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1.发明授权Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices 失效焊盘重路由元件，包括重路由元件的重新路由的半导体器件，以及包括重新路由的半导体器件的组件公开(公告)号：US07423336B2
公开(公告)日：2008-09-09
申请号：US10118366
申请日：2002-04-08
IPC分类号： H01L23/02
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.
摘要翻译： 一种用于半导体器件的重新路由元件，其包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。
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2.发明授权Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices 有权用于设计用于层叠半导体器件组件和用于组装半导体器件的接合焊盘重新路由元件的方法公开(公告)号：US07282397B2
公开(公告)日：2007-10-16
申请号：US11352685
申请日：2006-02-13
IPC分类号： H01L21/00
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device includes a substantially planar member that carries at least one contact location, at least one conductive, at least one rerouted bond pad. The contact location is positioned adjacent to a first periphered edge of the substantially planar member and at a location that corresponds to the location of a bond pad of a semiconductor device with which the rerouting element is to be used. The at least one conductive element, which communicates with the at least one contact location, reroutes the bond pad location of the semiconductor device to a corresponding rerouted bond pad location adjacent to a second one peripheral edge of the rerouted substantially planar member which is opposite the first periphered edge. In addition, assemblies including rerouting elements and methods for designing and using rerouting elements are disclosed.
摘要翻译： 用于半导体器件的重新路由元件包括承载至少一个接触位置的基本上平面的构件，至少一个导电的至少一个重新路由的接合焊盘。 接触位置邻近于基本平坦的构件的第一密封边缘并且位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置。 与至少一个接触位置连通的至少一个导电元件将半导体器件的接合焊盘位置重新路由到与重新路由的基本上平面的部件的第二个周边边缘相邻的相应的重路由接合焊盘位置， 第一个边缘。 此外，公开了包括重新路由元件和用于设计和使用重新路由元件的方法的组件。
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3.发明授权Fabricating a carrier substrate by using a solder resist opening as a combination pin one indicator and fiducial 有权通过使用阻焊开口作为组合销一个指示器和基准来制造载体基板公开(公告)号：US07146720B2
公开(公告)日：2006-12-12
申请号：US10286181
申请日：2002-10-31
申请人： Brad D. Rumsey , Matt E. Schwab
发明人： Brad D. Rumsey , Matt E. Schwab
CPC分类号： H01L24/49 , B33Y10/00 , B33Y80/00 , H01L23/544 , H01L24/45 , H01L24/48 , H01L2223/5442 , H01L2223/54473 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/49175 , H01L2224/49433 , H01L2224/73215 , H01L2224/85207 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H05K1/0266 , H05K3/0008 , H05K3/0052 , H05K3/3452 , H05K2201/0989 , H05K2201/09918 , Y10T29/49121 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , Y10T29/49171 , Y10T29/49172 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate using the combination pin one indicator and alignment fiducial are also described.
摘要翻译： 一种用于形成基准和引脚一指示器的方法，其利用管芯安装基板中的单个阻焊开口来执行现有技术基准和引脚一指示器的组合功能。 还描述了使用组合销一个指示器和对准基准来制造载体衬底的方法。
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4.发明授权Methods for designing bond pad rerouting elements for use in stacked semiconductor device assemblies and for assembling semiconductor devices 有权用于设计用于层叠半导体器件组件和用于组装半导体器件的接合焊盘重新路由元件的方法公开(公告)号：US07094631B2
公开(公告)日：2006-08-22
申请号：US10646420
申请日：2003-08-22
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device that includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.
摘要翻译： 一种用于半导体器件的重新路由元件，其包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。
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5.发明授权公开(公告)号：US07019223B2
公开(公告)日：2006-03-28
申请号：US10285881
申请日：2002-10-31
申请人： Brad D. Rumsey , Matt E. Schwab
发明人： Brad D. Rumsey , Matt E. Schwab
CPC分类号： H01L24/49 , B33Y10/00 , B33Y80/00 , H01L23/544 , H01L24/45 , H01L24/48 , H01L2223/5442 , H01L2223/54473 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/49175 , H01L2224/49433 , H01L2224/73215 , H01L2224/85207 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H05K1/0266 , H05K3/0008 , H05K3/0052 , H05K3/3452 , H05K2201/0989 , H05K2201/09918 , Y10T29/49121 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , Y10T29/49171 , Y10T29/49172 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention features a novel design for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.
摘要翻译： 本发明的特征在于用于形成基准和引脚一指示器的新颖设计，其利用管芯安装衬底中的单个阻焊剂开口来执行现有技术基准和引脚一指示器的组合功能。 还提供了使用组合销一个指示器和本发明的对准基准来制造载体基板并制造半导体器件封装的方法。
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公开(公告)号：US07013559B2
公开(公告)日：2006-03-21
申请号：US10286156
申请日：2002-10-31
申请人： Brad D. Rumsey , Matt E. Schwab
发明人： Brad D. Rumsey , Matt E. Schwab
IPC分类号： H05K3/34
CPC分类号： H01L24/49 , B33Y10/00 , B33Y80/00 , H01L23/544 , H01L24/45 , H01L24/48 , H01L2223/5442 , H01L2223/54473 , H01L2224/05553 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48463 , H01L2224/4847 , H01L2224/4911 , H01L2224/49175 , H01L2224/49433 , H01L2224/73215 , H01L2224/85207 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/3025 , H05K1/0266 , H05K3/0008 , H05K3/0052 , H05K3/3452 , H05K2201/0989 , H05K2201/09918 , Y10T29/49121 , Y10T29/4913 , Y10T29/49133 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , Y10T29/49171 , Y10T29/49172 , Y10T29/49222 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention features a novel design for forming a fiducial and pin one indicator that utilizes a single solder resist opening in a die mounting substrate to perform the combined functions of prior art fiducials and pin one indicators. Methods of fabricating a carrier substrate and fabricating a semiconductor device package using the combination pin one indicator and alignment fiducial of the present invention are also provided.
