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公开(公告)号:US20220161537A1
公开(公告)日:2022-05-26
申请号:US17425749
申请日:2020-01-24
申请人: Ame QUELLMALZ , Niclas ROXHED , Kristinn GYLFASON , Göran STEMME , Frank NIKLAUS
发明人: Arne QUELLMALZ , Xiaojing WANG , Kristinn GYLFASON , Niclas ROXHED , Göran STEMME , Frank NIKLAUS
IPC分类号: B32B37/00
摘要: A method for transferring an atomically thin layer comprising providing a target substrate and a donor substrate on which a first atomically thin layer has been formed. The method further comprises disposing an adhesion layer at the donor substrate or at the target substrate. The method further comprises bringing the target substrate and the donor substrate together. Further, the method comprises bonding together the donor substrate, the adhesion layer and the target substrate and removing the donor substrate.
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公开(公告)号:US10782249B2
公开(公告)日:2020-09-22
申请号:US16062517
申请日:2016-12-14
申请人: Valentin Dubois , Frank Niklaus , Göran Stemme
发明人: Valentin Dubois , Frank Niklaus , Göran Stemme
IPC分类号: G01N21/95 , G01N33/487 , G01N27/327 , C12Q1/6869 , H01L21/66 , H01L21/302 , H01L21/02 , B82Y5/00 , B82Y15/00 , B82Y40/00
摘要: Disclosed is a method of making a crack structure on a substrate, the crack structure being usable as a tunneling junction structure in a nanogap device, including the controlled fracture or release of a patterned layer under built-in stress, thereby forming elements separated by nanogaps or crack-junctions. The width of the crack-defined nanogap is controlled by locally release-etching the film at a notched bridge patterned in the film. The built-in stress contributes to forming the crack and defining of the width of the crack-defined nanogap. Further, by design of the length of the bridge in a range between sub-μπι to >25μαι, the separation between the elements, defined by the width of the crack-defined nanogaps, can be controlled for each individual crack structure from 100 nm. The nanogaps can be used for tunneling devices in combination with nanopores for DNA, RNA or peptides sequencing.
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公开(公告)号:US20150217095A1
公开(公告)日:2015-08-06
申请号:US14673993
申请日:2015-03-31
申请人: Niclas ROXHED , Staffan JOHANSSON , Göran STEMME , Anders EKLUND , Jan MALM
发明人: Niclas ROXHED , Staffan JOHANSSON , Göran STEMME , Anders EKLUND , Jan MALM
IPC分类号: A61M27/00
摘要: The disclosure relates to a cerebrospinal fluid (CSF) shunt for treatment of hydrocephalus, comprising a valve having an inlet port and an outlet port, which ports are for draining CSF, and a control port for regulating the drainage of CSF through the valve according to a hydrostatic pressure provided to the control port, which hydrostatic pressure is dependent on the body position of the patient. The disclosure further relates to a method for treatment of hydrocephalus comprising regulating drainage of CSF based on a hydrostatic pressure that is dependent on the body position of the patient.
摘要翻译: 本公开涉及用于治疗脑积水的脑脊液(CSF)分流器,包括具有入口和出口的阀,该端口用于排出CSF,以及控制端口,用于通过阀门调节CSF的排水,根据 提供给控制端口的静水压力,其静水压力取决于患者的身体位置。 本公开还涉及一种治疗脑积水的方法,包括基于取决于患者身体位置的静水压力来调节CSF的排水。
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公开(公告)号:US20130012078A1
公开(公告)日:2013-01-10
申请号:US13511486
申请日:2010-12-17
申请人: Andreas Fischer , Göran Stemme , Frank Niklaus , Niklas Roxhed
发明人: Andreas Fischer , Göran Stemme , Frank Niklaus , Niklas Roxhed
CPC分类号: B81C1/00293 , B01L3/502707 , B01L2300/042 , B81B2201/058 , B81B2203/0315 , B81C2201/019 , B81C2203/0145 , Y10T29/49117 , Y10T29/49151 , Y10T29/49153 , Y10T29/49826 , Y10T29/49885
摘要: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 μm to 300 μm, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.
