公开(公告)号：US20060033200A1

公开(公告)日：2006-02-16

申请号：US11198135

申请日：2005-08-08

申请人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

发明人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/053

CPC分类号： H01L21/50 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.

摘要翻译： 在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合， 连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及 内部部分和外部部分中的一个相对于另一个突出。

公开(公告)号：US07218002B2

公开(公告)日：2007-05-15

申请号：US11030288

申请日：2005-01-07

申请人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

发明人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC分类号： H01L23/04

CPC分类号： H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00014

摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

摘要翻译： 本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极 并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。 此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。 外部电极的表面暴露在斜面上。

公开(公告)号：US20050151247A1

公开(公告)日：2005-07-14

申请号：US11030288

申请日：2005-01-07

申请人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

发明人： Natsuyo Nagano ,  Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC分类号： H01L23/12 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H01L23/34

CPC分类号： H01L23/49805 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/09154 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00014

摘要： The present invention provides an electronic device comprising a base substrate to be surface-mounted on a circuit board, one or more electronic component elements mounted on a surface of the base substrate and/or therein, an external electrode provided on an end portion of the base substrate and in the form of a post perpendicular to a rear surface of the base substrate for connecting the one or more electronic component elements to the circuit board. Furthermore, the base substrate is provided on its end portion with a slope crossing a side surface and a rear surface of the base substrate. A surface of the external electrode is exposed on the slope.

摘要翻译： 本发明提供一种电子装置，其特征在于，具备：表面安装在电路基板上的基底基板，安装在所述基板的表面上的一个或多个电子元件元件和/或其内部设置在所述基板的端部的外部电极 并且以垂直于基底基板的后表面的柱的形式，用于将一个或多个电子元件连接到电路板。 此外，基底在其端部设置有与基底的侧面和背面交叉的斜面。 外部电极的表面暴露在斜面上。

公开(公告)号：US07432590B2

公开(公告)日：2008-10-07

申请号：US11198135

申请日：2005-08-08

申请人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

发明人： Natsuyo Nagano ,  Takashi Ogura ,  Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/12 ,  H01L23/48

CPC分类号： H01L21/50 ,  H01L21/4807 ,  H01L23/13 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a ceramic package including one or more ceramic layers and being capable of having an electronic component and a lid fixed to a surface thereof, a surface of a ceramic layer having a sealing electrode for joining the lid through a sealing member and a pad to be connected to input and output electrodes and/or a ground electrode of the electronic component is divided into an inner portion having the pad and an outer portion having the sealing electrode with a stepped side wall as a border for preventing the sealing member from flowing, and one of the inner portion and the outer portion projects relative to the other.

摘要翻译： 在包括一个或多个陶瓷层并且能够将电子部件和固定在其表面上的盖的陶瓷封装中的陶瓷层的表面上，具有密封电极的表面，所述密封电极用于通过密封构件和垫将盖接合， 连接到电子部件的输入和输出电极和/或接地电极被分成具有焊盘的内部部分和具有密封电极的外部部分，其具有阶梯状侧壁作为防止密封部件流动的边界，以及 内部部分和外部部分中的一个相对于另一个突出。

公开(公告)号：US20050141396A1

公开(公告)日：2005-06-30

申请号：US11019615

申请日：2004-12-23

申请人： Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

发明人： Masanori Hongo ,  Masami Fukuyama ,  Takashi Ogura

IPC分类号： G11B11/00 ,  H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

摘要： The present invention provides a package for light emitting element having a base substrate and a frame body mounted on an upper surface of the base substrate to form a cavity for housing a light emitting element therein. The frame body has an inner peripheral surface formed with a first reflecting layer. Furthermore, the base substrate has an upper surface formed with a pair of land layers for mounting the light emitting element thereon. One of the land layers has an outer peripheral portion connected to a lower end portion of the reflecting layer. The other land layer includes an exposure portion exposed on the upper surface of the base substrate, and a buried portion buried inside the base substrate. Further, the base substrate has a second reflecting layer formed below an area exposed on the bottom surface of the cavity.

摘要翻译： 本发明提供了一种用于发光元件的封装，其具有基底基板和安装在基底基板的上表面上的框体，以形成用于将发光元件容纳在其中的空腔。 框体具有形成有第一反射层的内周面。 此外，基底基板具有形成有用于将发光元件安装在其上的一对接地层的上表面。 一个接地层具有连接到反射层的下端部的外周部。 另一个地面层包括暴露在基底基板的上表面上的曝光部分和埋在基底内的掩埋部分。 此外，基底基板具有形成在暴露在空腔的底表面上的区域下方的第二反射层。

公开(公告)号：US20100213811A1

公开(公告)日：2010-08-26

申请号：US12708868

申请日：2010-02-19

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H01J1/88 ,  C03B29/00

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

摘要： The package for a light emitting element according to the present invention comprises a base substrate made of ceramic including glass, and a frame body made of ceramic. The frame body is arranged on a top surface of the base substrate and provided therein with a cavity for accommodating the light emitting element. A part of the glass included in the base substrate is precipitated in an area of the top surface of the base substrate, which is a bottom surface of the cavity, and a crystallinity degree of the precipitated glass is greater than 3%. In the manufacturing method of the package according to the present invention, a ceramic body which is to be the package is fired at a temperature of 840 degrees C. or higher and lower than 950 degrees C.