摘要翻译： 本发明的特征在于用于形成基准和引脚一指示器的新颖设计，其利用管芯安装衬底中的单个阻焊剂开口来执行现有技术基准和引脚一指示器的组合功能。 还提供了使用组合销一个指示器和本发明的对准基准来制造载体基板并制造半导体器件封装的方法。
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7.发明授权Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods 失效用于多芯片模块的路由元件，包括路由元件的多芯片模块和方法公开(公告)号：US06882034B2
公开(公告)日：2005-04-19
申请号：US09942183
申请日：2001-08-29
IPC分类号： H01L23/538 , H05K1/14 , H05K3/30 , H05K3/40 , H01L23/495
CPC分类号： H05K1/141 , H01L23/5385 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/4824 , H01L2224/85399 , H01L2924/00014 , H01L2924/09701 , H01L2924/12044 , H01L2924/19041 , H05K1/147 , H05K3/305 , H05K3/4084 , H05K2201/048 , H05K2203/049 , Y10T29/49124 , Y10T29/49126 , Y10T29/49204 , H01L2224/45015 , H01L2924/207
摘要： A routing element for use with a multichip module includes a substrate that carries conductive traces that provide either additional electrical paths or shorter electrical paths that those provided by a multichip module substrate. The conductive traces may be carried upon a single surface of the routing element substrate, be carried internally by the routing element substrate, or include externally and internally carried portions. The routing element also includes a contact pad positioned at each end of each conductive trace thereof to facilitate electrical connection of each conductive trace to a corresponding terminal of the substrate or to a corresponding bond pad of a semiconductor device of the multichip module. Multichip modules are also disclosed, as are methods for designing the routing element and methods in which the routing element is used.
摘要翻译： 用于多芯片模块的布线元件包括承载导电迹线的衬底，该衬底提供比由多芯片模块衬底提供的电路更多的电路径或更短的电路径。 导电迹线可以承载在路由元件衬底的单个表面上，由路由元件衬底在内部承载，或包括外部和内部承载的部分。 路由元件还包括位于其每个导电迹线的每一端处的接触焊盘，以便于将每个导电迹线电连接到衬底的对应端子或多芯片模块的半导体器件的对应接合焊盘。 还公开了多芯片模块，以及用于设计路由元件的方法和使用路由元件的方法。
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公开(公告)号：US08354301B2
公开(公告)日：2013-01-15
申请号：US12987890
申请日：2011-01-10
CPC分类号： H01L23/538 , H01L21/50 , H01L23/3121 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/1308 , H01L2224/13082 , H01L2224/13144 , H01L2224/16 , H01L2224/81203 , H01L2224/81205 , H01L2224/81801 , H01L2224/8183 , H01L2224/8383 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/13099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap.
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9.发明授权Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices 有权焊盘重路由元件，包括重路由元件的重新路由的半导体器件，以及包括重新路由的半导体器件的组件公开(公告)号：US07944057B2
公开(公告)日：2011-05-17
申请号：US12631230
申请日：2009-12-04
IPC分类号： H01L23/52
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.
摘要翻译： 用于半导体器件的重新路由元件包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。
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10.发明授权Bond pad rerouting element, rerouted semiconductor devices including the rerouting element, and assemblies including the rerouted semiconductor devices 有权焊盘重路由元件，包括重路由元件的重新路由的半导体器件，以及包括重新路由的半导体器件的组件公开(公告)号：US07851922B2
公开(公告)日：2010-12-14
申请号：US12207280
申请日：2008-09-09
IPC分类号： H01L29/40
CPC分类号： H01L25/0657 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06562 , H01L2225/06572 , H01L2225/06586 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H01L2924/30111 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A rerouting element for a semiconductor device includes a dielectric film that carries conductive vias, conductive elements, and contact pads. The conductive vias are positioned at locations that correspond to the locations of bond pads of a semiconductor device with which the rerouting element is to be used. The conductive elements, which communicate with corresponding conductive vias, reroute the bond pad locations to corresponding contact pad locations adjacent to one peripheral edge or two adjacent peripheral edges of the rerouted semiconductor device. The rerouting element is particularly useful for rerouting centrally located bond pads of a semiconductor device, as well as for rerouting the peripheral locations of bond pads of a semiconductor device to one or two adjacent peripheral edges thereof. Methods for designing and using the rerouting element are also disclosed, as are semiconductor device assemblies including one or more rerouting elements.
摘要翻译： 用于半导体器件的重新路由元件包括承载导电通孔，导电元件和接触焊盘的电介质膜。 导电通孔位于对应于要使用重新路由元件的半导体器件的接合焊盘的位置的位置处。 与相应的导电通孔连通的导电元件将接合焊盘位置重新路由到与被重新路由的半导体器件的一个外围边缘或两个相邻外围边缘相邻的相应接触焊盘位置。 重新路由元件对于重新布置半导体器件的中心位置的接合焊盘以及将半导体器件的接合焊盘的外围位置重新路由到其一个或两个相邻的外围边缘是特别有用的。 还公开了用于设计和使用重新路由元件的方法，半导体器件组件包括一个或多个重新布线元件。
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