摘要翻译: 一种用于至少部分地将插头插入孔中的方法,所述方法包括以下步骤:a)提供具有至少一个孔的至少一个基底,其中所述至少一个孔具有1μm至300μm的最大尺寸, b)提供一块材料,其中所述材料片具有比所述至少一个孔更大的尺寸,c)用工具将所述材料件压靠在孔上,从而形成插塞,其中至少部分 所述材料被压入所述孔中,d)从所述材料上移除所述工具。 还公开了一种使用该方法制造的堵塞孔。 一个实施例的一个优点是可以使用工业上可用的引线接合技术来密封各种空腔。 现有的导线接合技术使堵塞快速便宜。
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公开(公告)号:US20220324703A1
公开(公告)日:2022-10-13
申请号:US17641559
申请日:2020-09-10
申请人: Federico RIBET , Miku BRODIN-LAAKSO , Simone PAGLIANO , Frank NIKLAUS , Niclas ROXHED , Göran STEMME
发明人: Federico RIBET , Miku BRODIN-LAAKSO , Simone PAGLIANO , Frank NIKLAUS , Niclas ROXHED , Göran STEMME
摘要: Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).
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公开(公告)号:US07901387B2
公开(公告)日:2011-03-08
申请号:US11826871
申请日:2007-07-19
申请人: Göran Stemme , Patrick Griss
发明人: Göran Stemme , Patrick Griss
CPC分类号: A61M37/0015 , A61M2037/003 , A61M2037/0053
摘要: A hollow out-of-wafer-plane micro-needle protruding from a support member, the micro-needle includes a body portion having a longitudinal central axis, an inner lumen within the body portion and extending through the support member and into the protruding micro-needle, a closed pointed tip portion closing off the inner lumen in the tip region, the central axis extending through the tip portion, and at least one side opening in the body portion having an axis that intersects the central axis, the at least one side opening communicating with the inner lumen.
摘要翻译: 从支撑构件突出的中空的晶片外微型微针,所述微针包括具有纵向中心轴线的主体部分,所述主体部分内的内腔,并且延伸穿过所述支撑构件并进入所述突出微型 - 针头,封闭尖端部分,其封闭尖端区域中的内腔,延伸穿过尖端部分的中心轴线,并且主体部分中的至少一个侧开口具有与中心轴线相交的轴线,至少一个 侧开口与内腔连通。
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公开(公告)号:US20100144059A1
公开(公告)日:2010-06-10
申请号:US12523724
申请日:2008-01-18
IPC分类号: G01N35/10 , G01N30/00 , G01N33/543 , G01N29/00 , G01N33/558 , G01N27/00 , G01N21/00 , G01N1/28
CPC分类号: G01N33/54366 , A61B5/082 , A61B5/097 , B01L2300/048 , G01N1/2247 , G01N21/3504 , G01N21/553 , G01N21/65 , G01N21/78 , G01N21/783 , G01N27/4074 , G01N29/022 , G01N29/222 , G01N33/0004 , G01N33/0009 , G01N33/0057 , G01N33/497 , G01N33/4972 , G01N2021/7786 , G01N2291/0255 , G01N2291/0256 , G01N2291/0423 , G01N2291/0426 , Y10T436/11
摘要: There is provided an analysis device comprising a gas phase and a liquid phase and at least one sensor, said sensor having at least one point where an analyte is detected, said at least point being in contact with the liquid phase, characterised in that the device comprises a membrane with a first and a second side, which membrane is in contact with the gas phase on at least a part of one side of the membrane and which membrane is in contact with the liquid phase on at least a part of the other side of the membrane, wherein the membrane comprises openings, and wherein the largest possible distance between any two openings in the membrane is larger than the distance between the membrane and the point where an analyte is detected, moreover there is provided a method for analysing an analyte in a gas phase.
