公开(公告)号：US08198538B2

公开(公告)日：2012-06-12

申请号：US12392272

申请日：2009-02-25

Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang ,  Ray-Fong Hong

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang ,  Ray-Fong Hong

IPC: H05K1/09

CPC classification number: H05K1/162 ,  H01G4/228 ,  H01G4/248 ,  H01G4/33 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/112 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10674

Abstract: A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.

Abstract translation: 提供了一种电容器件。 该电容性装置包括第一电极和第一电极之下并与第一电极间隔开的第二电极，其中第一电极和第二电极中的至少一个包括多个导电步骤部分，所述多个导电步骤部分具有 不同的高度 电容性装置还包括在第一电极和第二电极之间的绝缘区域; 以及形成在第一电极和第二电极之一上的至少一个槽。

公开(公告)号：US20090267704A1

公开(公告)日：2009-10-29

申请号：US12395065

申请日：2009-02-27

Applicant: Huey-Ru CHANG ,  Min-Lin Lee ,  Jiin-Shing Perng ,  Sheng-Che Hung ,  Shinn-Juh Lai

Inventor： Huey-Ru CHANG ,  Min-Lin Lee ,  Jiin-Shing Perng ,  Sheng-Che Hung ,  Shinn-Juh Lai

IPC: H03H7/01

CPC classification number: H03H1/02 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1006

Abstract: A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.

Abstract translation: 提供电容器装置。 电容器装置包括至少一个电容器。 电容器装置还包括第一电容器和耦合第一电容器和导电区域的第一滤波器，其中第一电容器具有第一谐振频率，并且第一滤波器被配置为在覆盖第一谐振频率的第一频带上操作。

公开(公告)号：US08237520B2

公开(公告)日：2012-08-07

申请号：US12395065

申请日：2009-02-27

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Jiin-Shing Perng ,  Sheng-Che Hung ,  Shinn-Juh Lai

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Jiin-Shing Perng ,  Sheng-Che Hung ,  Shinn-Juh Lai

IPC: H03H7/00

CPC classification number: H03H1/02 ,  H01G4/40 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/162 ,  H05K1/165 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/1006

Abstract: A capacitor device is provided. The capacitor device includes at least one capacitor. The capacitor device also includes a first capacitor and a first filter coupling the first capacitor and a conductive region, wherein the first capacitor has a first resonance frequency and the first filter is configured to operate at a first frequency band covering the first resonance frequency.

Abstract translation: 提供电容器装置。 电容器装置包括至少一个电容器。 电容器装置还包括第一电容器和耦合第一电容器和导电区域的第一滤波器，其中第一电容器具有第一谐振频率，并且第一滤波器被配置为在覆盖第一谐振频率的第一频带上操作。

公开(公告)号：US08525328B2

公开(公告)日：2013-09-03

申请号：US13182469

申请日：2011-07-14

Applicant: Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

Inventor： Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

IPC: H01L23/34

CPC classification number: H01L25/165 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.

Abstract translation: 本公开涉及功率器件封装结构。 通过采用功率器件封装结构的金属衬底作为电容器的底部电极，将电容器集成到功率器件封装结构中。 依次设置在金属基板上的电介质材料层和上金属层。

公开(公告)号：US20090219668A1

公开(公告)日：2009-09-03

申请号：US12392272

申请日：2009-02-25

Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang ,  Ray-Fong Hong

Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang ,  Ray-Fong Hong

IPC: H01G4/005

CPC classification number: H05K1/162 ,  H01G4/228 ,  H01G4/248 ,  H01G4/33 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/112 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/09736 ,  H05K2201/09845 ,  H05K2201/10674

Abstract: A capacitive device is provided. The capacitive device includes a first electrode and a second electrode below the first electrode and spaced apart from the first electrode, wherein at least one of the first electrode and the second electrode includes a plurality of conductive step sections, the plurality of conductive step sections having different heights. The capacitive device also includes an insulating region between the first electrode and the second electrode; and at least one slot formed on one of the first electrode and the second electrode.

Abstract translation: 提供了一种电容器件。 该电容性装置包括第一电极和第一电极之下并与第一电极间隔开的第二电极，其中第一电极和第二电极中的至少一个包括多个导电步骤部分，所述多个导电步骤部分具有 不同的高度 电容性装置还包括在第一电极和第二电极之间的绝缘区域; 以及形成在第一电极和第二电极之一上的至少一个槽。

公开(公告)号：US06717071B2

公开(公告)日：2004-04-06

申请号：US09809310

申请日：2001-03-16

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Ted C. Ho

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Ted C. Ho

IPC: H05K111

CPC classification number: H05K1/0222 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2223/6622 ,  H01L2224/16 ,  H05K1/115 ,  H05K1/141 ,  H05K1/162 ,  H05K1/167 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/09809 ,  H05K2201/10378 ,  H05K2201/10689

Abstract: A coaxial via hole structure used in a carrier is disclosed. The coaxial via hole includes an outer cylinder-shaped conductor, an inner cylinder-shaped conductor and an intermediate fill. The outer cylinder-shaped conductor extends along a first direction. The inner cylinder-shaped conductor is disposed in the outer cylinder-shaped conductor and also extends along the first direction. The intermediate fill is between the outer cylinder-shaped conductor and the inner cylinder-shaped conductor and is made of insulating material or electrical-resistant material. The coaxial via hole structure can be applied as a capacitor or a resistor and has the function of signal shielding.

