Abstract:
An LSI device includes a core region to which a first driving voltage is applied and an interface region to which a second driving voltage higher than the above first driving voltage is applied. The LSI device includes an SOI substrate and a device separation region for separating a SOI layer of the SOI substrate into the core region and the interface region. The thickness of the SOI layer of the core region is thinner than the thickness of the SOI layer of the interface region. The LSI device further includes first MOSFETs formed in the core region and in which the SOI layer of the core region is a fully depleted Si channel and second MOSFETs formed in the interface region and in which the SOI layer of the interface region is a fully depleted Si channel.
Abstract:
A depolarizer includes a second birefringent plate having a thickness which continuously changes in a direction of an optical axis of the second birefringent plate; and a third birefringent plate having a thickness which continuously changes in a direction of 45 degree with respect to an optical axis of the third birefringent plate; wherein the second birefringent plate is stuck on the third birefringent plate so that a reduction direction of the thickness of the second birefringent plate and a reduction direction of the thickness of the third birefringent plate are opposite to each other.
Abstract:
A semiconductor device provided with a thin film capacitor having a small equivalent series inductance is provided, which can be operated at a high frequency range and contributes to size reduction of the electronic devices. The semiconductor device comprises a device formed on a silicon substrate 1a, interlayer insulating films 3a, 3b, and 3c, wiring blocks including a power source wire block and a ground wire block, and a thin film capacitor 14 formed on an uppermost insulating layer. The thin film capacitor 14 comprises a lower electrode 6 connected to the ground wire block 4e through a contact 5d, an upper electrode 8 which is connected to the power source wire block 4d through a contact 5d, and which extends above the lower electrode 6, and a dielectric layer 7 which is inserted between the lower and the upper electrodes.
Abstract:
A disk recording or playback device comprises a holder pivoted to a chassis and reciprocatingly movable between an open position in which the holder is raised for inserting thereinto a cartridge containing a disk and a closed position in which the holder is laid on the chassis, a kickout mechanism having an engaging piece engageable with the holder and biased by a spring to urge the cartridge in a direction of discharge from the holder, the kickout mechanism extending into the holder and pushable by the insertion of the cartridge against the spring when the holder is in the open position to bring the engaging piece into engagement with the holder, and a change-over lever pivotally movably provided on the chassis for releasing the kickout mechanism from engagement with the holder during the transition of the holder from the closed position to the open position. The pivot portion of the holder and a pivot portion of the change-over lever are provided on the same surface of one member mounted on the chassis.
Abstract:
A dielectric ceramic composition is herein disclosed which comprises four lead-containing perovskite compounds of (a) lead magnesium tungstate �Pb(Mg.sub.1/2 W.sub.1/2)O.sub.3 !, (b) lead nickel niobate �Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3 !, (c) lead titanate (PbTiO.sub.3) and (d) lead zirconate (PbZrO.sub.3) as main components and which further contains an oxide of a rare earth element; and by adjusting a molar ratio of the components (a) to (d) and an amount of the oxide of the rare earth element in specific ranges, there can be obtained the dielectric ceramic composition suitable for a dielectric substance for a multilayer ceramic capacitor which has a low firing temperature, a high dielectric constant at room temperature and a low change rate of the dielectric constant to temperature.
Abstract:
At a heat treatment temperature in a reducing atmosphere of Ar and H.sub.2, a precursory film of V.sub.2 O.sub.5 is reduced into a VO.sub.x film with the heat treatment temperature selected in a predetermined temperature range between 350 .degree. C. and 450.degree. C., both exclusive, to control a resistivity of the VO.sub.x film, where x is greater than 1.875 and less than 2.0. The VO.sub.x film is not susceptible to a metal-semiconductor phase transition inevitable in VO.sub.2 at about 70.degree. C. and is excellent for use in a bolometer-type infrared sensor. When reduced at 350.degree. C. and 450.degree. C. the resistivity and its temperature coefficient of the VO.sub.x film at room temperature are 0.5 and 0.002 .OMEGA. cm and -2.2% and 0.2% per degree Celsius.
