公开(公告)号：US20180343741A1

公开(公告)日：2018-11-29

申请号：US16055117

申请日：2018-08-05

Applicant: Applied BioPhotonics, Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/18 ,  H05K3/32 ,  H05K3/46 ,  H05K3/40 ,  H05K3/24

Abstract: A rigid-flex PCB includes an array of rigid PCB “islands” interconnected by a flexible PCB formed into flexible connectors. The conductive and insulating layers of the flexible PCB extend into the rigid PCBs, giving the electrical connections to the rigid PCBs added resistance to breakage as the rigid-flex PCB is repeatedly stressed by bending and twisting forces. In addition, the durability of the rigid-flex PCB is enhanced by making the power and signal lines driving the rigid PCBs redundant so that a breakage of a line will not necessarily affect the operation of the rigid PCB to which it is attached. The rigid-flex PCB is particularly applicable to light pads used in phototherapy, wherein LEDs mounted on the rigid-PCBs are powered and controlled through the redundant lines in the flexible PCB.

公开(公告)号：US10032744B2

公开(公告)日：2018-07-24

申请号：US15415108

申请日：2017-01-25

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng-Hung Lin

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78

Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

公开(公告)号：US09576932B2

公开(公告)日：2017-02-21

申请号：US14797056

申请日：2015-07-10

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/00 ,  H01L23/00 ,  H01L21/56 ,  H01L21/3105 ,  H01L21/268 ,  H01L21/78 ,  H01L23/31 ,  H01L23/495

CPC classification number: H01L24/96 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/05599

Abstract: In the fabrication of semiconductor packages, a leadframe is formed by masking and etching a metal sheet from both sides, and a plastic block is formed over a plurality of dice attached to die pads in the leadframe. A laser beam is used to form individual plastic capsules for each package, and a second laser beam is used to singulate the packages by severing the metal conductors, tie bars and rails between the packages. A wide variety of different types of packages, from gull-wing footed packages to leadless packages, with either exposed or isolated die pads, may be fabricated merely by varying the patterns of the openings in the mask layers and the width of the plastic trenches created by the first laser beam.

Abstract translation: 在半导体封装的制造中，通过从两侧掩蔽和蚀刻金属片而形成引线框，并且在引导框架中附着到焊盘的多个裸片上形成塑料块。 激光束用于为每个封装形成单独的塑料胶囊，并且第二激光束用于通过在包装之间切断金属导体，连接条和导轨来对包装进行分割。 可以仅通过改变掩模层中的开口的图案和创建的塑料沟槽的宽度来制造各种不同类型的包装，从鸥翼底脚包装到无引线封装，具有裸露或隔离的管芯焊盘 通过第一激光束。

公开(公告)号：US20180040545A1

公开(公告)日：2018-02-08

申请号：US15784706

申请日：2017-10-16

Applicant: Richard K. Williams

Inventor： Richard K. Williams

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49805 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05624 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed, in particular a method of fabricating a package including an exposed die pad.

公开(公告)号：US20150311144A1

公开(公告)日：2015-10-29

申请号：US14703359

申请日：2015-05-04

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H01L23/495 ,  H01L23/29 ,  H01L21/48 ,  H01L23/367

CPC classification number: H01L21/4882 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/29 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/367 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/29101 ,  H01L2224/2929 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2924/014

Abstract: A power package includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

Abstract translation: 功率封装包括从暴露在封装的下侧的裸片焊盘延伸的散热片，其有助于将热量从裸片移除到PCB或其上安装封装件的其它表面。 热片具有与芯片焊盘的平坦底表面和引线底表面共面的底表面。 引线包括水平脚部段，垂直柱状段和面向管芯焊盘的水平悬臂段。 热片也可以有一个脚。 包含功率器件的管芯安装在管芯焊盘的顶表面上，并且可以使用接合线或夹子电连接到引线。 管芯可以用导电材料安装在管芯焊盘上，并且封装还可以包括从管芯焊盘延伸的引线，并因此电连接到管芯的底部。 结果是具有最小占地面积的封装，适用于在相对低成本的印刷电路板组装工厂中使用的称为“波峰焊”的技术。 公开了制造封装的方法。

公开(公告)号：US20140257833A1

公开(公告)日：2014-09-11

申请号：US14183296

申请日：2014-02-18

Applicant: Richard K Williams

Inventor： Richard K Williams

IPC: G06F19/00

CPC classification number: G06F19/3418 ,  G16H40/40

Abstract: In a remote medical checkup system, a patient's symptoms are transmitted for review to a medical service provider, the medical service provider prescribes diagnostic tests using an identified biometric sensor, the tests are performed by the patient, and the results of the tests are transmitted back to the medical service provider, all using a cloud-based server or other storage device. With this system, the tests are performed and the results reported promptly, without the patient having to schedule a visit to the office of the medical service provider.

Abstract translation: 在远程医疗检查系统中，患者的症状被传送给医疗服务提供者审查，医疗服务提供者使用识别的生物特征传感器规定诊断测试，测试由患者执行，测试结果被传回 到医疗服务提供商，都使用基于云的服务器或其他存储设备。 使用该系统，进行测试并且立即报告结果，而不需要安排访问医疗服务提供者的办公室。

公开(公告)号：US10312111B2

公开(公告)日：2019-06-04

申请号：US16041275

申请日：2018-07-20

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng Hung Lin

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/495 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L23/367

Abstract: A method is disclosed of fabricating a power package which includes a heat tab extending from a die pad exposed on the underside of the package, which facilitates the removal of heat from the die to the PCB or other surface on which the package is mounted. The heat tab has a bottom surface coplanar with the flat bottom surface of the die pad and bottom surface of a lead. The lead includes a horizontal foot segment, a vertical columnar segment, and a horizontal cantilever segment facing the die pad. The heat tab may also have a foot. A die containing a power device is mounted on a top surface of the die pad and may be electrically connected to the lead using a bonding wire or clip. The die may be mounted on the die pad with an electrically conductive material, and the package may also include a lead that extends from the die pad and is thus electrically tied to the bottom of the die. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories.

公开(公告)号：US20170170144A1

公开(公告)日：2017-06-15

申请号：US15415108

申请日：2017-01-25

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng-Hung Lin

IPC: H01L23/00 ,  H01L21/78 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/96 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/05599

Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

公开(公告)号：US09576884B2

公开(公告)日：2017-02-21

申请号：US14056287

申请日：2013-10-17

Applicant: Richard K Williams

Inventor： Richard K Williams

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49805 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05624 ,  H01L2224/16245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the vertical side surface of the plastic body. The result is a package with a minimal footprint that is suitable for the technique known as “wave soldering” that is used in relatively low-cost printed circuit board assembly factories. Methods of fabricating the package are disclosed.

Abstract translation: 在半导体封装中，具有与塑料体的平坦底面共面的底面的引线在塑料体的垂直侧表面的底部向外延伸。 结果是具有最小占地面积的封装，适用于在相对低成本的印刷电路板组装工厂中使用的称为“波峰焊”的技术。 公开了制造封装的方法。

公开(公告)号：US20180331067A1

公开(公告)日：2018-11-15

申请号：US16041765

申请日：2018-07-21

Applicant: Adventive Technology Ltd.

Inventor： Richard K. Williams ,  Keng-Hung Lin

IPC: H01L23/00 ,  H01L21/3105 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/495 ,  H01L21/268

CPC classification number: H01L24/96 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/4111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.