Roll-to-roll processing method and tools for electroless deposition of thin layers
    1.
    发明授权
    Roll-to-roll processing method and tools for electroless deposition of thin layers 失效
    卷对卷加工方法和薄层无电沉积工具

    公开(公告)号:US08497152B2

    公开(公告)日:2013-07-30

    申请号:US12581787

    申请日:2009-10-19

    申请人: Jalal Ashjaee

    发明人: Jalal Ashjaee

    IPC分类号: H01L51/40

    摘要: A deposition method and a system are provided to deposit a CdS buffer layer on a surface of a solar cell absorber layer of a flexible workpiece from a process solution including all chemical components of the CdS buffer layer material. CdS is deposited from the deposition solution while the flexible workpiece is elastically shaped by a series of shaping rollers to retain the process solution on the solar cell absorber layer and while the flexible workpiece is heated by contacting to a heated liquid that the shaping rollers are fully or partially immersed. The flexible workpiece is elastically shaped by pulling a back surface of the flexible workpiece into surface cavity of the shaping rollers using magnetic force.

    摘要翻译: 提供沉积方法和系统以从包括CdS缓冲层材料的所有化学成分的处理溶液中在柔性工件的太阳能电池吸收体层的表面上沉积CdS缓冲层。 CdS从沉积溶液沉积,而柔性工件通过一系列成型辊弹性成形,以将工艺溶液保持在太阳能电池吸收层上,同时柔性工件通过与成型辊完全相互接触的加热液体加热 或部分浸没。 柔性工件通过使用磁力将柔性工件的后表面拉到成型辊的表面腔中来弹性成形。

    Method of sealing wafer backside for full-face electrochemical plating
    4.
    发明授权
    Method of sealing wafer backside for full-face electrochemical plating 失效
    用于全面电化学电镀的晶片背面密封方法

    公开(公告)号:US06855037B2

    公开(公告)日:2005-02-15

    申请号:US09910686

    申请日:2001-07-20

    摘要: The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

    摘要翻译: 本发明提供了一种晶片载体,其包括沿着晶片载体的周边设置的开口,其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中,使用多个同心密封构件来证明更好的密封,并且外部密封件优选地是独立地可移动的,以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

    Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
    5.
    发明授权
    Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing 有权
    用于全面电镀或电解抛光的与晶片表面电接触的方法和装置

    公开(公告)号:US06482307B2

    公开(公告)日:2002-11-19

    申请号:US09735546

    申请日:2000-12-14

    IPC分类号: C25D518

    摘要: Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.

    摘要翻译: 通过提供具有面向晶片正面的阳极区域的阳极和将晶片正面与至少一个电气电连接来进行导电材料沉积在半导体晶片的晶片正面上或从晶片正面去除导电材料 通过将电接触和晶片正面推动到彼此靠近来接触阳极区域外部。 在阳极和电接触之间施加电势,并且晶片相对于阳极和电触点移动。 因此允许在整个晶片正面侧面上进行全面电镀或电解抛光。

    Method and apparatus for stringing thin film solar cells
    6.
    发明授权
    Method and apparatus for stringing thin film solar cells 有权
    串联薄膜太阳能电池的方法和装置

    公开(公告)号:US08016007B2

    公开(公告)日:2011-09-13

    申请号:US12698903

    申请日:2010-02-02

    IPC分类号: B32B37/00

    摘要: The present inventions generally relate to thin film solar cell fabrication, and more particularly, to techniques for interconnecting solar cells based on Group IBIIIAVIA thin film semiconductors. In a particular embodiment, a system is described that positions solar cells and conductive leads with respect to each other so that application of a conductive adhesive and formation of an assembled solar cell string, followed by curing and cooling of the conductive adhesive, can occur in a repeatable manner.

    摘要翻译: 本发明一般涉及薄膜太阳能电池制造,更具体地涉及基于IBIIIAVIA薄膜半导体的用于互连太阳能电池的技术。 在具体实施例中,描述了一种系统,其将太阳能电池和导电引线相对于彼此定位,使得导电粘合剂的应用和组装的太阳能电池串的形成,随后导电粘合剂的固化和冷却可以发生在 一个可重复的方式。

    Integrated system for processing semiconductor wafers
    8.
    发明授权
    Integrated system for processing semiconductor wafers 有权
    用于处理半导体晶圆的集成系统

    公开(公告)号:US06953392B2

    公开(公告)日:2005-10-11

    申请号:US09795687

    申请日:2001-02-27

    摘要: An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system also has a wafer handling subsystem for transporting each of the wafers into or out of the appropriate one of the plurality of processing subsystems. The plurality of processing subsystems and wafer handling subsystem form an integrated system.

    摘要翻译: 提供了一种用于处理具有导电前表面的多个晶片的集成系统。 该系统包括用于从晶片的前表面沉积或从金属表面去除金属的多个处理子系统。 每个处理子系统包括处理室和清洁室。 该系统还具有晶片处理子系统,用于将每个晶片传送到多个处理子系统中的适当的一个处理子系统中或从其中移出。 多个处理子系统和晶片处理子系统形成集成系统。