公开(公告)号：US20110291111A1

公开(公告)日：2011-12-01

申请号：US13206908

申请日：2011-08-10

申请人： Shuichi NAGAI ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

发明人： Shuichi NAGAI ,  Takeshi FUKUDA ,  Hiroyuki SAKAI

IPC分类号： H01L29/161 ,  H01L23/495 ,  H01L21/78

CPC分类号： H01L23/3114 ,  H01L23/10 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H01L2924/1616 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

摘要： A chip size package includes: a radio frequency substrate having a radio frequency semiconductor circuit formed on a principal surface; a semiconductor cover substrate arranged at a position facing the principal surface of the radio frequency substrate; and a joining frame arranged in a manner such as to surround the radio frequency semiconductor circuit between the radio frequency substrate and the semiconductor cover substrate, the joining frame joining the radio frequency substrate and the semiconductor cover substrate, wherein: the radio frequency substrate further has a wire formed on a surface opposite to the principal surface; and the radio frequency semiconductor circuit and the wire are electrically connected to each other through a via hole penetrating through the radio frequency substrate in a thickness direction thereof.

摘要翻译： 芯片尺寸封装包括：具有形成在主表面上的射频半导体电路的射频基板; 布置在面向所述射频基板的主表面的位置处的半导体盖基板; 以及以包围射频基板和半导体盖基板之间的射频半导体电路的方式布置的接合框架，连接射频基板和半导体盖基板的接合框架，其中：射频基板还具有 形成在与所述主表面相对的表面上的线; 并且射频半导体电路和导线通过穿过射频基板的厚度方向上的通孔彼此电连接。

公开(公告)号：US20110254147A1

公开(公告)日：2011-10-20

申请号：US13173647

申请日：2011-06-30

申请人： Nobuyuki OTSUKA ,  Manabu Yanagihara ,  Shuichi Nagai ,  Daisuke Ueda

发明人： Nobuyuki OTSUKA ,  Manabu Yanagihara ,  Shuichi Nagai ,  Daisuke Ueda

IPC分类号： H01L23/44 ,  H01L21/54

CPC分类号： H01L23/427 ,  H01L21/50 ,  H01L21/54 ,  H01L23/045 ,  H01L23/10 ,  H01L2224/45124 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.

摘要翻译： 提供具有高传热效应和击穿电压的半导体设备及其制造方法。 半导体设备包括：密封容器; 通过杆周边部连接到密封容器的杆; 以及安装在所述杆的顶表面上的所述密封容器内的半导体芯片。 半导体芯片电连接到设置在杆上的引线，与外壳材料不同的材料的茎周边部分沿密封容器的材料粘结， 并且密封容器中填充有包括乙醇，全氟化碳和氟醚中的至少一种的工作流体。

公开(公告)号：US07155080B2

公开(公告)日：2006-12-26

申请号：US11124075

申请日：2005-05-09

申请人： Haruki Ogawa ,  Shuichi Nagai

发明人： Haruki Ogawa ,  Shuichi Nagai

IPC分类号： G02B6/12

CPC分类号： G02B6/423 ,  G02B6/4201 ,  H01S5/02252 ,  H01S5/02284

摘要： The present invention provides a semiconductor device in which a V-groove for holding an optical fiber and an alignment groove for adjusting the distance between the optical fiber and an optical element chip are formed in an optical fiber packaging region on the upper face of a semiconductor substrate, and an optical element chip is packaged in an optical element packaging region on the upper face of the semiconductor substrate so that its optical axis matches the direction in which the V-groove extends. A semiconductor integrated circuit is formed on the lower face of the semiconductor substrate. Through holes are provided in the optical element packaging region of the semiconductor substrate, passing from its upper face to its lower face, and the optical element chip and the semiconductor integrated circuit are connected via the through holes.

