摘要:
The present application relates to technology for improving a withstand voltage of a semiconductor device. The semiconductor device includes a termination area that surrounds a cell area. The cell area is provided with a plurality of main trenches. The termination area is provided with one or more termination trenches surrounding the cell area. A termination trench is disposed at an innermost circumference of one or more termination trenches. A body region is disposed on a surface of a drift region. Each main trench reaches the drift region. A gate electrode is provided within each main trench. The termination trench reaches the drift region. Sidewalls and a bottom surface of the termination trench are covered with a insulating layer. A surface of the insulating layer covering the bottom surface of the termination trench is covered with a buried electrode. A gate potential is applied to the buried electrode.
摘要:
A SiC device includes an inversion type MOSFET having: a substrate, a drift layer, and a base region stacked in this order; source and contact regions in upper portions of the base region; a trench penetrating the source and base regions; a gate electrode on a gate insulating film in the trench; a source electrode coupled with the source and base region; a drain electrode on a back of the substrate; and multiple deep layers in an upper portion of the drift layer deeper than the trench. Each deep layer has an impurity concentration distribution in a depth direction, and an inversion layer is provided in a portion of the deep layer on the side of the trench under application of the gate voltage.
摘要:
A silicon carbide semiconductor device includes: a semiconductor substrate having a principal surface and a backside surface; a drift layer disposed on the principal surface; a base region disposed on the drift layer; a source region disposed on the base region; a surface channel layer disposed on both of the drift layer and the base region for connecting between the source region and the drift layer; a gate insulation film disposed on the surface channel layer and including a high dielectric constant film; a gate electrode disposed on the gate insulation film; a source electrode disposed on the source region; and a backside electrode disposed on the backside surface.
摘要:
An SR (Selective Repeat) ARQ system with limited buffer memory is realized by modifying a part of a user data area. A transmitter side modifies a part of a user data area in a data frame so that it differs at least one bit from corresponding part of a frame with the same frame number as that of a current frame in a preceding modulo turn, and a receiver side compares said part of a user data area with corresponding part of a frame with the same frame number as that of a current frame in a preceding modulo turn. When they coincide, the receiver side disregards the received frame as it is re-transmitted frame which is already received correctly, and when they do not coincide, the receiver side takes the received frame. Preferably, said part of a user data area is the last word area in a user data area in a frame structure. When a user data has more words than capacity of a user data area in a frame structure, and when last word is completely equal to last word of a frame with the same frame number as that of a current frame in a preceding modulo turn, the last word in a user data area is transferred to a succeeding frame, and an area for that last word is filled with a data which differs at least one bit from a data in the last word in the corresponding frame having the same frame number as that of the current frame in a preceding modulo turn.
摘要:
A torque sensor comprising a magnetic amorphous film whose magnetostrictive characteristics vary with the amount of torque applied thereto and coils for detecting magnetostrictive variation disposed opposite the magnetic member. The torque sensor is constituted as an independent unit separate from the shaft whose torque is to be measured. The independent unit comprises a tubular or a shaft member having the magnetic amorphous film attached thereto and a housing with the coils at its inner wall. The housing covers the tubular or shaft member and is rotatable about the same axis as the member. The tubular member is easily mounted on the shaft through spline fittings in one embodiment and the short shaft member of the other embodiment is easily mounted between the two shaft ends via spline fittings and flange couplings.
摘要:
A torque sensor comprising a magnetic amorphous film whose magnetostrictive characteristics vary with the amount of torque applied thereto and coils for detecting magnetostrictive variation disposed opposite the magnetic member. The torque sensor is constituted as an independent unit separate from the shaft whose torque is to be measured. The independent unit comprises a tubular or a shaft member having the magnetic amorphous film attached thereto and a housing with the coils at its inner wall. The housing covers the tubular or shaft member and is rotatable about the same axis as the member. The tubular member is easily mounted on the shaft through spline fittings in one embodiment and the short shaft member via spline fittings and flange couplings.
摘要:
The silicon carbide semiconductor device includes a substrate, a drift layer, a base region, a source region, a trench, a gate insulating layer, a gate electrode, a source electrode, a drain electrode, and a deep layer. The deep layer is disposed under the base region and is located to a depth deeper than the trench. The deep layer is divided into a plurality of portions in a direction that crosses a longitudinal direction of the trench. The portions include a group of portions disposed at positions corresponding to the trench and arranged at equal intervals in the longitudinal direction of the trench. The group of portions surrounds corners of a bottom of the trench.
摘要:
To provide a circuit device freed from constrains of a mounting direction. The circuit device according to the present invention includes: a conductive pattern for forming a die pad, a first bonding pad, and a second bonding pad; and a semiconductor element (TR) attached to the conductive pattern. The circuit device further includes: a sealing resin for covering the semiconductor element (TR) and the conductive pattern with a rear surface of the conductive pattern being exposed; and a coating resin for covering the rear surface of the conductive pattern exposed from the sealing resin. The rear surface of the conductive pattern is exposed from openings of the coating resin, and the openings are arranged with rotational symmetry about a central point of the circuit device.
摘要:
Thiophene derivatives of the formula: ##SPC1##Wherein R.sup.1 is H or CH.sub.3 ; R.sup.2 is CH.sub.3 or C.sub.2 H.sub.5, or R.sup.1 and R.sup.2 combinedly represent --(CH.sub.2).sub.4 --; each of R.sup.3 and R.sup.4 is H, alkyl of from 1 to 4 carbon atoms or cyclohexyl, or R.sup.3 and R.sup.4 together with the adjacent nitrogen atom form 1-pyrrolidinyl, piperidino, 4-methyl-1-piperazinyl or morpholino; X is H, halogen or OCH.sub.3 ; A is -CH= or --C(CH.sub.3)=, and B is =N-- or =CH--; or A is --C(CH.sub.2 OH)= or --N=, and B is =N--, and pharmaceutically acceptable acid addition salts thereof possess excellent pharmacological properties such as sedative, anxiolytic and anticonvulsant effects and protective effects against hypoxia or anoxia.
摘要:
A semiconductor device has a semiconductor substrate including a body region, a drift region, a trench that extends from a surface of the semiconductor substrate into the drift region through the body region, and a source region located adjacent to the trench in a range exposed to the surface of the semiconductor substrate, the source region being isolated from the drift region by the body region. A specific layer is disposed on a bottom of the trench, and it has a characteristic of forming a depletion layer at a junction between the specific layer and the drift region. An insulating layer covers an upper surface of the specific layer and a sidewall of the trench. A conductive portion is formed on a part of the side wall of the trench. The conductive portion is joined to the specific layer, and reaches the surface of the semiconductor substrate.