公开(公告)号：US08182913B2

公开(公告)日：2012-05-22

申请号：US12225816

申请日：2007-10-18

申请人： Sang Ki Chun ,  Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Dong Han Kho

发明人： Sang Ki Chun ,  Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Dong Han Kho

IPC分类号： B32B27/08 ,  B05D3/14

CPC分类号： B41M5/529 ,  Y10T428/31507 ,  Y10T428/3154 ,  Y10T428/31544 ,  Y10T428/31663 ,  Y10T428/31667

摘要： There are provided a sheet having a silicon/plastic bi-layer structure capable of easily transferring a paste even when a hard roll is used, the hard roll having excellent durability but having disadvantages that the paste is poorly transferred when the paste is printed on a plastic base, and a method for producing the same. The bi-layer structured sheet having excellent printability when printed by hard roll includes a flexible substrate and a silicon resin formed on the substrate.

摘要翻译： 提供一种具有硅/塑料双层结构的片材，即使在使用硬卷时也能够容易地转移糊料，硬卷具有优异的耐久性，但是具有当将糊剂印刷在糊状物上时浆料转印不良的缺点 塑料基料及其制造方法。 当通过硬辊打印时具有优异的可印刷性的双层结构片包括柔性基板和形成在基板上的硅树脂。

公开(公告)号：US08128773B2

公开(公告)日：2012-03-06

申请号：US12087919

申请日：2007-01-15

申请人： Sang-ki Chun ,  Dong-han Kho ,  Suk-Ky Chang

发明人： Sang-ki Chun ,  Dong-han Kho ,  Suk-Ky Chang

IPC分类号： B32B7/12 ,  B32B7/02 ,  B32B5/02 ,  B32B37/00 ,  C08G77/38

CPC分类号： H05K3/007 ,  C08L83/00 ,  C09J7/28 ,  C09J183/04 ,  C09J2483/00 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/24355 ,  Y10T428/24942 ,  Y10T428/2839

摘要： Disclosed herein is a silicon adhesive composition for transporting a flexible substrate. The composition includes (A) 42 to 70 parts by weight of a polydiorganosiloxane containing an alkenyl group, (B) 55 to 28 parts by weight of a polyorganosiloxane copolymer including R13SiO1/2 units and SiO2 units, wherein R1 is a hydroxy group or a monovalent hydrocarbon group of 1 to 12 carbon atoms, (C) a polyorganosiloxane containing an SiH group, wherein the molar ratio of the SiH group of component (C) to the alkenyl group of component (A) is from 0.5 to 20, and (D) a platinum group catalytic compound, wherein the weight ratio of a metal component of the compound to the sum of components (A) and (B) is from 1 to 5000 ppm by weight.

摘要翻译： 本文公开了一种用于输送柔性基板的硅粘合剂组合物。 该组合物包含（A）42〜70重量份含有烯基的聚二有机硅氧烷，（B）55〜28重量份的包含R 13 SiO 1/2单元和SiO 2单元的聚有机硅氧烷共聚物，其中R 1为羟基或 （C）含有SiH基的聚有机硅氧烷，（C）成分（C）的SiH基与成分（A）的链烯基的摩尔比为0.5〜20，（C）含有1〜 D）铂族催化剂化合物，其中化合物的金属组分与组分（A）和（B）之和的重量比为1至5000重量ppm。

公开(公告)号：US20100038023A1

公开(公告)日：2010-02-18

申请号：US12225435

申请日：2007-03-22

申请人： Dong-Han Kho ,  Sang-Ki Chun ,  Se-Ra Kim ,  Suk-Ky Chang

发明人： Dong-Han Kho ,  Sang-Ki Chun ,  Se-Ra Kim ,  Suk-Ky Chang

IPC分类号： C08L83/04 ,  C08K3/28 ,  B32B33/00 ,  B32B37/00

CPC分类号： B32B27/36 ,  B32B7/06 ,  B32B15/08 ,  B32B17/06 ,  B32B27/08 ,  B32B27/18 ,  B32B27/283 ,  B32B2307/306 ,  B32B2307/748 ,  B32B2405/00 ,  B32B2457/20 ,  C08K5/0075 ,  C08L83/00 ,  C09J183/04 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  Y10T428/1476

摘要： Disclosed herein is an adhesive composition for transporting a flexible substrate, which is used to manufacture a flexible display device using a flexible substrate such as a plastic substrate by using a conventional line for manufacturing a liquid crystal display device comprising a glass substrate. The present invention provides an adhesive composition for transporting a flexible substrate, which includes 100 parts by weight of an adhesive for transporting a flexible substrate and 0.001 to 5 parts by weight of an antistatic agent, an adhesive sheet containing the composition, and a method of transporting a flexible substrate using the same.

