CEREBROSPINAL FLUID SHUNT FOR TREATMENT OF HYDROCEPHALUS
    3.
    发明申请
    CEREBROSPINAL FLUID SHUNT FOR TREATMENT OF HYDROCEPHALUS 审中-公开
    用于治疗水肿的脑脊液

    公开(公告)号:US20150217095A1

    公开(公告)日:2015-08-06

    申请号:US14673993

    申请日:2015-03-31

    IPC分类号: A61M27/00

    摘要: The disclosure relates to a cerebrospinal fluid (CSF) shunt for treatment of hydrocephalus, comprising a valve having an inlet port and an outlet port, which ports are for draining CSF, and a control port for regulating the drainage of CSF through the valve according to a hydrostatic pressure provided to the control port, which hydrostatic pressure is dependent on the body position of the patient. The disclosure further relates to a method for treatment of hydrocephalus comprising regulating drainage of CSF based on a hydrostatic pressure that is dependent on the body position of the patient.

    摘要翻译: 本公开涉及用于治疗脑积水的脑脊液(CSF)分流器,包括具有入口和出口的阀,该端口用于排出CSF,以及控制端口,用于通过阀门调节CSF的排水,根据 提供给控制端口的静水压力,其静水压力取决于患者的身体位置。 本公开还涉及一种治疗脑积水的方法,包括基于取决于患者身体位置的静水压力来调节CSF的排水。

    METHOD FOR PLUGGING A HOLE AND A PLUGGED HOLE
    4.
    发明申请
    METHOD FOR PLUGGING A HOLE AND A PLUGGED HOLE 有权
    用于插入孔和插入孔的方法

    公开(公告)号:US20130012078A1

    公开(公告)日:2013-01-10

    申请号:US13511486

    申请日:2010-12-17

    IPC分类号: B81C1/00 H01R13/02

    摘要: A method for at least partially inserting a plug into a hole, said method comprising the steps of a) providing a at least one substrate with at least one hole wherein said at least one hole has a largest dimension of from 1 μm to 300 μm, b) providing a piece of material, wherein said piece of material has a larger dimension than said at least one hole, c) pressing said piece of material against the hole with a tool so that a plug is formed, wherein at least a part of said piece of material is pressed into said hole, d) removing the tool from the piece of material. There is further disclosed a plugged hole manufactured with the method. One advantage of an embodiment is that an industrially available wire bonding technology can be used to seal various cavities. The existing wire bonding technology makes the plugging fast and cheap.

    摘要翻译: 一种用于至少部分地将插头插入孔中的方法,所述方法包括以下步骤:a)提供具有至少一个孔的至少一个基底,其中所述至少一个孔具有1μm至300μm的最大尺寸, b)提供一块材料,其中所述材料片具有比所述至少一个孔更大的尺寸,c)用工具将所述材料件压靠在孔上,从而形成插塞,其中至少部分 所述材料被压入所述孔中,d)从所述材料上移除所述工具。 还公开了一种使用该方法制造的堵塞孔。 一个实施例的一个优点是可以使用工业上可用的引线接合技术来密封各种空腔。 现有的导线接合技术使堵塞快速便宜。

    Micro needles and method of manufacture thereof
    6.
    发明授权
    Micro needles and method of manufacture thereof 有权
    微针及其制造方法

    公开(公告)号:US07901387B2

    公开(公告)日:2011-03-08

    申请号:US11826871

    申请日:2007-07-19

    IPC分类号: A61M5/32 A61M5/00

    摘要: A hollow out-of-wafer-plane micro-needle protruding from a support member, the micro-needle includes a body portion having a longitudinal central axis, an inner lumen within the body portion and extending through the support member and into the protruding micro-needle, a closed pointed tip portion closing off the inner lumen in the tip region, the central axis extending through the tip portion, and at least one side opening in the body portion having an axis that intersects the central axis, the at least one side opening communicating with the inner lumen.

    摘要翻译: 从支撑构件突出的中空的晶片外微型微针,所述微针包括具有纵向中心轴线的主体部分,所述主体部分内的内腔,并且延伸穿过所述支撑构件并进入所述突出微型 - 针头,封闭尖端部分,其封闭尖端区域中的内腔,延伸穿过尖端部分的中心轴线,并且主体部分中的至少一个侧开口具有与中心轴线相交的轴线,至少一个 侧开口与内腔连通。

    Adhesive sacrificial bonding of spatial light modulators
    9.
    发明授权
    Adhesive sacrificial bonding of spatial light modulators 有权
    空间光调制器的粘合剂牺牲粘合

    公开(公告)号:US07054052B2

    公开(公告)日:2006-05-30

    申请号:US10654007

    申请日:2003-09-04

    CPC分类号: G02B26/0841

    摘要: A method of combining components to form an integrated device, wherein at least one first component is provided on a first surface of a sacrificial substrate, and at least one second component is provided on a first surface of a non-sacrificial substrate. At least one support structure is formed on at least one of the first surfaces of the sacrificial substrate, and the non-sacrificial substrate, respectively, such that said at least one support structure is extended outwardly from at least one of the first surfaces. The sacrificial substrate carrying the first component, and the non-sacrificial substrate carrying the second component, respectively, are bonded, so that the first and second surfaces will be facing one another with a distance defined by a thickness of the support structure. At least a part of the sacrificial substrate is removed. The first component and second components are interconnected.

    摘要翻译: 一种组合部件以形成集成器件的方法,其中至少一个第一部件设置在牺牲衬底的第一表面上,并且至少一个第二部件设置在非牺牲衬底的第一表面上。 分别在牺牲基板和非牺牲基板的至少一个第一表面上形成至少一个支撑结构,使得所述至少一个支撑结构从至少一个第一表面向外延伸。 承载第一部件的牺牲基板和分别承载第二部件的非牺牲基板分别接合,使得第一和第二表面将彼此面对,由支撑结构的厚度限定的距离。 至少部分牺牲基板被去除。 第一组件和第二组件互连。