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    RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE
    1.
    发明申请
    RESIN COMPOSITION FOR WIRING BOARD, RESIN SHEET FOR WIRING BOARD, COMPOSITE BODY, METHOD FOR PRODUCING COMPOSITE BODY, AND SEMICONDUCTOR DEVICE 审中-公开
    接线板用树脂组合物，导线板用树脂片，复合体，生产复合体的方法及半导体器件

    公开(公告)号：US20110308848A1

    公开(公告)日：2011-12-22

    申请号：US13148774

    申请日：2010-02-08

    申请人： Yuka Ito ,  Kenichi Kaneda ,  Yasuaki Mitsui ,  Iji Onozuka ,  Noriyuki Ohigashi ,  Hideki Hara

    发明人： Yuka Ito ,  Kenichi Kaneda ,  Yasuaki Mitsui ,  Iji Onozuka ,  Noriyuki Ohigashi ,  Hideki Hara

    IPC分类号： H05K1/18 ,  H05K3/00 ,  B32B3/00

    CPC分类号： H05K3/045 ,  H05K3/107 ,  H05K3/281 ,  H05K3/421 ,  H05K3/465 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  Y10T29/49124 ,  Y10T428/24355

    摘要： Disclosed are a composite body, a method for producing the composite body and a semiconductor device, the composite body comprising a resin layer and a fine wiring and/or via hole being formed in the resin layer, having high adhesion and high reliability, and being capable of high frequencies. Also disclosed are a resin composition and a resin sheet, both of which can provide such a composite body.The composite body comprises a resin layer and an electroconductive layer, wherein a groove having a maximum width of 1 μm or more and 10 μm or less is on a surface of the resin layer; the electroconductive layer is inside the groove; and a surface of the resin layer being in contact with the electroconductive layer has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less, and/or wherein the resin layer has a via hole having a diameter of 1 μm or more and 25 μm or less; the electroconductive layer is inside the via hole; and a surface of the resin layer of the inside of the via hole has an arithmetic average roughness (Ra) of 0.05 μm or more and 0.45 μm or less. The resin composition comprises an inorganic filler and a thermosetting resin, wherein the inorganic filler contains coarse particles having a diameter of more than 2 μm in an amount of 500 ppm or less. The resin sheet comprises a resin layer and a substrate, wherein the resin layer is on the substrate and comprises the resin composition.

    摘要翻译： 公开了一种复合体，该复合体的制造方法以及半导体装置，该复合体包括树脂层和在该树脂层中形成的精细布线和/或通孔，具有高粘合性和高可靠性，并且 能够高频率。 还公开了树脂组合物和树脂片，两者都可以提供这种复合体。 复合体包括树脂层和导电层，其中在树脂层的表面上具有最大宽度为1μm以上且10μm以下的槽; 导电层在槽内; 并且与导电层接触的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下，和/或其中树脂层具有直径为1μm的通孔 以上且25μm以下; 导电层在通孔内; 通孔内侧的树脂层的表面的算术平均粗糙度（Ra）为0.05μm以上且0.45μm以下。 树脂组合物包含无机填料和热固性树脂，其中无机填料含有直径大于2μm的粗颗粒的量在500ppm以下。 树脂片包括树脂层和基材，其中树脂层在基材上并包含树脂组合物。

    EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
    3.
    发明申请
    EPOXY RESIN COMPOSITION, RESIN SHEET, PREPREG, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE 有权
    环氧树脂组合物，树脂片，PREPREG，多层印刷线路板和半导体器件

    公开(公告)号：US20110007489A1

    公开(公告)日：2011-01-13

    申请号：US12921401

    申请日：2009-03-24

    申请人： Noriyuki Ohigashi ,  Michio Kimura ,  Haruo Murakami

    发明人： Noriyuki Ohigashi ,  Michio Kimura ,  Haruo Murakami

    IPC分类号： H05K7/00 ,  C08L61/00 ,  C08L63/00 ,  C08K3/34 ,  C08K3/22 ,  B32B27/04 ,  H05K1/00

    CPC分类号： H05K1/0326 ,  C08G59/3218 ,  C08G59/5073 ,  C08G2650/56 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/00 ,  C08K3/013 ,  C08K5/3445 ,  C08L63/00 ,  C08L71/00 ,  H05K3/4626 ,  Y10T156/10 ,  Y10T428/31525 ,  C08L2666/22

    摘要： An object of the present invention is to provide an epoxy resin composition that provides, when used for an insulation layer of a multilayer printed wiring board, a multilayer printed wiring board which is excellent in plating adhesion, heat resistance and moisture resistance reliability and capable of forming fine wiring. Another object of the present invention is to provide a resin sheet, a prepreg, a method for producing a multilayer printed wiring board, a multilayer printed wiring board and a semiconductor device.These objects are achieved by an epoxy resin composition comprising (A) an epoxy resin, (B) a phenoxy resin having a specific bisphenol acetophenone structure and (C) a curing agent, wherein the content of the phenoxy resin (B) is 10 to 30% by weight of the total solid content of the resin composition.