摘要翻译： 本文公开了一种用于输送柔性基板的粘合剂组合物，其用于通过使用用于制造包括玻璃基板的液晶显示装置的传统线来制造使用诸如塑料基板的柔性基板的柔性显示装置。 本发明提供了一种用于输送柔性基材的粘合剂组合物，其包括100重量份的用于输送柔性基材的粘合剂和0.001至5重量份的抗静电剂，含有该组合物的粘合片，以及 使用其移动柔性基板。

公开(公告)号：US08541289B2

公开(公告)日：2013-09-24

申请号：US12681572

申请日：2008-10-15

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L21/00

CPC分类号： C09J163/00 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2924/1434 ,  H01L2924/37001 ,  Y10T428/24

摘要： The present invention relates to a dicing die bonding film, which is able to maintain good workability and reliability in any semiconductor packaging process, such as adhesive property, gap filling property and pick-up property, while controlling burr incidence in a dicing process and thus contamination of die, and a dicing method. Specifically, the present invention is characterized by optimizing tensile characteristics of the dicing die bonding film, or carrying out the dicing on the parts of the die bonding film in the dicing process and separating it through an expanding process. Therefore, the present invention may regulate physical properties of films so as to have the maximized adhesive property, pick-up property and gap filling property without any specific restriction, while controlling burr incidence in the dicing process and contamination of die. As a result, workability and reliability in a packaging process may be excellently maintained.

摘要翻译： 本发明涉及一种切割模片接合薄膜，其能够在任何半导体封装工艺中保持良好的可加工性和可靠性，例如粘合性能，间隙填充性能和拾取性能，同时控制切割工艺中的毛刺发生率，因此 模具污染和切割方法。 具体地说，本发明的特征在于优化切割芯片接合薄膜的拉伸特性，或者在切割工艺中对芯片接合薄膜的部分进行切割，并通过扩展工艺进行分离。 因此，本发明可以调节膜的物理性能，从而具有最大化的粘合性，吸收性和间隙填充性，而不受任何限制，同时控制切割过程中的毛刺发生率和模具的污染。 因此，可以极好地保持包装过程中的可操作性和可靠性。

公开(公告)号：US20100285244A1

公开(公告)日：2010-11-11

申请号：US12448918

申请日：2007-10-17

申请人： Dong Han Kho

发明人： Dong Han Kho

IPC分类号： C09K19/52 ,  C08L33/08 ,  C08L71/02 ,  B32B7/02 ,  C08F8/30 ,  C08F8/00 ,  C08K5/101

CPC分类号： C09J133/06 ,  B32B2457/202 ,  C08L2666/02 ,  C09J133/08 ,  C09J2201/606 ,  G02B5/30 ,  Y10T428/1059 ,  Y10T428/1077 ,  Y10T428/24975

摘要： The present invention relates to an acrylic pressure sensitive adhesive composition. More specifically, the present invention relates to an acrylic pressure sensitive adhesive composition which comprises a) acrylic copolymers; and b) a compound having an ester value of 200 or more. The acrylic pressure sensitive adhesive composition of the present invention has an excellent wettability to the surface of an adhered article with surface unevenness, an excellent endurance reliability, transparency, and stain resistance of adhered article, and a high-rate release property without any considerable change of adhesive properties.

