公开(公告)号：US09620430B2

公开(公告)日：2017-04-11

申请号：US13356173

申请日：2012-01-23

Applicant: Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

Inventor： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

IPC: H01L21/78 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L27/06

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11464 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

公开(公告)号：US08828848B2

公开(公告)日：2014-09-09

申请号：US13328746

申请日：2011-12-16

Applicant: Jing-Cheng Lin ,  Ying-Da Wang ,  Li-Chung Kuo ,  Szu Wei Lu

Inventor： Jing-Cheng Lin ,  Ying-Da Wang ,  Li-Chung Kuo ,  Szu Wei Lu

IPC: H01L21/00

CPC classification number: H01L21/563 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/94 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A die having a ledge along a sidewall, and a method of forming the die, is provided. A method of packaging the die is also provided. A substrate, such as a processed wafer, is diced by forming a first notch having a first width, and then forming a second notch within the first notch such that the second notch has a second width less than the first width. The second notch extends through the substrate, thereby dicing the substrate. The difference in widths between the first width and the second width results in a ledge along the sidewalls of the dice. The dice may be placed on a substrate, e.g., an interposer, and underfill placed between the dice and the substrate. The ledge prevents or reduces the distance the underfill is drawn up between adjacent dice. A molding compound may be formed over the substrate.

Abstract translation: 提供具有沿侧壁的凸缘的模具和形成模具的方法。 还提供了一种包装模具的方法。 通过形成具有第一宽度的第一凹口，然后在第一凹口内形成第二凹槽，使得第二凹槽具有小于第一宽度的第二宽度，来切割诸如经处理晶片的基底。 第二凹口延伸穿过衬底，从而切割衬底。 第一宽度和第二宽度之间的宽度差导致沿着骰子的侧壁的凸缘。 骰子可以放置在基底上，例如插入物，以及放置在骰子和基底之间的底部填充物。 凸缘防止或减少底部填充物在相邻骰子之间的距离。 可以在基材上形成模塑料。

公开(公告)号：US20130187258A1

公开(公告)日：2013-07-25

申请号：US13356173

申请日：2012-01-23

Applicant: Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

Inventor： Szu Wei Lu ,  Ying-Da Wang ,  Li-Chung Kuo ,  Jing-Cheng Lin

IPC: H01L27/06 ,  H01L21/78

CPC classification number: H01L25/0655 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3135 ,  H01L23/3178 ,  H01L23/3185 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/11464 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92125 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/11 ,  H01L2924/00 ,  H01L2224/05552

Abstract: A method includes bonding a first and a second package component on a top surface of a third package component, and dispensing a polymer. The polymer includes a first portion in a space between the first and the third package components, a second portion in a space between the second and the third package components, and a third portion in a gap between the first and the second package components. A curing step is then performed on the polymer. After the curing step, the third portion of the polymer is sawed to form a trench between the first and the second package components.

Abstract translation: 一种方法包括将第一和第二包装部件接合在第三包装部件的顶表面上，并分配聚合物。 聚合物包括在第一和第三包装部件之间的空间中的第一部分，在第二和第三包装部件之间的空间中的第二部分和第一和第二包装部件之间的间隙中的第三部分。 然后在聚合物上进行固化步骤。 在固化步骤之后，将聚合物的第三部分锯切以在第一和第二包装部件之间形成沟槽。

公开(公告)号：US20080315412A1

公开(公告)日：2008-12-25

申请号：US11910885

申请日：2006-04-06

Applicant: Jerry Liang ,  Jieren Xie ,  Xinchao Wang ,  Xiekang Yu ,  Yujuan Tao ,  Rongfu Wen ,  Fushou Li ,  Zhengwei Zhou ,  Da Wang ,  Haibo Ge ,  Qiang Zheng ,  Zhen Gong ,  Weijun Yang

Inventor： Jerry Liang ,  Jieren Xie ,  Xinchao Wang ,  Xiekang Yu ,  Yujuan Tao ,  Rongfu Wen ,  Fushou Li ,  Zhengwei Zhou ,  Da Wang ,  Haibo Ge ,  Qiang Zheng ,  Zhen Gong ,  Weijun Yang

IPC: H01L23/52 ,  H01L21/00

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention discloses a novel package structure of integrate circuit or discrete device and packaging method, and includes the lead pins adjacent to the island; another metal layer formed at the bottom of the island; another metal layer formed at the bottom of lead pins; chip mounted on the island; wires bonded between the chip and the lead pins; the molded body encapsulating the top surface and side surface of the island and the lead pins, small protrusions of the island and the lead pins below the molded body; in the individual package, the number of the island can be one or more, lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island. The invention provides strong welding, good quality, low cost, smooth production, wide applicability, flexible arrangement of the chips.

