公开(公告)号：US4866108A

公开(公告)日：1989-09-12

申请号：US144909

申请日：1988-01-19

申请人： David J. Vachon ,  Ralph D. Hermansen ,  Steven E. Lau

发明人： David J. Vachon ,  Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/22 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30

CPC分类号： H05K3/305 ,  C08G59/226 ,  C09J163/00 ,  H05K1/0203 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/1443 ,  Y10T428/24967

摘要： A flexible epoxy adhesive composition comprising a mixture of a fatty acid modified epoxy resin and an oxypropylene epoxy resin in the ratio of about 1:3 to 1:1. The adhesive paste also includes a stoichiometric amount of a polyamine curing agent, 1 to 20 total liquid weight percent of a plasticizer and 1 to 5 weight percent of microfine silicon dioxide particles. Fillers, such as aluminum oxide and glass beads, are optionally added. This adhesive paste is particularly well suited for use as a flat pack adhesive to provide a releasable bond and is also well suited for use in space applications.

摘要翻译： 一种柔性环氧粘合剂组合物，其包含脂肪酸改性环氧树脂和氧丙烯环氧树脂的混合物，其比例为约1:3至1:1。 粘合剂糊料还包括化学计量的多胺固化剂，1至20的总液体重量百分比的增塑剂和1至5重量％的微细二氧化硅颗粒。 任选地加入填料，例如氧化铝和玻璃珠。 该粘合剂糊剂特别适合用作扁平包装粘合剂以提供可释放的粘合剂，并且也非常适合用于空间应用。

公开(公告)号：US5385966A

公开(公告)日：1995-01-31

申请号：US188667

申请日：1994-01-28

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08L75/04 ,  C08K3/00 ,  C08K9/06 ,  C08L75/00 ,  C09J175/00 ,  C09J175/04 ,  C09J175/14 ,  C09K3/10 ,  C08J3/20 ,  C08K3/26 ,  C08F8/30

CPC分类号： C09K3/1021 ,  C08K3/0033 ,  C08K9/06 ,  C09J175/04 ,  C09J175/14 ,  C09K2003/1071 ,  C09K2200/0213 ,  C09K2200/0243 ,  C09K2200/0247 ,  Y10S525/92

摘要： Adhesives and sealants, based on polyurethane reactants, are provided. The one-component frozen premix material of the invention comprises: (a) up to about 60 vol % of at least one filler; (b) about 0.5 to 5 wt % of a thixotrope comprising hydrophobic fumed silica; and (c) the balance a urethane matrix. The urethane matrix comprises at least one polyol that includes at least one carbon-carbon double bond in its backbone and has less than 20 wt % of ether and ester moieties, at least one aliphatic polyisocyanate in stoichiometric amount relative to the polyol, and about 0.01 to 0.1 wt % of an organo-metallic catalyst. The urethanes of the invention can be stored as one-component, frozen, premix materials for a minimum of three months, and, when thawed, can be applied with a spatula or trowel to form non-sag fillets. The cured elastomers are free of voids, tears, or bubbles.

摘要翻译： 提供基于聚氨酯反应物的粘合剂和密封剂。 本发明的单组分冷冻预混材料包括：（a）至多约60vol％的至少一种填料; （b）约0.5至5重量％的包含疏水性热解法二氧化硅的触变剂; 和（c）氨基甲酸酯基质的平衡。 氨基甲酸酯基质包括至少一种多元醇，其多元醇在其主链中包含至少一个碳 - 碳双键，并且具有少于20重量％的醚和酯部分，至少一种相对于多元醇的化学计量的脂族多异氰酸酯和约0.01 至0.1重量％的有机金属催化剂。 本发明的氨基甲酸酯可以作为单组分的冷冻预混材料储存至少三个月，并且当解冻时，可以用刮刀或t刀施用以形成非下垂的鱼片。 固化的弹性体没有空隙，眼泪或气泡。

公开(公告)号：US5965673A

公开(公告)日：1999-10-12

申请号：US835671

申请日：1997-04-10

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/06 ,  C08G59/08 ,  C08G59/40 ,  C08L63/00 ,  C08K3/36 ,  C08L63/02 ,  C08L63/04

CPC分类号： C08G59/4042 ,  C08G59/066 ,  C08G59/08

摘要： A solid, one-component, flexible epoxy-based composition and method for making the same are provided. The present compositions comprise: (a) an epoxy-terminated prepolymer formed by reacting at least four moles of a polyepoxide resin with approximately one mole of a diamine compound, wherein at least one of the polyepoxide resin and diamine compound is solid at room temperature, and wherein the prepolymer is rheologically stable for weeks as a single component mixture at room temperature and, and (b) a substantially stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a heat-curable, latent epoxy resin curing agent and a room temperature-curable ketimine curing agent. Optional components include thixotropic agents, diluents, fillers, anti-oxidants, and processing aids. The present uncured epoxy-based compositions upon cure, exhibit a durometer Shore D of less than about 45 (or a durometer Shore A of less than about 100).