公开(公告)号：US20050207695A1

公开(公告)日：2005-09-22

申请号：US11124075

申请日：2005-05-09

申请人： Haruki Ogawa ,  Shuichi Nagai

发明人： Haruki Ogawa ,  Shuichi Nagai

IPC分类号： G02B6/42 ,  H01S5/022 ,  G02B6/12

CPC分类号： G02B6/423 ,  G02B6/4201 ,  H01S5/02252 ,  H01S5/02284

摘要： The present invention provides a semiconductor device in which a V-groove for holding an optical fiber and an alignment groove for adjusting the distance between the optical fiber and an optical element chip are formed in an optical fiber packaging region on the upper face of a semiconductor substrate, and an optical element chip is packaged in an optical element packaging region on the upper face of the semiconductor substrate so that its optical axis matches the direction in which the V-groove extends. A semiconductor integrated circuit is formed on the lower face of the semiconductor substrate. Through holes are provided in the optical element packaging region of the semiconductor substrate, passing from its upper face to its lower face, and the optical element chip and the semiconductor integrated circuit are connected via the through holes.

公开(公告)号：US20140009202A1

公开(公告)日：2014-01-09

申请号：US14007663

申请日：2013-01-23

申请人： Shuichi Nagai ,  Takeshi Fukuda

发明人： Shuichi Nagai ,  Takeshi Fukuda

IPC分类号： H03K17/041

CPC分类号： H03K17/041 ,  H02M1/08 ,  H03K17/04 ,  H03K17/04123 ,  H03K17/687

摘要： A gate drive circuit which drives a gate terminal of a semiconductor switching device includes: a first wireless signal transmitter which transmits an input first AC signal wirelessly; a second wireless signal transmitter which transmits an input second AC signal wirelessly; a first rectifier circuit which includes a first diode that rectifies an output signal from the first wireless signal transmitter; and a second rectifier circuit which includes a second diode that rectifies an output signal from the second wireless signal transmitter. A threshold voltage of the second diode is larger than a threshold voltage of the first diode.

摘要翻译： 驱动半导体开关器件的栅极端子的栅极驱动电路包括：无线发送输入的第一AC信号的第一无线信号发送器; 第二无线信号发射机，其以无线方式发送输入的第二AC信号; 第一整流器电路，其包括对来自第一无线信号发射器的输出信号进行整流的第一二极管; 以及第二整流器电路，其包括对来自第二无线信号发送器的输出信号进行整流的第二二极管。 第二二极管的阈值电压大于第一二极管的阈值电压。

公开(公告)号：US08384212B2

公开(公告)日：2013-02-26

申请号：US13173647

申请日：2011-06-30

申请人： Nobuyuki Otsuka ,  Manabu Yanagihara ,  Shuichi Nagai ,  Daisuke Ueda

发明人： Nobuyuki Otsuka ,  Manabu Yanagihara ,  Shuichi Nagai ,  Daisuke Ueda

IPC分类号： H01L23/10

CPC分类号： H01L23/427 ,  H01L21/50 ,  H01L21/54 ,  H01L23/045 ,  H01L23/10 ,  H01L2224/45124 ,  H01L2224/48 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

摘要： To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether.

摘要翻译： 提供具有高传热效应和击穿电压的半导体设备及其制造方法。 半导体设备包括：密封容器; 通过杆周边部连接到密封容器的杆; 以及安装在所述杆的顶表面上的所述密封容器内的半导体芯片。 半导体芯片电连接到设置在杆上的引线，与外壳材料不同的材料的茎周边部分沿密封容器的材料粘结， 并且密封容器中填充有包括乙醇，全氟化碳和氟醚中的至少一种的工作流体。

公开(公告)号：US20100309554A1

公开(公告)日：2010-12-09

申请号：US12477325

申请日：2009-06-03

申请人： Shuichi Nagai ,  Xinbing Liu

发明人： Shuichi Nagai ,  Xinbing Liu

IPC分类号： G02B5/18

CPC分类号： G02B5/1871 ,  G02B5/1814 ,  G02B5/1842

摘要： Color separation gratings, color separation microlenses and imaging arrays are provided. A color separation grating includes a transparent grating material having a grating formed therein. The transparent grating material has a first surface configured to receive incident light and a second surface opposite the first surface. The second surface is configured to pass selective separated colors from the incident light corresponding to different diffraction orders. The grating is formed in the first surface and includes a number of steps in a grating period and a number of sub-steps formed on each step. A combination of the number of steps and the number of sub-steps are selected to correspond to a number of diffraction orders produced by the color separation grating.

