公开(公告)号：US20240015910A1

公开(公告)日：2024-01-11

申请号：US18473559

申请日：2023-09-25

Applicant: Samsung Electronics Co., Ltd. ,  INTOPS. CO., LTD.

Inventor： Chunghyo JUNG ,  Chiyoung YOON

IPC: H05K5/02 ,  H05K5/04

CPC classification number: H05K5/0243 ,  H05K5/04

Abstract: An example housing of an electronic device may include a body including a first portion having a first curvature, and a second portion having a second curvature; an outer plating layer comprising a conductive material and disposed on an outer surface of the body unit to be spaced by a predetermined interval from a boundary between the first portion and the second portion; and a coating layer which is disposed on the outer surface of the body to cover the plating layer.

公开(公告)号：US11765819B2

公开(公告)日：2023-09-19

申请号：US17399120

申请日：2021-08-11

Applicant: INTOPS CO., LTD.

Inventor： Sung-hoon Jung ,  Tae yong Hong

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/18

CPC classification number: H05K1/0284 ,  H05K3/0064 ,  H05K3/18 ,  H05K2201/09045 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.

公开(公告)号：US10850436B2

公开(公告)日：2020-12-01

申请号：US16194361

申请日：2018-11-18

Applicant: INTOPS CO., LTD. ,  Keun ha Kim

Inventor： Keun ha Kim ,  Won jae Choi ,  Hong il Lee

IPC: B29C45/00 ,  B32B21/08 ,  B32B3/26 ,  B32B7/12

Abstract: Disclosed herein is a method of manufacturing an interior material, which can implement various and distinct light emission effects by disposing a light-blocking layer configured to block light emitted from a light source at a location adjacent to an inner transparent film and then allowing the component of the transparent film to fill lighting grooves formed by laser-etching. Since a tape configured to support an island is employed, stable manufacturing is possible throughout an overall process.

公开(公告)号：US20180222158A1

公开(公告)日：2018-08-09

申请号：US15641442

申请日：2017-07-05

Applicant: Keunha KIM ,  Hee-dae Park ,  INTOPS CO., LTD. ,  SAMBU FINE CHEMICAL CO., LTD.

Inventor： Keunha KIM ,  Jung Ah CHOI ,  Sung Hoon KIM ,  Hee-dae Park

IPC: B32B21/10 ,  B32B5/02 ,  B32B7/12 ,  B32B21/14 ,  B29C45/16 ,  B29C45/72

CPC classification number: B32B21/10 ,  B29C45/14221 ,  B29C45/14811 ,  B29C45/16 ,  B29C45/72 ,  B29K2711/14 ,  B29K2713/00 ,  B29K2715/006 ,  B29L2007/00 ,  B32B5/022 ,  B32B7/12 ,  B32B21/14 ,  B32B27/08 ,  B32B27/12 ,  B32B27/281 ,  B32B27/302 ,  B32B27/308 ,  B32B27/36 ,  B32B27/365 ,  B32B2255/08 ,  B32B2255/26 ,  B32B2307/308 ,  B32B2307/412 ,  B32B2307/734 ,  B32B2317/16 ,  B32B2605/003

Abstract: Disclosed herein are a real wood film and a method of manufacturing an injection-molded real wood product by using the real wood film. The real wood film includes: a sliced veneer; a non-woven fabric adhered to the bottom surface of the sliced veneer by means of a non-aqueous adhesive, and configured to protect the sliced veneer from moisture; a formation improvement layer adhered to the bottom surface of M the non-woven fabric, and configured to prevent the sliced veneer from being wrinkled due to heat applied to the sliced veneer and prevent a crack from occurring; and a thermoplastic adhesive layer adhered to the bottom surface of the formation improvement layer, and configured to enable adhesion to injected resin.

公开(公告)号：US20240179850A1

公开(公告)日：2024-05-30

申请号：US18432807

申请日：2024-02-05

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  BS TECHNICS CO., LTD. ,  INTOPS CO., LTD.

Inventor： Chunghyo JUNG ,  Chiyoung YOON ,  Jungsik CHOI

IPC: H05K3/34 ,  B23K1/002 ,  B23K101/42 ,  H05K3/10 ,  H05K3/42

CPC classification number: H05K3/3485 ,  B23K1/002 ,  H05K3/101 ,  H05K3/3494 ,  H05K3/429 ,  B23K2101/42 ,  H05K2203/0126 ,  H05K2203/101

Abstract: An electronic device includes an injection mold including a mounting part and a wiring groove, a plated wiring plated on the wiring groove, and an electronic element mounted on the mounting part and electrically connected to the plated wiring, wherein the plated wiring is plated on an outer region of the injection mold, and the electronic element mounted on the injection mold dispensed on the plated wiring.

