公开(公告)号：US06593016B1

公开(公告)日：2003-07-15

申请号：US09606081

申请日：2000-06-29

申请人： Toshiaki Chiyo ,  Naoki Shibata ,  Masanobu Senda ,  Jun Ito ,  Shizuyo Asami ,  Shinya Asami ,  Hiroshi Watanabe

发明人： Toshiaki Chiyo ,  Naoki Shibata ,  Masanobu Senda ,  Jun Ito ,  Shizuyo Asami ,  Shinya Asami ,  Hiroshi Watanabe

IPC分类号： H01L2900

CPC分类号： C30B29/406 ,  C30B25/02 ,  C30B29/403 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02502 ,  H01L21/0254 ,  H01L21/0262 ,  H01L33/007 ,  H01L33/32 ,  H01S5/32341 ,  Y10T428/265

摘要： A group III nitride compound semiconductor device has a substrate and an AlN single crystal layer formed on the substrate. The AlN single crystal layer has a thickness of from 0.5 to 3 &mgr;m and has a substantially flat surface. The half-value width of an X-ray rocking curve of the AlN single crystal layer is not longer than 50 sec. In another device, a group III nitride compound semiconductor layer having a thickness of from 0.01 to 3.2 &mgr;m is grown at a temperature of from 1000 to 1180° C. on a sapphire substrate having a surface nitride layer having a thickness of not larger than 300 Å.

摘要翻译： III族氮化物化合物半导体器件具有在衬底上形成的衬底和AlN单晶层。 AlN单晶层的厚度为0.5〜3μm，具有大致平坦的表面。 AlN单晶层的X射线摇摆曲线的半值宽度不大于50秒。 在另一种器件中，在具有厚度不大于300的表面氮化物层的蓝宝石衬底上，在1000至1180℃的温度下生长具有0.01至3.2μm厚度的III族氮化物化合物半导体层 一个。

公开(公告)号：US06335217B1

公开(公告)日：2002-01-01

申请号：US09525425

申请日：2000-03-14

申请人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

发明人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

IPC分类号： H01L2100

CPC分类号： H01L33/12 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/405 ,  H01L33/46

摘要： A GaN type semiconductor layer having a structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti.

摘要翻译： 提供具有结构的GaN型半导体层，其具有与GaN类半导体层相对的表面的由Ti构成的衬底。

公开(公告)号：US07029939B2

公开(公告)日：2006-04-18

申请号：US10481057

申请日：2002-06-17

申请人： Toshiaki Chiyo ,  Naoki Shibata

发明人： Toshiaki Chiyo ,  Naoki Shibata

IPC分类号： H01L21/22 ,  H01L21/324

CPC分类号： H01L33/0095 ,  H01L21/28575 ,  H01L29/2003 ,  H01L33/14 ,  H01L33/32 ,  H01L33/42

摘要： A p-GaN layer 5 comprising materials such as a Group III nitride compound semiconductor is formed on a sapphire substrate 1 through MOVPE treatment, and a first metal layer 6 made of Co/Au is formed thereon. Then in a planar electron beam irradiation apparatus using plasma, electron beams are irradiated to the p-GaN layer 5 through the first metal layer 6. Accordingly, the first metal layer 6 prevents the surface of the p-GaN layer 5 from being damaged and resistivity of the p-GaN layer 5 can be lowered. Next, a second metal (Ni) layer 10 is formed on the first metal layer 6. And the first metal layer 6 is etched through the second metal layer 10 by using fluoric nitric acid. As a result, the first metal layer is almost completely removed. Then a light-transmitting p-electrode 7 made of Co/Au is formed thereon. As a result, a p-type semiconductor having decreased contact resistance and lower driving voltage can be obtained and optical transmittance factor of the p-type semiconductor improves.