摘要翻译： 本发明涉及丙烯酸压敏粘合剂组合物。 更具体地，本发明涉及丙烯酸压敏粘合剂组合物，其包含：a）丙烯酸共聚物; 和b）酯值为200以上的化合物。 本发明的丙烯酸类压敏粘合剂组合物对于具有表面不均匀性，粘合制品的耐久性可靠性，透明性和耐污染性优异的粘附物品的表面具有优异的润湿性，并且高速释放性能没有任何显着变化 的粘合性能。

公开(公告)号：US10011743B2

公开(公告)日：2018-07-03

申请号：US14395240

申请日：2012-05-21

申请人： Dong Han Kho ,  Sang Hoon Lee ,  Chang Ik Hwang ,  Yeon Soo Kim

发明人： Dong Han Kho ,  Sang Hoon Lee ,  Chang Ik Hwang ,  Yeon Soo Kim

IPC分类号： C09J7/38 ,  C09J175/04 ,  C08G18/62 ,  C08G18/67 ,  C09J133/06 ,  C09J9/00 ,  C09J7/00 ,  C09J133/08 ,  G02F1/17 ,  G02F1/167

CPC分类号： C09J7/385 ,  C08G18/6229 ,  C08G18/672 ,  C09J7/00 ,  C09J7/10 ,  C09J9/00 ,  C09J133/068 ,  C09J133/08 ,  C09J175/04 ,  C09J2203/318 ,  C09J2433/00 ,  C09J2467/005 ,  G02F1/167 ,  G02F1/172 ,  G02F2202/28 ,  Y10T428/1476 ,  C08F2220/1825 ,  C08F220/14 ,  C08F220/06 ,  C08F2220/325

摘要： A dielectric adhesive film for an electronic paper display device, by which the operating performance of a flexible display device is excellent even applying a high voltage when the flexible display device is operated, by controlling a dielectric constant with respect to an adhesive film for attaching a lower electrode to which a voltage is applied with an image upper electrode on which particles, which possess electric charges with various colors that change according to an applied voltage, are coated to adjust the electric charges of the adhesive film in the thickness direction to thereby minimize loss of the applied voltage while maintaining an adhesive property and reliability.

公开(公告)号：US20130171399A1

公开(公告)日：2013-07-04

申请号：US13699253

申请日：2011-10-19

申请人： Dong Han Kho ,  Sang Hoon Lee ,  Chang Ik Hwang ,  Yeon Soo Kim

发明人： Dong Han Kho ,  Sang Hoon Lee ,  Chang Ik Hwang ,  Yeon Soo Kim

IPC分类号： C09J133/14

CPC分类号： C09J133/14 ,  C09J7/10 ,  C09J9/02 ,  C09J133/066 ,  C09J133/26 ,  C09J139/06 ,  C09J2203/318 ,  C09J2433/00 ,  G02F1/1676 ,  G02F2202/28 ,  Y10T428/1405 ,  Y10T428/1462

摘要： A dielectric adhesive film for an electronic paper display device. A lower electrode to which voltage is applied and an image upper electrode coated with charged particles whose colors are changed depending on the applied voltage are attached to the adhesive film. Thickness of the adhesive film is controlled to be uniform and constant, and a resistance value in the thickness direction of the adhesive film, i.e., a resistance value in the direction where an electric field is formed, is controlled without changing adhesive properties and reliability as the thickness of the adhesive film is controlled. Since loss of the applied voltage is minimized and the charged particles are freely driven, driving performance of the display device is excellent although a high voltage is not applied in driving a flexible display device, such as a flexible LED, an organic electro luminescence (EL) element including an electronic paper, and the like.

摘要翻译： 一种用于电子纸显示装置的介电粘合膜。 施加电压的下电极和涂覆有颜色根据施加电压而变化的带电粒子的图像上电极附着到粘合剂膜。 控制粘合膜的厚度均匀且恒定，并且在不改变粘合剂性质和可靠性的情况下控制粘合膜的厚度方向上的电阻值，即形成电场的方向上的电阻值 控制粘合膜的厚度。 由于施加电压的损失被最小化并且带电粒子被自由地驱动，所以显示装置的驱动性能优异，尽管在驱动诸如柔性LED，有机电致发光（EL）的柔性显​​示装置中没有高电压 ）元件等。

公开(公告)号：US08207616B2

公开(公告)日：2012-06-26

申请号：US12738560

申请日：2008-10-24

申请人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

发明人： Jong Wan Hong ,  Jang Soon Kim ,  Hyo Soon Park ,  Hyun Jee Yoo ,  Dong Han Kho ,  Hyo Sook Joo

