摘要:
A room-temperature-curable silicone rubber composition comprising (A) 100 parts by weight of a polydiorganosiloxan mixture comprising: (A-1) 20 to 95 wt. % of a polydiorganosiloxane having both molecular terminals capped with dialkoxysilyl groups or trialkoxysilyl groups, (A-2) 5 to 80 wt. % of a polydiorganosiloxane having a molecular terminal capped with dialkoxysilyl group or trialkoxysilyl group and the other molecular terminal capped with monoalkoxysilyl group, hydrosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, and (A-3) 0 to 30 wt. % of a polydiorganosiloxane having both molecular terminals capped with monoalkoxysilyl group, hydlosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, (B) one or more alkoxysilanes of the formula R5bSi(OR6)4-b or partial hydrolysis and condensation products thereof, and (C) an organotitanium compound. The composition is used as a sealant.
摘要翻译:一种室温可固化的硅橡胶组合物,其包含(A)100重量份的聚二有机基硅氧烷混合物,其包含:(A-1)20至95重量% 具有两个分子末端被二烷氧基甲硅烷基或三烷氧基甲硅烷基封端的聚二有机硅氧烷的%,(A-2)5-80重量% %的分子末端用二烷氧基甲硅烷基或三烷氧基甲硅烷基封端的聚二有机硅氧烷,另一分子末端用单烷氧基甲硅烷基,氢化硅烷基,三烷基甲硅烷基或三烷氧基烷基甲硅烷基封端,和(A-3)0〜30wt。 (B)一种或多种式R 5 b Si(OR 6)4-b的烷氧基硅烷或其部分水解和缩合产物,和(C )有机钛化合物。 该组合物用作密封剂。
摘要:
A saccharide residue-functional organopolysiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolysiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom, and an organopolysiloxane containing groups having the formula —R2Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.
摘要:
Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier. Method for preparation of a suspension of cured silicone particles by allowing such emulsion to stand at room temperature, or heating the aforementioned emulsion.
摘要:
A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.
摘要:
The invention relates to a gas barrier composition as well as to composite structures having at least one surface of a molded resin coated with the composition, said composition comprising:(A) an alkoxysilyl functional polyamine compound, or a hydrolyzate thereof, said polyamine compound having three or more amine groups, at least one nitrogen atom of said amine groups being bonded to a hydrogen atom and at least one nitrogen of said amine groups being bonded to an alkoxysilyl group expressed by the formula--W--SiR.sup.2.sub.3-f (OR.sup.1).sub.f wherein R.sup.1 is an alkyl group having 1 to 6 carbon atoms, R.sup.2 is a monovalent hydrocarbon group having 1 to 10 carbon atoms, W is a divalent hydrocarbon group having 2 to 10 carbon atoms, and f is an integer having a value of 1 to 3; and(B) an organic compound which is free of acrylic groups, said organic compound having an aromatic ring or an alicyclic hydrocarbon group and having per molecule at least two functional groups that are reactive with the amine groups, the alkoxy groups, or both, of component A.
摘要:
To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0.degree. C. to 800.degree. C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
摘要:
A method for preparing organosilicon compounds comprises: 1) converting the Si-bonded alkoxy in an Si-bonded alkoxy-functional organosilicon compound to the diorganosilyl group by reacting the Si-bonded alkoxy-functional organosilicon compound with organodisiloxane with the general formula HR.sub.2 Si--O--SiR.sub.2 H, where R is a monovalent hydrocarbyl group of 1 to 10 carbon atoms, in alcohol-containing acidic aqueous solution; and subsequently 2) treating with a sulfonic acid catalyst and carboxylic acid. This method is able to convert all the alkoxy groups in the alkoxy-functional organosilicon compound to diorganosilyl. This method can be used to synthesize a high-purity carbosiloxane dendrimer having a narrow molecular weight distribution.
摘要:
Silicone rubber composition comprising an alkenyl-substituted diorganopolysiloxane, an inorganic filler, an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, in a quantity that affords a value from 0.4 to 10 for the molar ratio of silicon-bonded hydrogen in the organopolysiloxane to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, an organohydrogenpolysiloxane, in a quantity that affords a value from 0.01 to 0.5 for the molar ratio of silicon-bonded hydrogen in this component to alkenyl groups in the alkenyl-substituted diorganopolysiloxane, and a platinum catalyst. A fluororesin-covered fixing roll in which a fluororesin layer is placed over the circumference of a roll shaft with a silicone rubber layer interposed between the fluororesin layer and the roll shaft, wherein said silicone rubber composition is formed by curing the silicone rubber composition described above.
摘要:
To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.
摘要:
A 1-acyloxy-organotetrasiloxane represented by the general formula: ##STR1## wherein R.sup.1 is a monovalent organic group containing an acryloyloxy group or a monovalent organic group containing a methacryloyloxy group, and R.sup.2 is a monovalent hydrocarbon group, and a process for producing the above mentioned 1-acyloxy-organotetrasiloxane, which is characterized by subjecting hexamethylcyclotrisiloxane to a ring-opening reaction with an acyloxysilane represented by the general formula: ##STR2## wherein R.sup.1 is a monovalent organic group containing an acryloyloxy group or a monovalent organic group containing a methacryloyloxy group, and R.sup.2 is a monovalent hydrocarbon group, in the presence of an acidic catalyst.