摘要翻译： 通过MOVPE处理在蓝宝石衬底1上形成包含III族氮化物化合物半导体的材料的p-GaN层5，在其上形成由Co / Au构成的第一金属层6。 然后在使用等离子体的平面电子束照射装置中，电子束通过第一金属层6照射到p-GaN层5。 因此，第一金属层6防止p-GaN层5的表面被损坏，并且可以降低p-GaN层5的电阻率。 接着，在第一金属层6上形成第二金属（Ni）层10。 并且通过使用氟酸硝酸将第一金属层6蚀刻通过第二金属层10。 结果，第一金属层几乎被完全去除。 然后在其上形成由Co / Au制成的透光p电极7。 结果，可以获得具有降低的接触电阻和较低驱动电压的p型半导体，并且p型半导体的光透射率提高。

公开(公告)号：US06861275B2

公开(公告)日：2005-03-01

申请号：US10413384

申请日：2003-04-15

申请人： Toshiaki Chiyo

发明人： Toshiaki Chiyo

IPC分类号： H01L33/32 ,  H01L33/42 ,  H01L21/00

CPC分类号： H01L33/0095

摘要： A method of producing a Group III nitride compound semiconductor device, has the following steps of: forming an n-type layer on a substrate; forming a layer containing a light emitting layer on the n-type layer; forming a p-type layer being doped with a p-type impurity on the layer; etching at least a portion of the n-type layer and at least a portion of the layer to reveal at least a part of the n-type layer and an end surface of the layer; forming a p-electrode on a surface side of the p-type layer; forming an n-electrode on the revealed part of the n-type layer; irradiating the p-type layer with an electron beam to make resistance of the p-type layer low; and acidizing at least the revealed end surface of the layer after the electron beam irradiating step.

摘要翻译： 制备III族氮化物半导体器件的方法具有以下步骤：在衬底上形成n型层; 在所述n型层上形成含有发光层的层; 在所述层上形成掺杂有p型杂质的p型层; 蚀刻所述n型层的至少一部分和所述层的至少一部分以露出所述n型层和所述层的端面的至少一部分; 在p型层的表面侧形成p电极; 在n型层的露出部分上形成n电极; 用电子束照射p型层，使p型层的电阻降低; 并且在电子束照射步骤之后至少酸化所述层的显露端表面。

公开(公告)号：US06830949B2

公开(公告)日：2004-12-14

申请号：US10258128

申请日：2002-10-21

申请人： Masanobu Senda ,  Jun Ito ,  Toshiaki Chiyo ,  Naoki Shibata ,  Shizuyo Asami

发明人： Masanobu Senda ,  Jun Ito ,  Toshiaki Chiyo ,  Naoki Shibata ,  Shizuyo Asami

IPC分类号： H01L2100

CPC分类号： C30B23/02 ,  C23C14/0036 ,  C23C14/0617 ,  C30B29/403 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/02538 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02631 ,  H01L33/0062

摘要： A preferred condition for forming a Group III nitride compound semiconductor layer on a substrate by a sputtering method is proposed. When a first Group III nitride compound semiconductor layer is formed on a substrate by a sputtering method, an initial voltage of a sputtering apparatus is selected to be not higher than 110% of a sputtering voltage.

摘要翻译： 提出了通过溅射法在基板上形成III族氮化物化合物半导体层的优选条件。 当通过溅射法在基板上形成第一III族氮化物化合物半导体层时，溅射装置的初始电压被选择为不高于溅射电压的110％。

公开(公告)号：US06713789B1

公开(公告)日：2004-03-30

申请号：US09516177

申请日：2000-03-01

申请人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Masanobu Senda ,  Shinya Asami

发明人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Masanobu Senda ,  Shinya Asami

IPC分类号： H01L3300

CPC分类号： C30B25/02 ,  C30B29/403 ,  C30B29/406 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/0262 ,  H01L21/02631 ,  H01L33/007

摘要： A first group III nitride compound layer, which is formed on a substrate by a method not using metal organic compounds as raw materials, is heated in an atmosphere of a mixture gas containing a hydrogen or nitrogen gas and an ammonia gas, so that the crystallinity of a second group III nitride compound semiconductor layer formed on the first group III nitride compound layer is improved. When the first group III nitride compound layer is formed on a substrate by a sputtering method, the thickness of the first group III nitride compound layer is set to be in a range of from 50 Å to 3000 Å.

