公开(公告)号：US6100545A

公开(公告)日：2000-08-08

申请号：US170128

申请日：1998-10-13

申请人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

发明人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

IPC分类号： H01L33/06 ,  H01L33/12 ,  H01L33/32 ,  H01S5/00 ,  H01S5/323 ,  H01S5/343 ,  H01L33/00

CPC分类号： H01L33/405 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/46

摘要： A GaN type semiconductor layer having a new structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti.

公开(公告)号：US06589808B2

公开(公告)日：2003-07-08

申请号：US09972898

申请日：2001-10-10

申请人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

发明人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

IPC分类号： H01L2100

CPC分类号： H01L33/12 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/405 ,  H01L33/46

摘要： A GaN type semiconductor layer having a new structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti.

公开(公告)号：US06335217B1

公开(公告)日：2002-01-01

申请号：US09525425

申请日：2000-03-14

申请人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

发明人： Toshiaki Chiyo ,  Shizuyo Noiri ,  Naoki Shibata ,  Jun Ito

IPC分类号： H01L2100

CPC分类号： H01L33/12 ,  H01L33/007 ,  H01L33/0075 ,  H01L33/10 ,  H01L33/405 ,  H01L33/46

摘要： A GaN type semiconductor layer having a structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti.

摘要翻译： 提供具有结构的GaN型半导体层，其具有与GaN类半导体层相对的表面的由Ti构成的衬底。

公开(公告)号：US06291840B1

公开(公告)日：2001-09-18

申请号：US08979346

申请日：1997-11-26

申请人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

发明人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

IPC分类号： H01L3300

CPC分类号： H01L33/42 ,  H01L33/0095 ,  H01L33/32

摘要： A layer comprising cobalt (Co) is formed on a p+ layer by vapor deposition, and layer comprising gold (Au) is formed thereon. The two layers are alloyed by a heat treatment to form a light-transmitting electrode. The light-transmitting electrode therefore has reduced contact resistance and improved light transmission properties, and gives a light-emitting patten which is stable over a long time. Furthermore, since cobalt (Co) is an element having a large work function, satisfactory ohmic properties are obtained.

摘要翻译： 通过气相沉积在p +层上形成包含钴（Co）的层，并且在其上形成包含金（Au）的层。 通过热处理将两层合金化以形成透光电极。 因此，透光电极具有降低的接触电阻和改善的透光性，并且给出长时间稳定的发光图案。 此外，由于钴（Co）是具有大功函数的元素，因此获得令人满意的欧姆特性。

公开(公告)号：US06573117B2

公开(公告)日：2003-06-03

申请号：US10053570

申请日：2002-01-24

申请人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

发明人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

IPC分类号： H01L2100

CPC分类号： H01L33/42 ,  H01L33/0095 ,  H01L33/32

摘要： A layer comprising cobalt (Co) is formed on a p+ layer by vapor deposition, and a layer comprising gold (Au) is formed thereon. The two layers are alloyed by a heat treatment to form a light-transmitting electrode. The light-transmitting electrode therefore has reduced contact resistance and improved light transmission properties, and gives a light-emitting pattern which is stable over a long time. Furthermore, since cobalt (Co) is an element having a large work function, satisfactory ohmic properties are obtained.

公开(公告)号：US06500689B2

公开(公告)日：2002-12-31

申请号：US09819622

申请日：2001-03-29

申请人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

发明人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Masanori Murakami ,  Yasuo Koide ,  Jun Ito

IPC分类号： H01L2128

CPC分类号： H01L33/42 ,  H01L33/0095 ,  H01L33/32

摘要： A layer comprising cobalt (Co) is formed on a p+ layer by vapor deposition, and a layer comprising gold (Au) is formed thereon. The two layers are alloyed by a heat treatment to form a light-transmitting electrode. The light-transmitting electrode therefore has reduced contact resistance and improved light transmission properties, and gives a light-emitting pattern which is stable over a long time. Furthermore, since cobalt (Co) is an element having a large work function, satisfactory ohmic properties are obtained.