    摘要翻译： 本发明的目的在于提供一种环氧树脂组合物，其用于多层印刷线路板的绝缘层时，具有优异的电镀粘附性，耐热性和耐湿可靠性的多层印刷线路板，并能够 形成精细布线。 本发明的另一个目的是提供一种树脂片，预浸料，多层印刷线路板的制造方法，多层印刷线路板和半导体器件。 这些目的是通过包含（A）环氧树脂，（B）具有特定的双酚苯乙酮结构的苯氧基树脂和（C）固化剂）的环氧树脂组合物来实现的，其中苯氧基树脂（B）的含量为10〜 30重量％的树脂组合物的总固体含量。

    Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate
    6.
    发明授权
    Insulating resin sheet laminate and multi-layer printed circuit board including insulating resin sheet laminate 失效
    绝缘树脂板层压板和包括绝缘树脂板层压板的多层印刷电路板

    公开(公告)号：US08357859B2

    公开(公告)日：2013-01-22

    申请号：US12523127

    申请日：2008-01-16

    申请人： Hiroaki Wakabayashi ,  Noriyuki Ohigashi

    发明人： Hiroaki Wakabayashi ,  Noriyuki Ohigashi

    IPC分类号： H05K1/00

    CPC分类号： H05K3/4655 ,  C08F220/18 ,  C08L33/064 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/12 ,  Y10T428/264 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31786 ,  Y10T428/31935

    摘要： Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

    摘要翻译： 公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层 金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。 本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂 。

    PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE
    8.
    发明申请
    PREPREG, WIRING BOARD, AND SEMICONDUCTOR DEVICE 审中-公开
    PREPREG，接线板和半导体器件

    公开(公告)号：US20130105200A1

    公开(公告)日：2013-05-02

    申请号：US13807254

    申请日：2011-06-29

    申请人： Noriyuki Ohigashi ,  Tadasuke Endo

    发明人： Noriyuki Ohigashi ,  Tadasuke Endo

    IPC分类号： B32B19/02 ,  H05K1/02

    CPC分类号： B32B19/02 ,  B32B17/04 ,  C08J5/24 ,  C08J2363/00 ,  H01L2224/16227 ,  H05K1/02 ,  H05K1/0366 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/029 ,  H05K2201/0358 ,  Y10T428/24355 ,  Y10T428/2495 ,  Y10T428/252

    摘要： An object of the invention is to provide a prepreg which can be thinner, and has both surfaces which have different application, function, performance or properties to each other, one of which has excellent adhesion to the conductive layer, and the conductive layer which is in contact with the one surface of the prepreg can form a fine circuit, and the present invention provides a prepreg including a core layer containing a fibrous base, a first resin layer which is formed on one surface of the core layer, a second layer which is formed on the other surface of the core layer, and a carrier film which is selected from the group consisting of a metal foil and a resin film and which is laminated on at least one of the surfaces of the first resin layer and the second resin layer, wherein the first resin layer contains a first epoxy resin composition containing silica nanoparticles having an average particle diameter of 1 to 100 nm; a thermoplastic resin selected from the group consisting of a polyimide resin, a polyamide resin, a phenoxy resin, a polyphenylene oxide resin, and a polyether sulfone resin; and an epoxy resin, and the first resin layer is in contact with the fibrous base or a part of the first resin layer is infiltrated into the fibrous base; the second resin layer contains a second epoxy resin composition containing an inorganic filler, and an epoxy resin, and a part of the second resin layer is infiltrated into the fibrous base.

    摘要翻译： 本发明的目的是提供一种可以更薄的预浸料，并且具有彼此具有不同应用，功能，性能或性质的两个表面，其中一个对导电层具有优异的粘附性，导电层是 与预浸料坯的一个表面接触可以形成微细电路，本发明提供一种预浸料坯，其包括含有纤维基材的芯层，形成在芯层的一个表面上的第一树脂层，第二层， 形成在芯层的另一个表面上，并且载体膜选自金属箔和树脂膜，并且层压在第一树脂层和第二树脂的至少一个表面上 层，其中所述第一树脂层含有含有平均粒径为1〜100nm的二氧化硅纳米粒子的第一环氧树脂组合物; 选自聚酰亚胺树脂，聚酰胺树脂，苯氧基树脂，聚苯醚树脂和聚醚砜树脂的热塑性树脂; 和环氧树脂，所述第一树脂层与所述纤维基部接触，或者所述第一树脂层的一部分渗透到所述纤维基材中; 第二树脂层含有含有无机填料的第二环氧树脂组合物和环氧树脂，第二树脂层的一部分渗透到纤维基材中。