摘要翻译: 提供了包括气相和液相的分析装置和至少一个传感器,所述传感器具有至少一个点,其中检测到分析物,所述至少点与液相接触,其特征在于,所述装置 包括具有第一和第二侧的膜,该膜在膜的一侧的至少一部分上与气相接触,并且膜在另一侧的至少一部分上与液相接触 的膜,其中膜包括开口,并且其中膜中任何两个开口之间的最大可能距离大于膜与检测到分析物的点之间的距离,此外,提供了用于分析分析物的方法 在气相中。
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公开(公告)号:US07067345B2
公开(公告)日:2006-06-27
申请号:US10181146
申请日:2001-01-17
申请人: Edvard Kälvesten , Göran Stemme , Frank Niklaus
发明人: Edvard Kälvesten , Göran Stemme , Frank Niklaus
IPC分类号: H01L21/30
CPC分类号: H01L25/50 , G01J5/02 , H01L21/2007 , H01L21/6835 , H01L24/24 , H01L24/82 , H01L25/16 , H01L2221/68359 , H01L2221/68363 , H01L2224/24011 , H01L2224/24226 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01042 , H01L2924/01057 , H01L2924/01072 , H01L2924/01077 , H01L2924/01078 , H01L2924/10329 , H01L2924/10336 , H01L2924/1433 , Y10T156/1092
摘要: A method of combining components to form an integrated device, wherein the components are provided on a first sacrificial wafer, and a second non-sacrificial wafer, respectively. The sacrificial wafer carries a first plurality of components and the non-sacrificial wafer carries a second plurality of components. The wafers are bonded together with an intermediate bonding material. Optionally the sacrificial wafer is thinned to a desired level. The components of the sacrificial wafer are electrically interconnected to the component(s) on the non-sacrificial wafer. Finally, optionally the intermediate bonding material is stripped away.
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公开(公告)号:US07054052B2
公开(公告)日:2006-05-30
申请号:US10654007
申请日:2003-09-04
申请人: Frank Niklaus , Göran Stemme
发明人: Frank Niklaus , Göran Stemme
CPC分类号: G02B26/0841
摘要: A method of combining components to form an integrated device, wherein at least one first component is provided on a first surface of a sacrificial substrate, and at least one second component is provided on a first surface of a non-sacrificial substrate. At least one support structure is formed on at least one of the first surfaces of the sacrificial substrate, and the non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of the first surfaces. The sacrificial substrate carrying the first component, and the non-sacrificial substrate carrying the second component, respectively, are bonded, so that the first and second surfaces will be facing one another with a distance defined by a thickness of the support structure. At least a part of the sacrificial substrate is removed. The first component and second components are interconnected.
摘要翻译: 一种组合部件以形成集成器件的方法,其中至少一个第一部件设置在牺牲衬底的第一表面上,并且至少一个第二部件设置在非牺牲衬底的第一表面上。 分别在牺牲基板和非牺牲基板的至少一个第一表面上形成至少一个支撑结构,使得所述至少一个支撑结构从至少一个第一表面向外延伸。 承载第一部件的牺牲基板和分别承载第二部件的非牺牲基板分别接合,使得第一和第二表面将彼此面对,由支撑结构的厚度限定的距离。 至少部分牺牲基板被去除。 第一组件和第二组件互连。
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公开(公告)号:US20230041785A1
公开(公告)日:2023-02-09
申请号:US17790621
申请日:2021-01-04
申请人: Niclas ROXHED , Mikael SANDELL , Göran STEMME , Staffan HOLMIN , Stefan JONSSON , Wouter METSOLA VAN DER WIJNGAART
发明人: Niclas ROXHED , Mikael SANDELL , Göran STEMME , Staffan HOLMIN , Stefan JONSSON , Wouter METSOLA VAN DER WIJNGAART
摘要: A microbiopsy device for extracting a tissue sample, the microbiopsy device comprising a main body extending between a distal end and a proximal end and adapted to have or assume a shape of substantially uniform transverse width along the length of the main body, wherein the distal end is arranged to enter tissue; the proximal end comprises a mounting interface adapted for connection with an elongated member, or is integrally formed with a solid elongated member; the transverse width of the main body is smaller than 1 mm; and the main body comprises a recess extending in a longitudinal direction of the main body and defining a cavity arranged to capture tissue therein.
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