摘要翻译： 提供固体，单组分，柔性环氧基组合物及其制备方法。 本发明的组合物包括：（a）通过使至少四摩尔的聚环氧树脂与约1摩尔的二胺化合物反应形成的环氧基封端的预聚物，其中至少一种聚环氧树脂和二胺化合物在室温下是固体， 并且其中所述预聚物在室温下作为单一组分混合物流变稳定数周，和（b）基本上化学计量的环氧树脂固化剂，其选自可热固化的潜在环氧树脂固化剂和 室温固化的酮亚胺固化剂。 任选组分包括触变剂，稀释剂，填充剂，抗氧化剂和加工助剂。 目前未固化的环氧基组合物在固化时表现出小于约45的肖氏硬度（或肖氏A的硬度小于约100）。

公开(公告)号：US06723803B1

公开(公告)日：2004-04-20

申请号：US08700133

申请日：1996-08-20

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G5940

CPC分类号： C08G59/4035 ,  C08G59/20 ,  C08G59/22 ,  C09J163/00

摘要： Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

摘要翻译： 在未固化状态下在室温下保持稳定的柔性环氧基粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种硬度不超过硬度的肖氏D读数为45的柔性聚环氧树脂（ “DETA”）; 和（b）基本上化学计量的至少一种潜在环氧树脂固化剂。 任选地，粘合剂组合物还可以掺入一种或多种半柔性树脂。 其它任选的组分包括填料，触变剂和增韧剂。 粘合剂组合物提供环氧基粘合剂组合物，其可在室温下作为单一组分混合物储存数周，可在不到两小时内在约100℃至125℃的温度范围内固化，并且在固化至 温度低至零下50摄氏度，表现出肖氏A的硬度小于约95。

公开(公告)号：US6060539A

公开(公告)日：2000-05-09

申请号：US877980

申请日：1997-06-18

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/18 ,  C08G59/20 ,  C08G59/40 ,  C08K3/22 ,  C08K3/34 ,  C08K3/38 ,  C09J163/00 ,  C08K3/28

CPC分类号： C08K3/34 ,  C08G59/184 ,  C08G59/20 ,  C08G59/4035 ,  C08K3/22 ,  C08K3/38 ,  C09J163/00

摘要： A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).

摘要翻译： 提供柔性导热性环氧系粘合剂组合物及其制造方法。 本发明的粘合剂组合物包含（a）当用化学计量的二亚乙基三胺（“DETA”）固化时，包含至少一种硬度不超过约45的硬度的肖氏D读数的聚环氧树脂的聚合物混合物和基本上化学计量 至少一种潜在环氧树脂固化剂的量; 和（b）导热填料。 可选组分包括二级环氧树脂，非反应性增韧剂，稀释剂和加工助剂。 本粘合剂组合物在室温下流变稳定数周或甚至几个月，并且在约100℃至140℃的温度下在少于1小时内可固化，因此固化的粘合剂组合物显示硬度为肖氏A 小于约90，热导率超过0.4BTU / hr-ft-°F（0.7W / mK）。

公开(公告)号：US5457165A

公开(公告)日：1995-10-10

申请号：US928885

申请日：1992-08-12

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/22 ,  C08G59/50 ,  C08L63/00 ,  C08L77/06

CPC分类号： C08L63/00 ,  C08G59/226 ,  C08G59/50

摘要： Encapsulant compositions which provide both dry heat and humid heat stability comprise:(a) a first liquid epoxy resin comprising either:(1) the diglycidyl ether of polyoxypropylene glycol; or(2) the diglycidyl ester of linoleic dimer acid;(b) a second liquid epoxy resin comprising the diglycidyl ether of 1,4-butanediol, present in the amount of about 12 to 55 parts by weight of said composition; and(c) a stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a flexibilized polyamine and a flexibilized polyamide.

