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公开(公告)号:US20220310870A1
公开(公告)日:2022-09-29
申请号:US17834242
申请日:2022-06-07
申请人: Vikram Dalal , David Keogh
发明人: Vikram Dalal , David Keogh
IPC分类号: H01L31/18 , H01L31/0232 , H01L31/0747 , H01L31/20
摘要: Disclosed are embodiments of a thin-film photovoltaic technology including a single-junction crystalline silicon solar cell with a photonic-plasmonic back-reflector structure for lightweight, flexible energy conversion applications. The back-reflector enables high absorption for long-wavelength and near-infrared photons via diffraction and light-concentration, implemented by periodic texturing of the bottom-contact layer by nanoimprint lithography. The thin-film crystalline silicon solar cell is implemented in a heterojunction design with amorphous silicon, where plasma enhanced chemical vapor deposition (PECVD) is used for all device layers, including a low-temperature crystalline silicon deposition step. Excimer laser crystallization is used to integrate crystalline and amorphous silicon within a monolithic process, where a thin layer of amorphous silicon is converted to a crystalline silicon seed layer prior to deposition of a crystalline silicon absorber layer via PECVD. The crystalline nature of the absorber layer and the back-reflector enable efficiencies higher than what is achievable in other thin-film silicon devices.
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公开(公告)号:US20180283621A1
公开(公告)日:2018-10-04
申请号:US15938336
申请日:2018-03-28
IPC分类号: F21K9/238 , H05B37/02 , F21V29/70 , H05B33/08 , H04N1/028 , F21V29/77 , F21K9/233 , F21K9/64 , F21K9/235 , F21K9/237 , F21V3/00 , F21V9/08 , F21V15/01 , F21V23/00 , F21V23/06 , H01L25/075 , H01L51/50 , H01L33/62 , H01L33/60 , H01L33/58 , H01L33/50 , H01L33/34 , H01L33/32 , H01L33/30 , H01L33/28 , H01L27/32 , H01L27/15 , H01L33/00 , F21Y101/00 , F21Y105/10 , F21V7/00 , F21Y115/10
CPC分类号: H05B33/0803 , F21K9/233 , F21K9/64 , F21V7/0066 , F21V29/773 , F21Y2105/10 , F21Y2115/10 , H01L27/156 , H01L33/0079 , H01L33/50 , H01L33/62 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.
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公开(公告)号:US09559150B2
公开(公告)日:2017-01-31
申请号:US15088821
申请日:2016-04-01
IPC分类号: H01L33/00 , H01L21/00 , H01L27/32 , H05B33/08 , H01L51/50 , H01L27/15 , H01L33/62 , F21V29/77 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , F21V7/00 , F21Y101/00
CPC分类号: F21K9/238 , F21K9/233 , F21K9/235 , F21K9/237 , F21K9/64 , F21V3/00 , F21V7/0066 , F21V9/08 , F21V15/01 , F21V23/008 , F21V23/06 , F21V29/70 , F21V29/773 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L27/32 , H01L33/0079 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H04N1/02865 , H05B33/0803 , H05B33/0815 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H05B33/0896 , H05B37/0218 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs) that are interconnected in parallel in a first direction and interconnected in series in a second direction different from the first direction.
摘要翻译: 在各种实施例中,照明系统包括其上设置有多个导电元件的电绝缘载体和发光阵列。 发光阵列设置在载体上,并且包括多个发光二极管(LED),其在第一方向上并联并且在与第一方向不同的第二方向上串联互连。
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公开(公告)号:US20160010805A1
公开(公告)日:2016-01-14
申请号:US14860800
申请日:2015-09-22
CPC分类号: F21K9/238 , F21K9/233 , F21K9/235 , F21K9/237 , F21K9/64 , F21V3/00 , F21V7/0066 , F21V9/08 , F21V15/01 , F21V23/008 , F21V23/06 , F21V29/70 , F21V29/773 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L27/32 , H01L33/0079 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H04N1/02865 , H05B33/0803 , H05B33/0815 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H05B33/0896 , H05B37/0218 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of electrically connected light-emitting diodes (LEDs). Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element. The power source provides power to the light-emitting strings.
摘要翻译: 在各种实施例中,照明系统包括具有设置在其上的多个导电元件的电绝缘载体,发光阵列和至少一个电源。 发光阵列设置在载体上并且包括多个发光串,每个发光串包括多个电连接的发光二极管(LED)。 每个LED具有至少两个电触头,并且每个电触头电连接到导电元件。 电源为发光串提供电源。
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公开(公告)号:US08338849B2
公开(公告)日:2012-12-25
申请号:US13523576
申请日:2012-06-14
CPC分类号: F21K9/238 , F21K9/233 , F21K9/235 , F21K9/237 , F21K9/64 , F21V3/00 , F21V7/0066 , F21V9/08 , F21V15/01 , F21V23/008 , F21V23/06 , F21V29/70 , F21V29/773 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L27/32 , H01L33/0079 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H04N1/02865 , H05B33/0803 , H05B33/0815 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H05B33/0896 , H05B37/0218 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of unpackaged light-emitting diode (LED) dies electrically connected in series. Each LED die has at least two electrical contacts on one surface thereof, and each electrical contact is electrically connected to a conductive element by a conductive adhesive. The power source provides power to the light-emitting strings.