公开(公告)号：US20220209401A1

公开(公告)日：2022-06-30

申请号：US17179664

申请日：2021-02-19

Applicant: INTOPS CO., LTD.

Inventor： Tae yong HONG ,  Gyeom son SEONG

IPC: H01Q1/42 ,  B29C45/14 ,  B29C45/00 ,  B29C65/48 ,  B41M3/00 ,  H05B3/84 ,  B60R19/52 ,  B60Q1/24

Abstract: A method for a radome structure having a heating and a light emitting function according to the present invention comprises forming a three dimensional shape with a film part comprising a film, and a light emitting circuit and a heating circuit printed on the film in a stack; cutting the film part, and integrating an upper cover, a lower cover, and the film part disposed between the upper and the lower cover, into one body using one of a bonding process or an injection-molding process.

公开(公告)号：US20220184865A1

公开(公告)日：2022-06-16

申请号：US17173390

申请日：2021-02-11

Applicant: INTOPS CO., LTD.

Inventor： Tae yong HONG ,  Jun young AHN

IPC: B29C45/14

Abstract: An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.

公开(公告)号：US09819076B2

公开(公告)日：2017-11-14

申请号：US14895491

申请日：2013-08-26

Applicant: INTOPS. CO., LTD. ,  Bon-sool Koo

Inventor： Bon-sool Koo

IPC: H01Q1/38 ,  C25D7/00 ,  C25D5/48 ,  C25D5/34 ,  C23C28/02 ,  C23C18/16 ,  C25D5/02 ,  H01Q1/24

CPC classification number: H01Q1/38 ,  C23C18/16 ,  C23C28/023 ,  C25D5/024 ,  C25D5/34 ,  C25D5/48 ,  C25D7/00 ,  H01Q1/243

Abstract: The present invention relates to a method for manufacturing an internal antenna (intenna) and, in particular, to a method for manufacturing an intenna, which allows a resin molded product to be smoothly and securely plated with a metal by applying a primer paint on the surface of the resin molded product, and thereby improves the reliability of the metal plating formed on the resin molded product.

公开(公告)号：US11958210B2

公开(公告)日：2024-04-16

申请号：US17842142

申请日：2022-06-16

Applicant: HYUNDAI MOBIS Co., Ltd. ,  INTOPS CO., LTD. ,  SEOYON AUTOVISION Co., Ltd.

Inventor： Ik Keun Choi ,  Min Kyeong Lee ,  Hyun Ho Lee ,  Ji Seung Hong ,  Jong Jin Lee

IPC: B27N3/18 ,  B27N3/20 ,  B27M3/00

CPC classification number: B27N3/18 ,  B27N3/20 ,  B27M3/0066

Abstract: Disclosed are wood preforming devices for manufacturing a crash pad for a vehicle including a real wood sheet. A wood preforming device for manufacturing a crash pad for a vehicle includes a real wood sheet includes a lower press mold comprising a debossed portion provided on a portion on which a product is formed, and a support portion configured to support an upper press mold, in response to the lower press mold and the upper press mold pressing each other, the support portion having a protrusion for fixing a real wood sheet, the upper press mold having an embossed portion corresponding to the debossed portion of the lower press mold, and a movable core provided on the debossed portion of the lower press mold and being configured to guide the real wood sheet by moving upward from the debossed portion, in response to the upper press mold moving downward.

公开(公告)号：US20230257884A1

公开(公告)日：2023-08-17

申请号：US18137062

申请日：2023-04-20

Applicant: SAMSUNG ELECTRONICS CO, LTD. ,  INTOPS CO, LTD.

Inventor： Chunghyo JUNG ,  Wonjun KO ,  Hyein PARK ,  Yongsub LEE ,  Jaedeok LIM ,  Bumjin CHO ,  Chiyoung YOON ,  Keunha KIM ,  Kyungha KOO ,  Hongki MOON

IPC: C23C18/20 ,  H05K5/02 ,  B23C3/30 ,  C23C18/16

CPC classification number: C23C18/2013 ,  H05K5/0247 ,  B23C3/30 ,  C23C18/1651 ,  C23C18/1689 ,  B23K26/364

Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.