摘要翻译： 提供干热和湿热稳定性的封装组合物包括：（a）第一液体环氧树脂，其包含：（1）聚氧丙烯二醇的二缩水甘油醚; 或（2）亚油酸二聚酸的二缩水甘油酯; （b）包含1,4-丁二醇的二缩水甘油醚的第二液体环氧树脂，其量为所述组合物的约12至55重量份; 和（c）化学计量的环氧树脂固化剂，其选自柔性聚胺和柔性聚酰胺。

公开(公告)号：US5350779A

公开(公告)日：1994-09-27

申请号：US85244

申请日：1993-06-29

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/50 ,  H01B3/40 ,  C08L63/02

CPC分类号： C08G59/5026 ,  H01B3/40

摘要： Epoxy-type impregnating compounds, which are useful for electrical potting or encapsulation, plastic tooling, and fiber-reinforced composites, comprise a resin component and a stoichiometric amount of a curative and have a curing temperature of less than about 120.degree. F. (49.degree. C.). The resin component is the diglycidyl ether of bisphenol A, either alone or as a mixture with up to about 15 wt % of at least one reactive monoepoxide diluent or up to about 50 wt % of at least one reactive diepoxide diluent, the diluent having a viscosity of less than about 200 cp. The curative is a mixture of cycloaliphatic diamines, comprising from about 20 to 80 wt % of at least one sterically-hindered cycloaliphatic diamine and the balance at least one sterically-unhindered cycloaliphatic diamine. These epoxy compounds are unique because they can be handled in relatively large bulk without concern for dangerous runaway exotherms. In addition, they result in useful products with a moderate service temperature range, without the necessity of high temperature cures. The advantages of the low temperature cure are lower residual stress in the cured product, better dimensional control in molding, and lower energy expenditure.

摘要翻译： 可用于电灌封或封装，塑料加工和纤维增强复合材料的环氧型浸渍化合物包含树脂组分和化学计量量的固化剂，其固化温度低于约120°F。（49 DEG）。 树脂组分是双酚A的二缩水甘油醚，单独或作为与至多约15重量％的至少一种反应性单环氧化物稀释剂或至多约50重量％的至少一种反应性二环氧化物稀释剂的混合物，所述稀释剂具有 粘度小于约200cp。 固化剂是脂环族二胺的混合物，其包含约20至80重量％的至少一个空间位阻环脂族二胺，余量至少一个空间不受阻碍的脂环族二胺。 这些环氧化合物是独特的，因为它们可以在相当大的体积下处理，而不用担心危险的放电放电。 此外，它们产生具有适中的使用温度范围的有用产品，而不需要高温固化。 低温固化的优点是固化产物残留应力较低，成型时尺寸控制更好，能耗更低。

公开(公告)号：US5929141A

公开(公告)日：1999-07-27

申请号：US901153

申请日：1997-07-28

申请人： Steven E. Lau ,  Deborah S. Huff ,  Ralph D. Hermansen ,  E. Dean Johnston

发明人： Steven E. Lau ,  Deborah S. Huff ,  Ralph D. Hermansen ,  E. Dean Johnston

IPC分类号： C08G59/22 ,  C08G59/50 ,  C09J9/02 ,  C09J163/00 ,  H05K3/32 ,  C08K3/08

CPC分类号： H05K3/321 ,  C08G59/22 ,  C08G59/50 ,  C09J163/00 ,  H05K2201/0133

摘要： A flexible, electrically-conductive, one-component epoxy adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45 when cured with a stoichiometric amount of diethylene triamine; (b) a substantially stoichiometric amount of curing agent including at least one amine-terminated butadiene-acrylonitrile polymer; and (c) an electrically-conductive filler. The epoxy adhesive, upon cure, has a volume resistivity not exceeding about 10.sup.-3 ohm-cm at room temperature and a drop resistance such that a 6-mil-thick (0.015 cm) bond effected by the adhesive can withstand at least six 60-inch (152 cm) drops onto a hard surface. Optional components in the epoxy adhesive include secondary rigid and semi-rigid epoxy resins, secondary amine curing agents, non-reactive flexibilizers, diluents, and processing aids. The adhesive bonds achieved using these epoxy adhesives are non-brittle, flexible, resilient, and drop-resistant, while also exhibiting strong adhesion and good processing characteristics.

摘要翻译： 提供柔性导电的单组分环氧粘合剂组合物及其制备方法。 本发明的粘合剂组合物包含：（a）当化学计量量的二亚乙基三胺固化时，至少一种聚环氧树脂的硬度不超过肖氏D读数约45; （b）基本上化学计量的固化剂，包括至少一种胺封端的丁二烯 - 丙烯腈聚合物; 和（c）导电填料。 环氧树脂粘合剂在固化时的体积电阻率在室温下不超过约10-3欧姆 - 厘米，并且具有防滴落性，使得由粘合剂实现的6密耳厚（0.015cm）的粘合剂能够承受至少六个60 -inch（152厘米）滴在硬表面上。 环氧树脂粘合剂中的任选组分包括二级刚性和半刚性环氧树脂，仲胺固化剂，非反应性增韧剂，稀释剂和加工助剂。 使用这些环氧树脂粘合剂的粘合剂粘合剂是非脆性的，柔性的，有弹性的和防滴落的，同时还具有很强的附着力和良好的加工特性。