Abstract translation: 本发明公开了一种集成电路或分立器件和封装方法的新型封装结构，其中包括与岛相邻的引脚; 在岛底形成另一金属层; 在引脚的底部形成另一金属层; 芯片安装在岛上; 引线接合在芯片和引脚之间; 封装岛状物的顶面和侧面以及引线销的成型体，岛状体的小突起和成形体下方的引线销; 在单个封装中，岛的数量可以是一个或多个，引脚可以排列在岛的一侧，也可以排列在岛的两侧或三侧，一行或两排引脚可以 位于岛周围。 本发明提供焊接牢固，质量好，成本低，生产流畅，适用范围广，芯片布置灵活。

公开(公告)号：US20080258273A1

公开(公告)日：2008-10-23

申请号：US11910878

申请日：2006-04-06

Applicant: Jerry Liang ,  Jieren Xie ,  Xinchao Wang ,  Xiekang Yu ,  Yujuan Tao ,  Rongfu Wen ,  Fushou Li ,  Zhengwei Zhou ,  Da Wang ,  Haibo Ge ,  Qiang Zheng ,  Zhen Gong ,  Weijun Yang

Inventor： Jerry Liang ,  Jieren Xie ,  Xinchao Wang ,  Xiekang Yu ,  Yujuan Tao ,  Rongfu Wen ,  Fushou Li ,  Zhengwei Zhou ,  Da Wang ,  Haibo Ge ,  Qiang Zheng ,  Zhen Gong ,  Weijun Yang

IPC: H01L23/495 ,  H01L21/56

CPC classification number: H01L23/3107 ,  H01L21/4832 ,  H01L21/561 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T29/49121 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: The invention discloses an ultra thin package structure of leadless electronic device and the packaging method, and includes lead support base adjacent to the chip support base; chip mounted on the chip support base; wires bonded between chip and lead support base; the molded body encapsulating the top surface and side surface of the chip support base, small protrusions of the chip support base and lead support base below the molded body; in the individual package, the number of the chip support base island can be one or more, the lead pins can be arrayed at one side of the island, also can be arrayed at two sides or three sides of the island, one or two rows of lead pins can be located around the island.

Abstract translation: 本发明公开了一种无铅电子器件的超薄封装结构及其封装方法，包括与芯片支撑基座相邻的引线支撑基座; 芯片安装在芯片支撑基座上; 芯片和引线支撑基座之间接合的导线; 包封芯片支撑基座的上表面和侧表面的成型体，芯片支撑基座的小突起和模制体下方的引线支撑基座; 在单个封装中，芯片支撑基岛的数量可以是一个或多个，引脚可以排列在岛的一侧，也可以排列在岛的两侧或三侧，一行或两行 的引脚可以位于岛周围。

公开(公告)号：US20070080075A1

公开(公告)日：2007-04-12

申请号：US11538252

申请日：2006-10-03

Applicant: Da Wang ,  Walter Symons ,  Robert Farhat ,  Sheng Yao ,  Joachim Kupe

Inventor： Da Wang ,  Walter Symons ,  Robert Farhat ,  Sheng Yao ,  Joachim Kupe

IPC: G01F1/64 ,  G01N27/26

CPC classification number: G01N33/0037 ,  G01N27/4074 ,  Y02A50/245

Abstract: Disclosed herein are NOx sensors and methods of using the same. In one embodiment, a method for sensing NOx comprises: contacting a first NOx electrode with the gas, contacting a second NOx electrode with the gas, determining a NO2 emf between the first NOX electrode and a first reference electrode, determining a NOx emf between the second NOx electrode and a second reference electrode, and determining a NO2 concentration and a NO concentration using the NO2 emf and the NOx emf. The first electrode can be at a first temperature of greater than or equal to about 700 ° C., and the second electrode can be at a second temperature of about 500 ° C. to about 650 ° C.