摘要翻译： 根据本发明的用于发光元件的封装包括由包括玻璃的陶瓷制成的基底基板和由陶瓷制成的框体。 框架主体布置在基底基板的顶表面上并且在其中设置有用于容纳发光元件的空腔。 包括在基底中的玻璃的一部分在作为空腔底面的基底基板的上表面的区域中析出，析出玻璃的结晶度大于3％。 在根据本发明的包装的制造方法中，作为包装的陶瓷体在840℃以上且低于950℃的温度下烧成。

公开(公告)号：US20100182791A1

公开(公告)日：2010-07-22

申请号：US12688227

申请日：2010-01-15

申请人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Takuma Hitomi ,  Masanori Hongo ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： F21V7/00 ,  F21V19/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/48227

摘要： In a package for a light emitting element according to the present invention, a light reflecting plate is buried in a base substrate at a position below a cavity with a light reflecting surface thereof facing upward, a part of the ceramic forming the base substrate is interposed between the light reflecting surface of the light reflecting plate and a top surface of the base substrate, and at least the part is light-transmitting. A light emitting device comprises the package, and the light emitting element accommodated in the cavity of the package. In another light emitting device, a first reflector which is made of a metal material and reflects a light emitted from the light emitting element is buried in a frame body.

摘要翻译： 在根据本发明的发光元件的封装中，将光反射板埋在基板的位于空腔下方的位置，其光反射面朝上，形成基板的陶瓷的一部分插入 在所述光反射板的光反射表面和所述基底基板的顶表面之间，并且至少所述部分是透光的。 发光器件包括封装，并且发光元件容纳在封装的空腔中。 在另一发光器件中，由金属材料制成并将从发光元件发出的光反射的第一反射器被埋入框架体中。

公开(公告)号：US20100246135A1

公开(公告)日：2010-09-30

申请号：US12731827

申请日：2010-03-25

申请人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

发明人： Masanori Hongo ,  Takuma Hitomi ,  Hideki Ito ,  Kiyoshi Yamakoshi ,  Masami Fukuyama ,  Hideki Takagi

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L23/12 ,  H01L23/49805 ,  H01L23/49822 ,  H01L24/45 ,  H01L24/48 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device of the present invention includes: a base made of a ceramic material; an electronic device element arranged in a central area of the upper surface of the base, in a way that the electronic device element is placed on a first heat transfer layer; a first heat dissipation layer formed in a central area of the lower surface of the base; a plurality of thermal vias arranged in the base, and which connects the first heat transfer layer and the first heat dissipation layer; and a second heat transfer layer buried in the base, the second heat transfer layer crossing the plurality of thermal vias, while extending from a position above a central area of the lower surface of the base to a position above a peripheral area of the lower surface of the base.

摘要翻译： 本发明的电子设备包括：由陶瓷材料制成的基座; 电子器件元件，其布置在所述基座的上表面的中心区域中，以使得所述电子器件元件被放置在第一传热层上; 第一散热层，形成在所述基部的下表面的中心区域; 多个热通孔，其布置在所述基座中，并且连接所述第一传热层和所述第一散热层; 以及第二传热层，所述第二传热层与所述多个热通孔交叉，同时从所述基部的下表面的中心区域上方的位置延伸到所述下表面的周边区域的上​​方 的基地。

公开(公告)号：US20060220205A1

公开(公告)日：2006-10-05

申请号：US11374138

申请日：2006-03-14

申请人： Masanori Hongo ,  Masami Fukuyama

发明人： Masanori Hongo ,  Masami Fukuyama

IPC分类号： H01L23/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

摘要： A package of the present invention has a laminate structure formed by laminating a plurality of ceramic layers, and has a mount surface to be a joint surface when mounted on a mother board, defined parallel with the laminating direction. A first ceramic layer has a recess with an L-shaped cross section across the mount surface and a side surface, defined at each end thereof in a direction perpendicular to the laminating direction, and an external electrode formed on each recess, the external electrode having a surface thereof exposed to the mount surface.

摘要翻译： 本发明的封装具有通过层叠多个陶瓷层而形成的层叠结构，并且在与层叠方向平行地限定在安装在母板上时具有作为接合面的安装面。 第一陶瓷层具有穿过安装表面的L形横截面的凹部和在其每个端部沿与层叠方向垂直的方向限定的侧表面和形成在每个凹部上的外部电极，所述外部电极具有 其表面暴露于安装表面。

公开(公告)号：US20060220233A1

公开(公告)日：2006-10-05

申请号：US11389330

申请日：2006-03-27

申请人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

发明人： Hideki Ito ,  Masanori Hongo ,  Masami Fukuyama ,  Hiroyuki Taguchi ,  Hideki Takagi

IPC分类号： H01L23/34

CPC分类号： H05K3/3442 ,  H01L21/4857 ,  H01L23/15 ,  H01L23/49805 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H05K2201/09472 ,  H05K2201/09845 ,  H05K2201/10106 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

摘要： A package of the present invention has a laminate structure of a plurality of ceramic layers, and includes a cavity for housing a light emitting element. A mount surface is defined on a side surface parallel with the depth direction of the cavity. A pair of external electrodes each including a charged electrode portion and a coated electrode portion are formed over the entire length in the laminating direction at two corners defined by intersection of the mount surface and two side surfaces perpendicular to the mount surface. When the package is mounted, a pair of charged electrode portions and a pair of coated electrode portions are soldered to a surface of a substrate.

摘要翻译： 本发明的封装具有多个陶瓷层的叠层结构，并且包括用于容纳发光元件的空腔。 安装表面限定在与空腔的深度方向平行的侧表面上。 在安装面和与安装面垂直的两个侧面的交点形成的两个角处，在层叠方向的整个长度上形成有一对包含带电电极部分和涂覆电极部分的外部电极。 当安装封装时，将一对充电电极部分和一对涂覆的电极部分焊接到基板的表面。