摘要翻译： 通过气相沉积在p +层上形成包含钴（Co）的层，并且在其上形成包含金（Au）的层。 通过热处理将两层合金化以形成透光电极。 因此，透光电极具有降低的接触电阻和改善的透光性，并且给出了长时间稳定的发光图案。 此外，由于钴（Co）是具有大功函数的元素，因此获得令人满意的欧姆特性。

公开(公告)号：US06734468B2

公开(公告)日：2004-05-11

申请号：US08866129

申请日：1997-05-30

申请人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Shigemi Horiuchi

发明人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Shigemi Horiuchi

IPC分类号： H01L3300

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/06 ,  H01L29/452 ,  H01L2224/05073 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrode pad for a Group III nitride compound semiconductor having p-type conduction includes a triple layer structure having first, second, and third metal layers, formed on an electrode layer. A protection film with a window exposing a central portion of the third metal layer is formed by etching on the third metal layer and covers the sides of the first, second, and third metal layers. The second metal layer is made of gold (Au). The first metal layer is made of an element which has ionization potential lower than gold (Au). The third metal is made of an element which has adhesiveness to the protection film stronger than that of gold (Au). Consequently, this structure of the electrode pad improves the adhesive strength between the protection layer and the third meal layer and prevents the etching of the sides of the protection film. Furthermore, the contact resistance between the semiconductor and the electrode pad is lowered and, thus, ohmic characteristic of the electrode pad is improved.

摘要翻译： 具有p型导电的III族氮化物化合物半导体的电极焊盘包括形成在电极层上的具有第一，第二和第三金属层的三层结构。 通过在第三金属层上蚀刻并覆盖第一，第二和第三金属层的侧面，形成具有暴露第三金属层的中心部分的窗口的保护膜。 第二金属层由金（Au）制成。 第一金属层由电离电位低于金（Au）的元素制成。 第三金属由对金（Au）的保护膜具有更强的粘合性的元素制成。 因此，电极焊盘的这种结构提高了保护层和第三层之间的粘合强度，并且防止了保护膜的侧面的蚀刻。 此外，半导体和电极焊盘之间的接触电阻降低，因此提高了电极焊盘的欧姆特性。

公开(公告)号：US06955936B2

公开(公告)日：2005-10-18

申请号：US10670518

申请日：2003-09-26

申请人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Shigemi Horiuchi

发明人： Toshiya Uemura ,  Naoki Shibata ,  Shizuyo Noiri ,  Shigemi Horiuchi

IPC分类号： H01L21/28 ,  H01L23/485 ,  H01L29/45 ,  H01L33/32 ,  H01L33/40 ,  H01L33/62 ,  H01L21/00

CPC分类号： H01L24/05 ,  H01L24/03 ,  H01L24/06 ,  H01L29/452 ,  H01L2224/05073 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05042 ,  H01L2924/1033 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electrode pad for a Group III nitride compound semiconductor having p-type conduction includes a triple layer structure having first, second, and third metal layers, formed on an electrode layer. A protection film with a window exposing a central portion of the third metal layer is formed by etching on the third metal layer and covers the sides of the first, second, and third metal layers. The second metal layer is made of gold (Au). The first metal layer is made of an element which has ionization potential lower than gold (Au). The third metal is made of an element which has adhesiveness to the protection film stronger than that of gold (Au). Consequently, this structure of the electrode pad improves the adhesive strength between the protection layer and the third meal layer and prevents the etching of the sides of the protection film. Furthermore, the contact resistance between the semiconductor and the electrode pad is lowered and, thus, ohmic characteristic of the electrode pad is improved.

摘要翻译： 具有p型导电的III族氮化物化合物半导体的电极焊盘包括形成在电极层上的具有第一，第二和第三金属层的三层结构。 通过在第三金属层上蚀刻并覆盖第一，第二和第三金属层的侧面，形成具有暴露第三金属层的中心部分的窗口的保护膜。 第二金属层由金（Au）制成。 第一金属层由电离电位低于金（Au）的元素制成。 第三金属由对金（Au）的保护膜具有更强的粘合性的元素制成。 因此，电极焊盘的这种结构提高了保护层和第三层之间的粘合强度，并且防止了保护膜的侧面的蚀刻。 此外，半导体和电极焊盘之间的接触电阻降低，因此提高了电极焊盘的欧姆特性。