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    INTEGRATED CIRCUIT PACKAGE SOCKET AND SOCKET CONTACT
    1.
    发明申请
    INTEGRATED CIRCUIT PACKAGE SOCKET AND SOCKET CONTACT 有权
    集成电路插座和插座联系人

    公开(公告)号：US20060216957A1

    公开(公告)日：2006-09-28

    申请号：US11090385

    申请日：2005-03-25

    Applicant: Shawn Lloyd ,  John Oldendorf ,  J. Lewis ,  Michael Kochanowski

    Inventor： Shawn Lloyd ,  John Oldendorf ,  J. Lewis ,  Michael Kochanowski

    IPC: H01R12/00

    CPC classification number: H05K7/1069

    Abstract: An integrated circuit (IC) package socket is provided with an array of single-piece socket contact pins arranged to connect an IC package to a circuit board. The single-piece contact pin is supported at a middle portion of the contact pin and includes two acutely angled bends that allow the two ends of the contact pin to independently resiliently engage the package lands of the IC package and the contact pads of the circuit board. The contact pins are further shaped and arranged to laterally swipe the package lands and contact pads during engagement to scrape away or penetrate through any oxide or other contaminant buildup.

    Abstract translation: 集成电路（IC）封装插座设置有将IC封装连接到电路板的单件式插座触针的阵列。 单件接触销支撑在接触销的中间部分，并且包括两个锐角弯曲部，其允许接触销的两端独立地弹性地接合IC封装的封装焊盘和电路板的接触焊盘 。 接触销进一步成形并布置成在接合期间横向滑动封装焊盘和接触垫，以刮除或穿透任何氧化物或其它污染物积聚。

    Making electrical connections between a circuit board and an integrated circuit
    4.
    发明申请
    Making electrical connections between a circuit board and an integrated circuit 有权
    在电路板和集成电路之间进行电气连接

    公开(公告)号：US20050227509A1

    公开(公告)日：2005-10-13

    申请号：US10822572

    申请日：2004-04-12

    Applicant: Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

    Inventor： Shawn Lloyd ,  John Oldendorf ,  Michael Kochanowski ,  Scott Gilbert

    IPC: H01R12/00 ,  H01R13/24

    CPC classification number: H01R13/2435

    Abstract: A socket may receive both ball grid and land grid array packages. Thus, in some embodiments, the early package prototypes, without solder balls, may be packaged in the same socket design that is ultimately used for production devices using ball grid array packaging. Both land grid array and ball grid arrays may be self-centered on the socket in some embodiments. An S-shaped spring contact may be utilized to electrically connect to either solder balls or lands in a wiping action.

    Abstract translation: 插座可以接收球栅格和平台栅格阵列封装。 因此，在一些实施例中，没有焊球的早期封装原型可以封装在最终用于使用球栅阵列封装的生产设备的相同插座设计中。 在一些实施例中，平台阵列和球栅阵列可以在插座上以自身为中心。 可以使用S形弹簧接触器来以擦拭动作电连接到焊球或焊盘。

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