公开(公告)号：US08871660B2

公开(公告)日：2014-10-28

申请号：US12523320

申请日：2008-02-07

申请人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

发明人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

IPC分类号： B32B15/14 ,  B32B27/38 ,  D03D13/00 ,  B32B5/08 ,  B32B5/26 ,  H05K1/03 ,  D04H13/00 ,  B29C65/00 ,  B32B5/28 ,  B32B5/12 ,  H05K1/02

CPC分类号： H05K1/0366 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B29/005 ,  B32B29/02 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/036 ,  H05K2201/029 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/24124 ,  Y10T442/2951 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3463 ,  Y10T442/3496

摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

摘要翻译： 提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为 所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度 以较大者为准，为2°以下。

公开(公告)号：US20130242520A1

公开(公告)日：2013-09-19

申请号：US13885321

申请日：2011-11-15

申请人： Iji Onozuka

发明人： Iji Onozuka

IPC分类号： H05K1/03

CPC分类号： H05K1/038 ,  B32B5/02 ,  B32B2307/734 ,  B32B2457/08 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/4602 ,  H05K2201/029 ,  Y10T428/2495 ,  Y10T428/24967 ,  H01L2924/00 ,  H01L2224/0401

摘要： The present invention provides: an insulating substrate or metal-clad laminate able to sufficiently reduce or prevent negative warping of a semiconductor device; a printed wiring board that uses the insulating substrate or metal-clad laminate; and a semiconductor device. The insulating substrate is composed of a cured product of a laminate including one or more fibrous base material layers and two or more resin layers, in which the outermost layers on both sides is the resin layers. At least one of the fibrous base material layers is shifted towards the first side or a second side on the opposite side thereof with respect to the reference position, namely the dividing position at which a total thickness of the insulating substrate is equally divided by the number of the fibrous base material layers and each divided region having the thickness is further equally divided by two. The fibrous base material layers are not shifted in different directions. It is possible to produce a printed wiring board by using, as a core substrate, a metal-clad laminate containing the insulating substrate. Also, it is possible to produce a semiconductor device by mounting a semiconductor element onto the printed wiring board.

摘要翻译： 本发明提供：能够充分地减少或防止半导体器件的负翘曲的绝缘基板或覆金属层压板; 使用绝缘基板或覆金属层压板的印刷线路板; 和半导体器件。 绝缘基板由包括一个或多个纤维基材层和两个或更多个树脂层的层压体的固化产物组成，其中两侧的最外层是树脂层。 纤维基材层中的至少一个相对于基准位置移动到其相对侧的第一侧或第二侧，即绝缘基板的总厚度等于数量的分割位置 的纤维基材层和具有厚度的每个分割区域进一步等分二分。 纤维基材层不向不同方向移动。 可以通过使用包含绝缘基板的覆金属层压板作为芯基板来制造印刷线路板。 此外，可以通过将半导体元件安装到印刷线路板上来制造半导体器件。

公开(公告)号：US20110308848A1

公开(公告)日：2011-12-22

申请号：US13148774

申请日：2010-02-08

申请人： Yuka Ito ,  Kenichi Kaneda ,  Yasuaki Mitsui ,  Iji Onozuka ,  Noriyuki Ohigashi ,  Hideki Hara

发明人： Yuka Ito ,  Kenichi Kaneda ,  Yasuaki Mitsui ,  Iji Onozuka ,  Noriyuki Ohigashi ,  Hideki Hara

IPC分类号： H05K1/18 ,  H05K3/00 ,  B32B3/00

CPC分类号： H05K3/045 ,  H05K3/107 ,  H05K3/281 ,  H05K3/421 ,  H05K3/465 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T428/24355

摘要： Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.