摘要翻译： 提供了色分离光栅，分色微透镜和成像阵列。 色分离光栅包括其中形成有光栅的透明光栅材料。 透明光栅材料具有被配置为接收入射光的第一表面和与第一表面相对的第二表面。 第二表面被配置为从与不同衍射级相对应的入射光中传递选择性分离的颜色。 光栅形成在第一表面中并且包括在光栅周期中的多个步骤以及在每个步骤上形成的多个子步骤。 选择步数和子步数的组合以对应于由分色光栅产生的衍射次数。

公开(公告)号：US20090046029A1

公开(公告)日：2009-02-19

申请号：US12092739

申请日：2006-08-04

申请人： Shuichi Nagai

发明人： Shuichi Nagai

IPC分类号： H01Q1/50

CPC分类号： H01P1/2135 ,  H01Q1/38 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/06

摘要： An antenna device according to the present invention includes; a plurality of antenna elements; a line which is electro-magnetically connected to each of the antenna elements and is branched from at least one branch point in the line; and filters formed in the line between a first branch point and each of said plurality of antenna elements. Here, the first branch point is the electrically farthest branch point from each of the antenna elements among all branch points.

摘要翻译： 根据本发明的天线装置包括： 多个天线元件; 电线连接到每个天线元件并从该线路中的至少一个分支点分支的线; 以及形成在第一分支点和所述多个天线元件中的每一个之间的线中的滤波器。 这里，第一分支点是从所有分支点中的每个天线元件的最远的分支点。

公开(公告)号：US07839350B2

公开(公告)日：2010-11-23

申请号：US12092739

申请日：2006-08-04

申请人： Shuichi Nagai

发明人： Shuichi Nagai

IPC分类号： H01Q1/50

CPC分类号： H01P1/2135 ,  H01Q1/38 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/06

摘要： An antenna device according to the present invention includes; a plurality of antenna elements; a line which is electro-magnetically connected to each of the antenna elements and is branched from at least one branch point in the line; and filters formed in the line between a first branch point and each of said plurality of antenna elements. Here, the first branch point is the electrically farthest branch point from each of the antenna elements among all branch points.

摘要翻译： 本发明的天线装置包括： 多个天线元件; 电线连接到每个天线元件并从该线路中的至少一个分支点分支的线; 以及形成在第一分支点和所述多个天线元件中的每一个之间的线中的滤波器。 这里，第一分支点是从所有分支点中的每个天线元件的最远的分支点。

公开(公告)号：US20090256777A1

公开(公告)日：2009-10-15

申请号：US11916547

申请日：2006-04-12

申请人： Shuichi Nagai

发明人： Shuichi Nagai

IPC分类号： H01Q1/38 ,  H01Q21/00

CPC分类号： H01Q21/065 ,  H01Q9/0407 ,  H01Q9/045 ,  H01Q21/0075 ,  H01Q21/22

摘要： Provided a practical planar antenna device which has antenna elements facing each other, in which electrical power is fed between the antenna elements. The first feeding point is provided near an end of the first antenna element, which faces the opposite antenna element. The second feeding point is provided near an outer end of the second antenna element, by providing a second slit longer than the distance from the end of the second antenna element to its center. Since the feeding points are provided at the same level, the same electric field is excited in the two antenna elements in phase. The planar antenna device, to which electrical power is fed from the facing sides of the pair of opposite antenna elements, saves a bend conventionally required in a feed line, thereby allowing a wiring area to be smaller than in the conventional method.

摘要翻译： 提供了一种实用的平面天线装置，其具有彼此面对的天线元件，其中在天线元件之间馈送电力。 第一馈电点设置在第一天线元件的靠近相对天线元件的端部附近。 第二馈电点设置在第二天线元件的外端附近，通过提供比从第二天线元件的端部到其中心的距离更长的第二狭缝。 由于馈电点设置在相同的电平上，相同的电场在两个天线元件中同相激发。 从一对相对天线元件的相对侧馈送电力的平面天线装置节省了馈电线中常规需要的弯曲，从而允许布线面积比常规方法中的更小。