Abstract:
A compound for an organic optoelectronic device is represented by Chemical Formula 1: and, in Chemical Formula 1, one of Ar1 or Ar2 is a substituted or unsubstituted C6 to C30 aryl group, or a substituted or unsubstituted C3 to C30 heteroaryl group, and the other of Ar1 or Ar2 is a substituent represented by the Chemical Formula 2:
Abstract:
A method and a system for providing a service are provided. In the method for providing the service, a user terminal receives customized information among individuals or group members. The method includes: obtaining tag information by reading a tag attached to an object, the tag information containing a tag code and service data; obtaining service access information from an Object Directory Service (ODS) server when the tag is tagged in a situation, the service access information corresponding to at least one of the obtained tag information and identification information; and receiving a customized information service corresponding to the user terminal by accessing a service providing server in accordance with the service access information.
Abstract:
A manufacture includes a substrate, a reinforcement layer over the substrate, and abrasive particles over the substrate. The abrasive particles are partially buried in the reinforcement layer. Upper tips of the abrasive particles are substantially coplanar.
Abstract:
A semiconductor package is provided. The semiconductor package includes a package substrate, a semiconductor chip, bonding wires, and a molding film. The package substrate includes a first surface having a recessed portion, a second surface opposed to the first surface, an opening extending from the recessed portion of the first surface to the second surface, and bonding pads provided on the first surface. The semiconductor chip is disposed on the second surface of the package substrate to cover the opening, and includes center pads exposed through the opening. Bonding wires electrically connect the center pads and the bonding pads through the opening. The molding film covers the bonding pads, the center pads, and the bonding wires. A depth of the recessed portion is greater than a distance between the recessed portion of the first surface and a lowermost surface of the molding film.
Abstract:
A semiconductor device package is assembled using a jig that alters the shape of gel material disposed in a cavity in the package. In one embodiment, a jig having a concave bottom surface is inserted onto uncured gel material disposed within a cavity in a housing of the package to change a top surface of the gel from having a concave shape to a convex shape. The gel is then cured with the jig in place. When the jig is subsequently removed, the cured gel retains the convex shape, which helps to avoid any bond wires from being exposed. The re-shaped gel material reduces internal stresses during thermal cycling and can therefore reduce permanent damage to the package otherwise resulting from such thermal cycling.
Abstract:
A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device.
Abstract:
An apparatus for auto white balance includes a histogram generation unit writing respective histograms of Cb values and Cr values with regard to pixels included in an input image frame, a single-tone determination unit comparing respective maximum values of the histograms of Cb values and Cr values with a first threshold value, and determining the input image frame as a single-tone image if at least one of the maximum values is higher than the first threshold value, and an auto white balance gain computation unit computing and an auto white balance gain by using color information of an input image frame and outputting the computed auto white balance gain, wherein if the input image frame is determined to be a single-tone image, the auto white balance gain computation unit outputs an auto white balance gain computed with respect to a previous input image frame.
Abstract:
A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.
Abstract:
Disclosed is a traffic managing device which includes an information collector collecting primary information associated with a flow; a controller judging a traffic state, collecting secondary information associated with the traffic based on the judged traffic state and the primary information, and judging whether the flow is abnormal, based on the secondary information; and a traffic correspondence unit dropping the flow based on the judged traffic state and whether the flow is abnormal. The primary information includes internet protocol addresses of source and destination of the flow and the secondary information includes a flow number of each internet protocol address of a source.