摘要翻译: 在各种实施例中,照明系统包括具有设置在其上的多个导电元件的电绝缘载体,发光阵列和至少一个电源。 发光阵列设置在载体上并且包括多个发光串,每个发光串包括串联电连接的多个未封装的发光二极管(LED)管芯。 每个LED管芯在其一个表面上具有至少两个电触头,并且每个电触点通过导电粘合剂电连接到导电元件。 电源为发光串提供电源。
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公开(公告)号:US20120146066A1
公开(公告)日:2012-06-14
申请号:US13378880
申请日:2010-06-23
CPC分类号: F21K9/238 , F21K9/233 , F21K9/235 , F21K9/237 , F21K9/64 , F21V3/00 , F21V7/0066 , F21V9/08 , F21V15/01 , F21V23/008 , F21V23/06 , F21V29/70 , F21V29/773 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L27/32 , H01L33/0079 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H04N1/02865 , H05B33/0803 , H05B33/0815 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H05B33/0896 , H05B37/0218 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: The present invention relates to a light emitting device comprising a plurality of electrically coupled light emitting elements, wherein each light emitting element has a luminous efficacy vs. current characteristic, wherein said luminous efficacy vs. current characteristic has a maximum luminous efficacy value and wherein at least one of said light emitting devices is operated at a current corresponding to a luminous efficacy value that is within 10% of said maximum luminous efficacy value. The present invention also relates to methods of making said light emitting device, to lamps comprising said light emitting device and to methods of operating said light emitting device.
摘要翻译: 本发明涉及包括多个电耦合发光元件的发光器件,其中每个发光元件具有发光效率与电流特性,其中所述发光效率与电流特性具有最大发光效能值,并且其中在 至少一个所述发光器件以与所述最大发光效率值的10%以内的发光效率值相对应的电流工作。 本发明还涉及制造所述发光器件的方法,包括所述发光器件的灯以及操作所述发光器件的方法。
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公开(公告)号:US11415272B2
公开(公告)日:2022-08-16
申请号:US17130408
申请日:2020-12-22
IPC分类号: H01L29/40 , H01L21/00 , F21K9/233 , H05B45/60 , H05B47/11 , F21K9/64 , H01L27/15 , H05B45/30 , H05B45/3725 , H05B45/40 , H05B45/10 , H01L33/50 , F21V29/70 , F21K9/238 , F21K9/235 , F21K9/237 , F21V3/00 , F21V9/08 , F21V15/01 , F21V23/00 , F21V23/06 , H01L25/075 , H01L27/32 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/58 , H01L33/60 , H01L51/50 , H04N1/028 , H05B45/37 , F21Y105/10 , F21Y115/10 , H05B45/42 , H05B45/12
摘要: In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.
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公开(公告)号:US20190316742A1
公开(公告)日:2019-10-17
申请号:US16358888
申请日:2019-03-20
IPC分类号: F21K9/238 , H05B33/08 , H01L27/15 , H04N1/028 , H01L51/50 , H01L33/60 , H01L33/58 , H01L33/34 , H01L33/32 , H01L33/30 , H01L33/28 , H01L27/32 , H01L25/075 , H01L33/62 , F21K9/233 , F21K9/64 , F21V29/77 , F21V23/06 , F21V23/00 , F21V15/01 , F21V9/08 , F21V3/00 , F21K9/237 , F21K9/235 , H05B37/02 , F21V29/70 , H01L33/50
摘要: In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.
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公开(公告)号:US10281091B2
公开(公告)日:2019-05-07
申请号:US15938336
申请日:2018-03-28
IPC分类号: H01L33/00 , H01L21/00 , F21K9/238 , H05B33/08 , H01L51/50 , H01L27/32 , H01L27/15 , H01L33/62 , F21V29/77 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , F21K9/233 , F21K9/64 , F21K9/237 , H04N1/028 , F21V29/70 , F21K9/235 , F21V3/00 , F21V9/08 , F21V15/01 , F21V23/00 , F21V23/06 , H01L25/075 , H05B37/02 , F21V7/00 , F21Y101/00 , F21Y105/10 , F21Y115/10
摘要: In various embodiments, lighting systems include a carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs), each of which has at least two electrical contacts electrically connected to conductive elements.
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公开(公告)号:US09431462B2
公开(公告)日:2016-08-30
申请号:US14860800
申请日:2015-09-22
IPC分类号: H01L33/00 , H01L21/00 , H01L27/32 , H05B33/08 , H01L51/50 , F21K99/00 , F21V29/77 , F21Y101/02 , H01L27/15 , H01L33/62 , F21V7/00 , F21Y105/00
CPC分类号: F21K9/238 , F21K9/233 , F21K9/235 , F21K9/237 , F21K9/64 , F21V3/00 , F21V7/0066 , F21V9/08 , F21V15/01 , F21V23/008 , F21V23/06 , F21V29/70 , F21V29/773 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L27/156 , H01L27/32 , H01L33/0079 , H01L33/28 , H01L33/30 , H01L33/32 , H01L33/34 , H01L33/50 , H01L33/58 , H01L33/60 , H01L33/62 , H01L51/50 , H01L2224/48137 , H01L2224/48227 , H01L2224/49107 , H01L2924/13033 , H04N1/02865 , H05B33/0803 , H05B33/0815 , H05B33/0818 , H05B33/0821 , H05B33/0824 , H05B33/0845 , H05B33/0896 , H05B37/0218 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of electrically connected light-emitting diodes (LEDs). Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element. The power source provides power to the light-emitting strings.
摘要翻译: 在各种实施例中,照明系统包括具有设置在其上的多个导电元件的电绝缘载体,发光阵列和至少一个电源。 发光阵列设置在载体上并且包括多个发光串,每个发光串包括多个电连接的发光二极管(LED)。 每个LED具有至少两个电触头,并且每个电触头电连接到导电元件。 电源为发光串提供电源。
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