公开(公告)号：US5575956A

公开(公告)日：1996-11-19

申请号：US504002

申请日：1995-07-19

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/22 ,  C08G59/32 ,  C08G59/36 ,  C08G59/38 ,  C08G59/50 ,  C08G59/56 ,  C08K3/08 ,  C08L63/04 ,  C09J9/02 ,  C09J163/00 ,  C09J163/04 ,  H01B1/20 ,  H01B1/22

CPC分类号： H01B1/22

摘要： A flexible electrically-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises: (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore A reading of 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) an electrically-conductive filler comprising a metal. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks as a single component mixture at room temperature and is curable in less than two hours at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than 95 and a volume resistivity less than about 10.sup.-2 ohm-cm at room temperature.

摘要翻译： 提供柔性导电性环氧类粘合剂组合物及其制造方法。 本发明的粘合剂组合物包括：（a）当用化学计量量的二亚乙基三胺（“DETA”）固化时，包含至少一种硬度不超过硬度的肖氏A读数为45的聚环氧树脂的聚合物混合物和基本上化学计量 至少一种潜在环氧树脂固化剂的量; 和（b）包含金属的导电填料。 可选组分包括二级环氧树脂，非反应性增韧剂，稀释剂和加工助剂。 本粘合剂组合物在室温下作为单一组分混合物流变稳定了几周，并且在约100℃至140℃的温度下在少于两小时内可固化，于是固化的粘合剂组合物显示出硬度为Shore A小于95，体积电阻率小于约10-2欧姆 - 厘米。

公开(公告)号：US5367006A

公开(公告)日：1994-11-22

申请号：US178341

申请日：1994-01-06

申请人： Ralph D. Hermansen ,  Steven E. Lau

发明人： Ralph D. Hermansen ,  Steven E. Lau

IPC分类号： C08G59/18 ,  C08G59/22 ,  C08G59/50 ,  C09J7/00 ,  C09J163/00 ,  H01B3/40 ,  H05K1/02 ,  H05K3/30 ,  C08K3/22 ,  C08K3/36 ,  C09J163/02 ,  C09J163/04 ,  C08G59/08 ,  C08G59/36 ,  C08G59/38

CPC分类号： H05K3/305 ,  C08G59/22 ,  C08G59/5006 ,  C09J163/00 ,  C09J7/00 ,  H01B3/40 ,  H05K1/0203 ,  H05K2201/0209 ,  H05K2203/0528 ,  H05K2203/1105 ,  Y02P70/613

摘要： A superior thermal transfer film adhesive comprises the following composition: (a) at least one aliphatic epoxy resin; (b) a stoichiometric amount of at least one aliphatic polyamine curative; (c) an effective amount of a thixotropic agent, such as fumed silica; and (d) about 20 to 50 volume percent of at least one filler, such as alumina, based on the total of the epoxy resin and the curative. The aliphatic epoxy resin has aliphatic pendant chains of 6 to 20 carbon atoms in length. The curative comprises a long chain aliphatic or cycloaliphatic curing agent for the epoxy resin. Since aliphatic moieties, which are flexible, are used, the glass transition temperature of the resulting cured material is lower than epoxies and plasticizers employing rigid moieties. The adhesive of the invention is novel in attaining high volume resistivity (at least 10.sup.14 ohm-cm at 25.degree. C.), low temperature flexibility (-55.degree. C.), excellent adhesion for maximum thermal transfer, and ease of reworkability.

摘要翻译： 优异的热转印膜粘合剂包含以下组成：（a）至少一种脂族环氧树脂; （b）化学计量的至少一种脂族多胺治疗剂; （c）有效量的触变剂，如热解法二氧化硅; 和（d）约20至50体积％的至少一种填料，例如氧化铝，基于环氧树脂和固化剂的总量。 脂肪族环氧树脂的长度为6〜20个碳原子的脂肪族侧链。 固化剂包括用于环氧树脂的长链脂族或脂环族固化剂。 由于使用柔性的脂肪族部分，所得固化材料的玻璃化转变温度低于采用刚性部分的环氧树脂和增塑剂。 本发明的粘合剂在获得高体积电阻率（25℃时至少1014欧姆 - 厘米），低温柔韧性（-55℃），优异的粘合力以达到最大热转印和易于再加工性方面是新颖的。