摘要翻译： 公开了一种复合体，该复合体的制造方法以及半导体装置，该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔，具有高粘合性和高可靠性，并且 能够高频率。 还公开了树脂组合物和树脂片，两者都可以提供这种复合体。 复合体包括树脂层和导电层，其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下，和/或其中树脂层具有直径为1μm的通孔 以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下。 树脂组合物包含无机填料和热固性树脂，其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。 树脂片包括树脂层和基材，其中树脂层在基材上并包含树脂组合物。

公开(公告)号：US20090166060A1

公开(公告)日：2009-07-02

申请号：US12225106

申请日：2006-03-20

申请人： Iji Onozuka ,  Masataka Arai ,  Takeshi Hosomi

发明人： Iji Onozuka ,  Masataka Arai ,  Takeshi Hosomi

IPC分类号： H05K1/00 ,  B32B27/06

CPC分类号： H05K3/4626 ,  H05K1/024 ,  H05K1/036 ,  H05K2201/0195 ,  H05K2201/068 ,  Y10T428/31504 ,  Y10T428/31587 ,  Y10T428/31855

摘要： An insulating resin layer, which is capable of being employed for forming a multiple-layered printed wiring board via a thermal compression forming process, comprising: at least one first layer and at least one second layer being stacked, wherein a specific dielectric constant of the first layer at a frequency of 1 MHz after the thermal compression forming is not more than 3.2, and wherein a linear expansion coefficient of the second layer at a temperature within a range of from not lower than 35 degree C. to not higher than 85 degree C. after the thermal compression forming is not more than 40 ppm/degree C. A multiple-layered printed wiring board, formed by disposing the aforementioned insulating resin layer over at least one side of an internal layer circuit board, and then conducting a thermal compression forming process.

摘要翻译： 一种绝缘树脂层，其能够用于通过热压缩成形工艺形成多层印刷线路板，包括：至少一个第一层和至少一层第二层，其中所述绝缘树脂层的比介电常数 热压成形后1MHz频率的第一层不大于3.2，其中第二层的线膨胀系数在不低于35度至不高于85度的温度范围内 热压缩成形后的温度不超过40ppm /℃。一种多层印刷线路板，其通过在内层电路板的至少一侧上设置上述绝缘树脂层，然后进行热处理 压缩成型工艺。

公开(公告)号：US20100078201A1

公开(公告)日：2010-04-01

申请号：US12523320

申请日：2008-02-07

申请人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

发明人： Kazuyuki Yoshizaki ,  Teppei Ito ,  Iji Onozuka ,  Kensuke Nakamura

IPC分类号： H05K1/03 ,  B32B5/12 ,  B32B37/00

CPC分类号： H05K1/0366 ,  B32B5/024 ,  B32B5/12 ,  B32B5/22 ,  B32B5/26 ,  B32B5/28 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B27/12 ,  B32B27/281 ,  B32B27/304 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B29/005 ,  B32B29/02 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/02 ,  B32B2262/0261 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/30 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/718 ,  B32B2457/08 ,  H05K1/0271 ,  H05K1/036 ,  H05K2201/029 ,  H05K2201/09136 ,  Y10T156/10 ,  Y10T428/24124 ,  Y10T442/2951 ,  Y10T442/3179 ,  Y10T442/3301 ,  Y10T442/3415 ,  Y10T442/3431 ,  Y10T442/3463 ,  Y10T442/3496

摘要： There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less.

摘要翻译： 提供了一种层叠体，其包括由第一纤维基材和树脂构成的第一树脂层和由第二纤维基材和树脂组成的第二树脂层，其中第一树脂层和第二树脂层被设置为 所述第一树脂层和所述第二树脂层至少部分地位于沿所述层叠体的厚度方向由所述中心线分开的分离区域中; 其中所述第一纤维基材和所述第二纤维基材中的至少一个具有弯曲区域，在所述弯曲区域中，所述纤维基材中弯曲区域是较小经纱/纬纱交叉角度小于90°的区域; 并且其中在所述弯曲区域中，由所述第一纤维基材的翘曲和所述第二纤维基材的翘曲形成的角度和由所述第一纤维基材的纬纱和所述第二纤维基材的纬纱形成的角度 以较大者为准，为2°以下。