS Uniphase Inc.

Inventor： Philip Deane ,  Neil Teitelbaum

IPC: B23K031/00

CPC classification number: H05K3/3436 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H05K3/3494 ,  H05K2201/10484 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method for solder bonding a photodiode or an array of photodiodes to a substrate, the photodiode(s) tilted at a predetermined angle, uses a pair solder bumps placed on a photodiode chip opposite a corresponding pair of solder pads placed on the substrate. When the photodiode chip is placed on the substrate, with the solder bumps therebetween, the solder is melted and undergoes a reflow over the surface of the pads. The shape of the pads and the location of the solder bumps on the pads causes the surface tension of the solder to tilt the chip by pulling it to one side.

Abstract translation: 将光电二极管或阵列的光电二极管焊接到基板上的方法，即以预定角度倾斜的光电二极管，使用放置在与放置在基板上的对应的一对焊盘相对的光电二极管芯片上的一对焊料凸块。 当光电二极管芯片放置在基板上时，焊料凸起之间，焊料熔化并在焊盘的表面上经过回流焊。 焊盘的形状和焊盘上的焊料凸点的位置使得焊料的表面张力通过将芯片拉到一侧来使芯片倾斜。

公开(公告)号：US20040076424A1

公开(公告)日：2004-04-22

申请号：US10448335

申请日：2003-05-29

Inventor： Hiroshi Terada ,  Naohiro Tsuchida ,  Yutaka Maeda ,  Kazuyuki Iwasa ,  Tatsuo Takanashi

IPC: G03B017/00

CPC classification number: G03B17/00 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/10484 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: In a camera according to the present invention, an edge portion of a lens barrel unit is projected and arranged from a front cover. The lens barrel unit is covered with a front cover cylindrical member connected to the front cover, and a front exposed portion of the front cover cylindrical member is covered with an exterior cylindrical member as a detachable (before-attaching) metal cylindrical member. The exterior cylindrical member is positioned and is fixed by an stop claw on the front-cover side. A C-shaped stop portion cover having flexibility is made flexible and is attached around the stop claw portion, and is fixed by a screw. The restriction on design is reduced on the appearance for covering the lens barrel unit of the camera, and a camera exterior portion can be made of metal.

Abstract translation: 在根据本发明的照相机中，透镜筒单元的边缘部分从前盖突出并布置。 透镜筒单元被连接到前盖的前盖圆柱形构件覆盖，并且前盖圆柱形构件的前部暴露部分被外部圆柱形构件覆盖为可拆卸（安装前）金属圆柱形构件。 外圆柱形部件通过前盖侧的止动爪定位并固定。 具有柔性的C形止挡部分盖被制成柔性并且被安装在止动爪部分周围，并由螺钉固定。 相机的镜筒单元的外观上的设计限制减少，摄像机外部部分可以由金属制成。

公开(公告)号：US20040070990A1

公开(公告)日：2004-04-15

申请号：US10262037

申请日：2002-10-01

Inventor： Witold Szypszak

IPC: F21V007/04

CPC classification number: G02B25/02 ,  F21Y2115/10 ,  G01N21/8806 ,  G02B21/06 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10484 ,  H05K2203/1446 ,  H01L2924/00

Abstract: An self-contained illuminator capable of being manufactured in a plurality of shapes is built around a circuit board. The circuit board enables attuning the position of the light emitting diode assemblies to maximize light output and also provides for mounting the electrical componentry needed to control and supply the required amount of electrical energy to the LED assemblies. The circuit board also provides a substrate for a layer of the self-hardening flowable medium used to hold the light emitting diodes in their attuned position.

Abstract translation: 围绕电路板构建能够制造成多个形状的独立照明器。 电路板使得能够调节发光二极管组件的位置以使光输出最大化，并且还提供了将所需量的电能控制和提供给LED组件所需的电气组件的安装。 电路板还提供了用于将发光二极管保持在其调节位置的自硬化可流动介质的层的衬底。

公开(公告)号：US20040070857A1

公开(公告)日：2004-04-15

申请号：US10702281

申请日：2003-11-06

Inventor： Timothy A. Bonardi ,  Frederick T. Bauer

IPC: G02B007/182

CPC classification number: H05K1/189 ,  B60Q1/2665 ,  B60R1/07 ,  B60R1/088 ,  B60R1/1207 ,  H05K1/02 ,  H05K1/18 ,  H05K3/0058 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10106 ,  H05K2201/10484

Abstract: A rearview mirror assembly of the present invention includes a circuit board disposed behind the mirror. The circuit board may be a flexible circuit board and may include an LED mounted to project light through a transparent window in the flexible circuit board and through the mirror. The flexible circuit board may function as a mirror heater and may include conductive paths for connection to the LED and/or electrodes of an electrochromic mirror. The LED may include an LED chip mounted directly on the circuit board and encapsulated thereon by an encapsulant.

Abstract translation: 本发明的后视镜组件包括设置在反射镜后面的电路板。 电路板可以是柔性电路板，并且可以包括安装成将光投射穿过柔性电路板中的透明窗口并通过反射镜的LED​​。 柔性电路板可以用作镜面加热器，并且可以包括用于连接到电致变色镜的LED​​和/或电极的导电路径。 LED可以包括直接安装在电路板上并通过密封剂封装在其上的LED芯片。