Abstract translation: 本文公开了NOx传感器及其使用方法。 在一个实施例中，用于感测NOx的方法包括：使第一NOx电极与气体接触，使第二NOx电极与气体接触，确定第一NO x电极和第一参考电极之间的NO 2 电极，确定第二NOx电极和第二参比电极之间的NOx电动势，以及使用NO 2 2 emf和NO x emf确定NO 2浓度和NO浓度 。 第一电极可以处于大于或等于约700℃的第一温度，并且第二电极可以处于约500℃至约650℃的第二温度。

公开(公告)号：US20060266659A1

公开(公告)日：2006-11-30

申请号：US11483448

申请日：2006-07-10

Applicant: Da Wang ,  Walter Symons ,  Robert Farhat ,  Carlos Valdes ,  Elizabeth Briggs ,  Kaius Polikarpus ,  Joachim Kupe

Inventor： Da Wang ,  Walter Symons ,  Robert Farhat ,  Carlos Valdes ,  Elizabeth Briggs ,  Kaius Polikarpus ,  Joachim Kupe

IPC: G01F1/64 ,  G01N27/26

CPC classification number: G01N33/0054 ,  G01N27/4074 ,  Y02A50/246

Abstract: One embodiment of an ammonia gas sensor includes: a reference electrode, an ammonia selective sensing electrode and an electrolyte disposed therebetween. The sensing electrode comprises the reaction product of a main material selected from the group consisting of vanadium, tungsten, molybdenum, vanadium oxides, tungsten oxides, molybdenum oxides, and combinations comprising at least one of the foregoing main materials, and an electrically conducting material selected from the group consisting of electrically conductive metals, electrically conductive metal oxides, and combinations comprising at least one of the foregoing.

Abstract translation: 氨气传感器的一个实施例包括：参比电极，氨选择性感测电极和设置在其间的电解质。 感测电极包括选自钒，钨，钼，氧化钒，氧化钨，氧化钼以及包含至少一种前述主要材料的组合的主要材料的反应产物和选择的导电材料 来自由导电金属，导电金属氧化物组成的组，以及包含前述的至少一种的组合。

公开(公告)号：US20060151338A1

公开(公告)日：2006-07-13

申请号：US11034125

申请日：2005-01-12

Applicant: Da Wang ,  Walter Symons ,  Robert Farhat ,  Joachim Kupe ,  David Ehle ,  Alfred Webster ,  Paul Kikuchi

Inventor： Da Wang ,  Walter Symons ,  Robert Farhat ,  Joachim Kupe ,  David Ehle ,  Alfred Webster ,  Paul Kikuchi

IPC: G01F1/64 ,  G01N27/26

CPC classification number: G01N27/4071 ,  G01N27/4075

Abstract: A gas sensor system includes an ammonia-sensing cell for generating a signal upon exposure to an unknown gas comprising ammonia, an A/F cell for generating a signal upon exposure to hydrocarbons in the gas, a heater in thermal communication with the cells and a housing in which the cells and the heater are mounted. The housing permits an unknown gas to flow therethrough for contact with the cells, and there is a sensor control circuit in communication with the cells. The sensor control circuit is configured to utilize the signals from the cells to generate an ammonia concentration signal indicating the concentration of ammonia in the unknown gas. Ammonia may be sensed in an unknown gas by heating such cells to selected working temperatures, exposing them to an unknown gas, obtaining signals from the cells, and using the cell signals to determine the ammonia content.

Abstract translation: 气体传感器系统包括用于在暴露于包含氨的未知气体时产生信号的氨感测单元，用于在暴露于气体中的烃时产生信号的A / F单元，与单元热连通的加热器 安装电池和加热器的外壳。 壳体允许未知气体流过其中以与电池接触，并且存在与电池连通的传感器控制电路。 传感器控制电路被配置为利用来自单元的信号产生指示未知气体中的氨浓度的氨浓度信号。 可以通过将这样的细胞加热至选定的工作温度，将其暴露于未知气体，从细胞获得信号，并使用细胞信号来确定氨含量，可以在未知气体中感测氨。

公开(公告)号：US06283821B1

公开(公告)日：2001-09-04

申请号：US09754271

申请日：2001-01-05

Applicant: Wen-Da Wang

Inventor： Wen-Da Wang

IPC: A41C300

CPC classification number: A41C3/0042 ,  A41F15/002

Abstract: A brassiere sash made of two overlapping pieces of transparent thermoplastic polyurethane. The circumferential edges of the overlapping pieces are joined with high frequency energy to form a central cavity between two overlapping pieces. The central cavity is filled with liquid, perfume and ornamental glittering articles. Each end of the brassiere sash is passed through a buckle ring and then attached to a predetermined position of the brassiere sash.

Abstract translation: 由两个重叠的透明热塑性聚氨酯制成的胸罩窗框。 重叠片的圆周边缘以高频能结合，形成两个重叠片之间的中心腔。 中心腔充满液体，香水和观赏性闪光物品。 胸罩窗帘的每一端都穿过一个带扣环，然后连接到胸罩窗的预定位置。

公开(公告)号：USD1073352S1

公开(公告)日：2025-05-06

申请号：US29984506

申请日：2025-01-14

Applicant: Da Wang

Designer： Da Wang