公开(公告)号：US08101468B2

公开(公告)日：2012-01-24

申请号：US12906775

申请日：2010-10-18

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US20110033983A1

公开(公告)日：2011-02-10

申请号：US12906775

申请日：2010-10-18

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L21/50

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved.Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US20070192559A1

公开(公告)日：2007-08-16

申请号：US11616966

申请日：2006-12-28

申请人： Takafumi BETSUI ,  Naoto Taoka ,  Motoo Suwa ,  Shigezumi Matsui ,  Norihiko Sugita ,  Yoshiharu Fukushima

发明人： Takafumi BETSUI ,  Naoto Taoka ,  Motoo Suwa ,  Shigezumi Matsui ,  Norihiko Sugita ,  Yoshiharu Fukushima

IPC分类号： G06F13/00

CPC分类号： G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

摘要翻译： 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US20120079238A1

公开(公告)日：2012-03-29

申请号：US13310217

申请日：2011-12-02

申请人： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

发明人： Takafumi BETSUI ,  Naoto TAOKA ,  Motoo SUWA ,  Shigezumi MATSUI ,  Norihiko SUGITA ,  Yoshiharu FUKUSHIMA

IPC分类号： G06F15/78 ,  G06F9/02

CPC分类号： G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

摘要翻译： 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US07834455B2

公开(公告)日：2010-11-16

申请号：US12470562

申请日：2009-05-22

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US20090230551A1

公开(公告)日：2009-09-17

申请号：US12470562

申请日：2009-05-22

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L23/498

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved.Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US07547968B2

公开(公告)日：2009-06-16

申请号：US11434745

申请日：2006-05-17

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2 , and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的不充分的4a和4b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US20060264022A1

公开(公告)日：2006-11-23

申请号：US11434745

申请日：2006-05-17

申请人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

发明人： Takahiro Sugimura ,  Satoshi Imasu ,  Norihiko Sugita ,  Takafumi Betsui

IPC分类号： H01L21/44 ,  H01L23/48

CPC分类号： H05K3/305 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/18 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/05644 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/1005 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/53178 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2924/0695

摘要： The reliability of a semiconductor device which has the semiconductor components which were mounted on the same surface of the same substrate via the bump electrodes with which height differs, and with which package structure differs is improved. Semiconductor component 2 of WPP structure is mounted on the main surface of the interposer substrate which forms a semiconductor device via a plurality of bump electrodes. Semiconductor component 3 of CSP structure is mounted on the main surface of an interposer substrate via a plurality of bump electrodes with larger diameter and contiguity pitch than the above-mentioned bump electrode. And under-filling 4a and 4b mutually different, are filled up between the facing surfaces of this interposer substrate and semiconductor components 2, and between the facing surfaces of the interposer substrate and semiconductor components 3, respectively.

摘要翻译： 具有半导体元件的半导体器件的可靠性提高了通过高度不同的突起电极安装在同一基板的同一表面上的半导体器件的可靠性。 WPP结构的半导体部件2通过多个凸块电极安装在形成半导体器件的插入器基板的主表面上。 CSP结构的半导体部件3通过多个比上述凸起电极具有更大的直径和邻接间距的凸起电极安装在插入基片的主表面上。 并且相互不同的欠充填4 a和4 b分别填充在该插入器基板和半导体部件2的相对表面之间以及插入器基板和半导体部件3的相对表面之间。

公开(公告)号：US08091061B2

公开(公告)日：2012-01-03

申请号：US11616966

申请日：2006-12-28

申请人： Takafumi Betsui ,  Naoto Taoka ,  Motoo Suwa ,  Shigezumi Matsui ,  Norihiko Sugita ,  Yoshiharu Fukushima

发明人： Takafumi Betsui ,  Naoto Taoka ,  Motoo Suwa ,  Shigezumi Matsui ,  Norihiko Sugita ,  Yoshiharu Fukushima

IPC分类号： G06F17/50

CPC分类号： G11C5/04 ,  G11C5/02 ,  G11C5/06 ,  G11C5/063 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L25/18 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/49175 ,  H01L2924/1432 ,  H01L2924/14361 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/4602 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

摘要： A microcomputer provided on a rectangular semiconductor board has memory interface circuits. The memory interface circuits are separately disposed in such positions as to extend along the peripheries of the semiconductor board on both sides from one corner as a reference position. In this case, limitations to size reduction imposed on the semiconductor board can be reduced compared with a semiconductor board having memory interface circuits only on one side. Respective partial circuits on each of the separated memory interface circuits have equal data units associated with data and data strobe signals. Thus, the microcomputer has simplified line design on a mother board and on a module board.

摘要翻译： 设置在矩形半导体板上的微型计算机具有存储器接口电路。 存储器接口电路分别设置在从作为基准位置的一个角部沿着半导体板的两侧的周边延伸的位置。 在这种情况下，与仅在一侧具有存储器接口电路的半导体板相比，可以减小对半导体板的尺寸减小的限制。 每个分离的存储器接口电路上的各个部分电路具有与数据和数据选通信号相关联的相等的数据单元。 因此，微型计算机在主板和模块板上简化了线路设计。

公开(公告)号：US07745915B2

公开(公告)日：2010-06-29

申请号：US11360808

申请日：2006-02-24

申请人： Motoo Suwa ,  Hikaru Ikegami ,  Takafumi Betsui

发明人： Motoo Suwa ,  Hikaru Ikegami ,  Takafumi Betsui

IPC分类号： H01L23/02

CPC分类号： H01L23/5385 ,  H01L23/50 ,  H01L23/5386 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/0102 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/15173 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H01L2924/00

摘要： A mounting board has a plurality of semiconductor memory devices operated in sync with a clock signal, and a semiconductor data processing device which access-controls the semiconductor memory devices. Layouts of data-system terminals of the semiconductor memory devices with respect to memory access terminals of the semiconductor data processing device are determined in such a manner that wirings for data and a data strobe system (RTdq/dqs) become shorter than wirings for a command/address system (RTcmd/add). The wirings for the data and data strobe system (RTdq/dqs) are laid down using an area defined between the semiconductor memory devices. The wirings for the command/address system (RTcmd/add) bypass the side of the mounting board.

摘要翻译： 安装板具有与时钟信号同步操作的多个半导体存储器件，以及访问控制半导体存储器件的半导体数据处理器件。 确定半导体存储器件相对于半导体数据处理器件的存储器访问端子的数据系统端子的布局，使得数据布线和数据选通系统（RTdq / dqs）变得比命令布线短 /地址系统（RTcmd / add）。 数据和数据选通系统（RTdq / dqs）的布线使用半导体存储器件之间定义的区域进行布局。 命令/地址系统（RTcmd / add）的布线绕过安装板侧面。