Abstract translation:在Ar和H2的还原气氛中的热处理温度下,将V 2 O 5的前体膜还原成VOx膜,其中热处理温度选择在350℃至450℃的预定温度范围内, 以控制VOx膜的电阻率,其中x大于1.875且小于2.0。 VOx膜不易受到在约70℃的VO2中不可避免的金属 - 半导体相变的影响,并且适用于测辐射热计型红外传感器。 当在350℃和450℃下还原时,VOx膜在室温下的电阻率及其温度系数分别为0.5和0.002欧米加厘米,-2.2%和0.2%摄氏度。
Abstract:
A ceramic composition is herein disclosed, which is a lead-type perovskite compound capable of being subjected to low temperature-sintering among ceramic compositions for use in making capacitors, which has a high dielectric constant, low temperature-dependency thereof and a low decrease in capacitance upon application of a DC bias and which comprises a ternary system comprising lead magnesium niobate (Pb(Mg.sub.1/3 Nb.sub.2/3)O.sub.3), lead nickel niobate (Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3) and lead titanate (PbTiO.sub.3).sub.z or a ternary system comprising lead magnesium tungstate (Pb(Mg.sub.1/2 W.sub.1/2)O.sub.3) lead titanate (PbTiO.sub.3) and lead nickel niobate (Pb(Ni.sub.1/3 Nb.sub.2/3)O.sub.3) and a desired amount of lanthanum manganese niobate La(Mn.sub.2/3 Nb.sub.1/3)O.sub.3) incorporated into the ternary system or a predetermined amount of La.sup.3+ or Ca.sup.2+ ions with which the Pb.sup.2+ ions present in the ternary system are substituted.
Abstract:
A melt-processable copolyester composed of the following structural units (I), (II) and (III) and/or (IV) as main structural components, whereinunit (I) is represented by the formula ##STR1## wherein X.sub.1, X.sub.2, X.sub.3 and X.sub.4, independently from each other, represent H, F, Cl, Br, CH.sub.3 or C(CH.sub.3).sub.3, provided that X.sub.1 to X.sub.4 do not simultaneously represent H, and n is 2 or 4,unit (II) is at least one unit selected from the group consisting of ##STR2## wherein at least one of the hydrogen atoms in each aromatic ring in units (II), (III) and (IV) may be substituted by an alkyl or alkoxy group having 1 to 4 carbon atoms or a halogen atom.The proportion of unit (I) is 2.5 to 35 mole %, the proportion of unit (II) is 2.5 to 35 mole %, and the proportion of unit (III), (IV) or a combination of units (III) and (IV) is 30 to 95 mole %.
Abstract:
To provide a game device that can reduce the size of the device and can execute the simulation of a match game scene based on an operation input by a game player.A field panel 9 imitating a field of a sporting event, card holding stages 10 that are arranged in the locations indicating the positions of players in the sporting event on the field panel 9, and holding card 11 in a raised state, a card information reading means for reading card information recorded on the cards 11 held by the card holding stages 10, and a game execution control means for controlling the execution of a game are provided. Further, the game execution control means includes a means for controlling, based on the card information read by the card information reading means, the execution of the simulation of the match game scene, which is displayed on the touch panel 6 based on the operation by the game player, to be a predetermined number of times that is set in advance.
Abstract:
A manufacturing method for an SOI semiconductor device includes creating transistors and an element isolation region on a semiconductor layer in an SOI substrate. The method also includes covering the transistors and the element isolation region with a first insulation film. The method also includes creating a first opening section which penetrates the first insulation film, element isolation region and a buried oxide film to expose the support substrate. The method also includes creating a first source interconnect, first drain interconnect and first gate interconnect which are electrically connected to the transistors, on the second insulation film. The method also includes forming dummy interconnects which are connected with these interconnects, and are electrically connected with the support substrate via the first opening section, on the second insulation film. The method also includes disconnecting the dummy interconnects to electrically insulate the first source interconnect, first drain interconnect and first gate interconnect from the support substrate.