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC分类号： H01L24/29 ,  C08L33/068 ,  C08L2666/04 ,  C09J7/35 ,  C09J133/02 ,  C09J133/14 ,  C09J163/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83885 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  Y10T428/25 ,  Y10T428/269 ,  Y10T428/2874 ,  Y10T428/31515 ,  H01L2924/00

摘要： The present invention relates to an adhesive film, a dicing die bonding film and a semiconductor device. More specifically, the adhesive film of the present invention is characterized by comprising a base film and an adhesive layer and having a yield strength of 20 to 50 gf and a slope of tensile elastic region of 30 to 80 gf/mm at a thickness of 5 to 50 μm. In the present adhesive film, the yield strength and the slope of tensile elastic region are controlled so that the incidence of burrs may be predicted and controlled depending on thickness of an adhesive layer. The dicing die bonding film, and the semiconductor device comprising the same have lower incidence of burrs and an excellent workability and reliability.

摘要翻译： 粘合膜技术领域本发明涉及一种粘合膜，切割芯片接合膜和半导体器件。 更具体地说，本发明的粘合膜的特征在于，包括基膜和粘合剂层，其屈服强度为20〜50gf，拉伸弹性区域的斜率为30〜80gf / mm，厚度为5 至50μm。 在本粘合膜中，控制屈服强度和拉伸弹性区域的斜率，使得可以根据粘合剂层的厚度来预测和控制毛刺的发生。 切割芯片接合薄膜及其半导体装置具有较低的毛刺发生率和良好的可加工性和可靠性。

公开(公告)号：US08021751B2

公开(公告)日：2011-09-20

申请号：US12225816

申请日：2007-10-18

申请人： Sang Ki Chun ,  Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Dong Han Kho

发明人： Sang Ki Chun ,  Dong Wook Lee ,  In Seok Hwang ,  Seung Wook Kim ,  Dong Han Kho

IPC分类号： B32B27/08 ,  B05D3/14

摘要： There are provided a sheet having a silicon/plastic bi-layer structure capable of easily transferring a paste even when a hard roll is used, the hard roll having excellent durability but having disadvantages that the paste is poorly transferred when the paste is printed on a plastic base, and a method for producing the same. The bi-layer structured sheet having excellent printability when printed by hard roll includes a flexible substrate and a silicon resin formed on the substrate.

公开(公告)号：US20110111218A1

公开(公告)日：2011-05-12

申请号：US12989353

申请日：2009-04-24

申请人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

发明人： Hyun Jee Yoo ,  Dong Han Kho ,  Jang Soon Kim ,  Hyo Soon Park ,  Jong Wan Hong ,  Hyo Sook Joo

IPC分类号： B32B7/12 ,  B32B27/38 ,  C08L63/00

CPC分类号： H01L21/02002 ,  C08G59/621 ,  C08K5/13 ,  C08L33/066 ,  C08L33/068 ,  C08L61/06 ,  C08L61/12 ,  C08L61/20 ,  C08L63/00 ,  C08L2666/02 ,  C09J5/06 ,  C09J7/20 ,  C09J133/066 ,  C09J133/068 ,  C09J163/00 ,  C09J2201/36 ,  C09J2201/60 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6836 ,  Y10T428/269 ,  Y10T428/287 ,  Y10T428/2891 ,  Y10T428/31515

摘要： Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of buns during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent.

摘要翻译： 提供环氧组合物，粘合剂膜，切割芯片接合膜和使用其的半导体器件。 具体地，提供环氧组合物及其用途，其中环氧组合物在一定条件下测定的凝胶含量为5〜20％。 根据本发明的环氧组合物作为粘合剂，当制备成具有低的玻璃化转变温度，在高温下表现出良好的粘附性并且在加工期间具有最小的小圆面包的情况下，显示出优异的弹性。 因此，根据本发明，能够防止在高温下的引线接合或模压加工中由于模切移位引起的缺陷，并且由于粘合剂的粘合性和加工性优异，因此获得了高可靠性的半导体器件。