Abstract translation: 公开了一种在载体中使用的同轴通孔结构。 同轴通孔包括外筒形导体，内圆柱形导体和中间填充物。 外筒形导体沿着第一方向延伸。 内筒形导体设置在外筒状导体中，并且也沿着第一方向延伸。 中间填料位于外筒状导体与内筒状导体之间，由绝缘材料或耐电材料构成。 同轴通孔结构可以作为电容器或电阻器使用，具有信号屏蔽功能。

公开(公告)号：US20070062726A1

公开(公告)日：2007-03-22

申请号：US11531337

申请日：2006-09-13

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

IPC: H05K1/16

CPC classification number: H01L23/50 ,  H01G4/38 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01079 ,  H05K1/0231 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/10734

Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.

Abstract translation: 提供了具有集成电路的电路板内的嵌入式电容器件。 电路板在集成电路下具有公共耦合区域。 嵌入式电容器装置包括：向集成电路的第一端子组提供至少一个电容器的第一电容器部分和向集成电路的第二端子组提供至少一个电容器的第二电容器部分。 第一电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第一端子组。 类似地，第二电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第二端子组。

公开(公告)号：US07064427B2

公开(公告)日：2006-06-20

申请号：US10863700

申请日：2004-06-07

Applicant: Stephen Chung ,  Jungle Lee ,  Shinn-Juh Lay ,  Randy Wu ,  Huey-Ru Chang ,  Yu-Mei Cheng

Inventor： Stephen Chung ,  Jungle Lee ,  Shinn-Juh Lay ,  Randy Wu ,  Huey-Ru Chang ,  Yu-Mei Cheng

IPC: H01L23/04

CPC classification number: H05K1/162 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10674

Abstract: A unitary buried array capacitor and microelectronic structures incorporating such capacitors are disclosed. A unitary buried array capacitor can be formed by a top layer of electrode, a middle layer of dielectric, and a bottom layer of electrode. A first electrode lead, a second electrode lead and at least one interconnect line pass through the three layers while only the first electrode lead making electrical contact with the top layer of electrode and only the second electrode lead making electrical contact with the bottom electrode.

Abstract translation: 公开了一种整体埋地阵列电容器和结合这种电容器的微电子结构。 单一埋地阵列电容器可以由电极的顶层，电介质的中间层和电极的底层形成。 第一电极引线，第二电极引线和至少一个互连线穿过三层，而只有第一电极引线与电极的顶层电接触，并且仅第二电极引线与底部电极电接触。

公开(公告)号：US20120168839A1

公开(公告)日：2012-07-05

申请号：US13182469

申请日：2011-07-14

Applicant: Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

Inventor： Jiin-Shing Perng ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Huey-Ru Chang

IPC: H01L27/06

CPC classification number: H01L25/165 ,  H01L23/3107 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The disclosure relates to a power device package structure. By employing the metal substrate of the power device package structure serve as a bottom electrode of a capacitor, the capacitor is integrated into the power device package structure. A dielectric material layer and a upper metal layer sequentially disposed on the metal substrate.

Abstract translation: 本公开涉及功率器件封装结构。 通过采用功率器件封装结构的金属衬底作为电容器的底部电极，将电容器集成到功率器件封装结构中。 依次设置在金属基板上的电介质材料层和上金属层。

公开(公告)号：US07875808B2

公开(公告)日：2011-01-25

申请号：US11531337

申请日：2006-09-13

Applicant: Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

Inventor： Huey-Ru Chang ,  Min-Lin Lee ,  Shinn-Juh Lay ,  Chin Sun Shyu

IPC: H05K1/16

CPC classification number: H01L23/50 ,  H01G4/38 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01079 ,  H05K1/0231 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/10734

Abstract: An embedded capacitor device within a circuit board having an integrated circuitry thereon is provided. The circuit board has a common coupling area under the integrated circuitry. The embedded capacitor device includes a first capacitor section providing at least one capacitor to a first terminal set of the integrated circuitry and a second capacitor section providing at least one capacitor to a second terminal set of the integrated circuitry. A portion of the first capacitor section is in the common coupling area and has its coupling to the first terminal set located in the common coupling area. Similarly, a portion of the second capacitor section is in the common coupling area and has its coupling to the second terminal set located in the common coupling area.

Abstract translation: 提供了具有集成电路的电路板内的嵌入式电容器件。 电路板在集成电路下具有公共耦合区域。 嵌入式电容器装置包括：向集成电路的第一端子组提供至少一个电容器的第一电容器部分和向集成电路的第二端子组提供至少一个电容器的第二电容器部分。 第一电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第一端子组。 类似地，第二电容器部分的一部分在公共耦合区域中，并且其耦合到位于公共耦合区域中的第二端子组。