公开(公告)号：US06426512B1

公开(公告)日：2002-07-30

申请号：US09518724

申请日：2000-03-03

申请人： Jun Ito ,  Toshiaki Chiyo ,  Naoki Shibata ,  Hiroshi Watanabe ,  Shizuyo Asami ,  Shinya Asami

发明人： Jun Ito ,  Toshiaki Chiyo ,  Naoki Shibata ,  Hiroshi Watanabe ,  Shizuyo Asami ,  Shinya Asami

IPC分类号： H01L2906

CPC分类号： H01L33/007 ,  H01L33/0075

摘要： An undercoat layer inclusive of a metal nitride layer is formed on a substrate. Group III nitride compound semiconductor layers are formed on the undercoat layer continuously.

摘要翻译： 在基板上形成包含金属氮化物层的底涂层。 在内涂层上连续形成III族氮化物化合物半导体层。

公开(公告)号：US06982435B2

公开(公告)日：2006-01-03

申请号：US09985927

申请日：2001-11-06

申请人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Shinya Asami

发明人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Shinya Asami

IPC分类号： H01L31/0256

CPC分类号： H01L33/007 ,  H01L21/02381 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02639

摘要： A group III nitride compound semiconductor device is produced according to the following manner. A separation layer made of a material which prevents group III nitride compound semiconductors from being grown thereon is formed on a substrate. Group III nitride compound semiconductors is grown on a surface of the substrate uncovered with the separation layer while keeping the uncovered substrate surface separated by the separation layer.

公开(公告)号：US06939733B2

公开(公告)日：2005-09-06

申请号：US10725380

申请日：2003-12-03

申请人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Masanobu Senda ,  Shinya Asami

发明人： Naoki Shibata ,  Jun Ito ,  Toshiaki Chiyo ,  Shizuyo Asami ,  Hiroshi Watanabe ,  Masanobu Senda ,  Shinya Asami

IPC分类号： C30B25/02 ,  H01L21/205 ,  H01L33/00 ,  H01L21/00

CPC分类号： C30B25/02 ,  C30B29/403 ,  C30B29/406 ,  H01L21/0237 ,  H01L21/0242 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/02573 ,  H01L21/0262 ,  H01L21/02631 ,  H01L33/007

摘要： A first group III nitride compound layer, which is formed on a substrate by a method not using metal organic compounds as raw materials, is heated in an atmosphere of a mixture gas containing a hydrogen or nitrogen gas and an ammonia gas, so that the crystallinity of a second group III nitride compound semiconductor layer formed on the first group III nitride compound layer is improved. When the first group III nitride compound layer is formed on a substrate by a sputtering method, the thickness of the first group III nitride compound layer is set to be in a range of from 50 Å to 3000 Å.

摘要翻译： 通过不使用金属有机化合物作为原料的方法在基板上形成的第一III族氮化物化合物层在含有氢或氮气和氨气的混合气体的气氛中加热，使得结晶度 形成在第一III族氮化物层上的第二III族氮化物化合物半导体层。 当通过溅射法在基板上形成第一III族氮化物化合物层时，第一III族氮化物化合物层的厚度被设定在从50到3000的范围内。

公开(公告)号：US06589808B2

公开(公告)日：2003-07-08

申请号：US09972898

申请日：2001-10-10

申请人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

发明人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

IPC分类号： H01L2100

CPC分类号： H01L33/12 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/405 ,  H01L33/46

摘要： A GaN type semiconductor layer having a new structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti.