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公开(公告)号：US12132409B1
公开(公告)日：2024-10-29
申请号：US18381894
申请日：2023-10-19
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
CPC分类号： H02M3/33592 , H02M1/083 , H02M3/3376 , H02M1/0054 , H02M1/0058 , Y02B70/10
摘要： A power converter including a transformer, a resonant circuit including the transformer and a resonant capacitor having a characteristic resonant frequency and period, and output circuitry connected to the transformer for delivering a rectified output voltage to a load. Primary switches drive the resonant circuit, a switch controller operates the primary switches in a series of converter operating cycles which include power transfer intervals of adjustable duration during which a resonant current at the characteristic resonant frequency flows through a winding of the transformer. The operating cycles may also include energy recycling intervals of variable duration for charging and discharging capacitances within the converter. A gate driver includes a transformer, a plurality of switches, a current monitor, and a controller that operates the switches in a series of driver operating cycles having adjustable ON periods and adjustable transition periods during which capacitances are resonantly charged and discharged.
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公开(公告)号：US12132403B1
公开(公告)日：2024-10-29
申请号：US17939820
申请日：2022-09-07
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
CPC分类号： H02M3/1584 , H02M1/4241 , H02M3/33523 , H02M3/33569 , H02M1/0003 , H02M1/0058
摘要： An isolated, power factor corrected, converter, for operation from a three-phase AC source, comprises three power processors, each power processor connected to one of the three phases. Each power processor comprises a cascade of a first and a second power conversion stage. At least one of the first and second power converters in each power processor is configured to provide galvanic isolation through a DC Transformer between the power processor input and output. At least one of the first and second power converters in each power processor is configured to provide power factor correction at the AC source. Substantially all of the bulk energy storage and low frequency filtering is provided by storage elements at the output of the power system. Low voltage semiconductor devices may be cascaded to implement low output capacitance high voltage switches in a multi-cell resonant converter for high voltage applications.
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公开(公告)号：US12088208B1
公开(公告)日：2024-09-10
申请号：US18206890
申请日：2023-06-07
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
IPC分类号： H02M3/335 , H01F1/44 , H01F3/10 , H01F27/28 , H01F41/04 , H02M1/44 , H02M3/337 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/00 , H05K3/02 , H02M1/00
CPC分类号： H02M3/33523 , H01F1/44 , H01F3/10 , H01F27/2804 , H01F41/041 , H02M1/44 , H02M3/33561 , H02M3/33592 , H02M3/3376 , H05K1/0298 , H05K1/165 , H05K1/181 , H05K3/0011 , H05K3/02 , H01F1/447 , H01F2003/106 , H01F2027/2809 , H01F2027/2819 , H02M1/0058 , H02M1/008 , H05K1/0204 , H05K1/0265 , H05K2201/08 , H05K2201/086
摘要： A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.
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公开(公告)号：US11870340B1
公开(公告)日：2024-01-09
申请号：US17475146
申请日：2021-09-14
申请人： Vicor Corporation
摘要： An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits. Some embodiments of the multi-cell converter comprise integrated secondary-side switching devices comprising control circuitry that monitors circuit conditions to determine when the switching device is to be ON and OFF, thereby eliminating the need for secondary-side switch control signals and signal buses, primary-to-secondary interface circuitry and centralized drive circuitry.
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公开(公告)号：US11757353B1
公开(公告)日：2023-09-12
申请号：US17170406
申请日：2021-02-08
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
摘要： A power converter system converts power from an input source for delivery to an active load. An input current surge at startup may be reduced by combining power converter switch resistance modulation with active load control. In another aspect, an input current surge at startup in an array of power converters may be reduced by periodically reconfiguring the array during the startup phase to accumulatively increase the output voltage up to a predetermined output voltage. A power converter may include a controller that provides an over-current signal to the load to reduce the load or advise of potential voltage perturbations.
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公开(公告)号：US11751338B1
公开(公告)日：2023-09-05
申请号：US17706023
申请日：2022-03-28
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli , Michael B. LaFleur , Sean Timothy Fleming , Rudolph F. Mutter , Andrew T. D'Amico
IPC分类号： H05K3/28 , H05K1/11 , H05K5/06 , H05K5/02 , H05K1/18 , H05K1/02 , H05K5/04 , B23P15/00 , H01F27/28 , H05K3/00 , H05K5/00 , B29C45/00 , H01F27/24 , H05K7/14 , H05K7/20 , H01R27/02 , B29C45/14 , H01R43/24 , H01R43/20 , B29C45/16 , B29K63/00
CPC分类号： H05K3/284 , B23P15/007 , B29C45/0055 , B29C45/14639 , B29C45/1679 , H01F27/24 , H01F27/2804 , H01R27/02 , H01R43/205 , H01R43/24 , H05K1/0298 , H05K1/11 , H05K1/111 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/186 , H05K3/007 , H05K3/0044 , H05K3/0052 , H05K5/0004 , H05K5/0065 , H05K5/0217 , H05K5/0247 , H05K5/04 , H05K5/064 , H05K5/065 , H05K7/1427 , H05K7/209 , B29C2045/0058 , B29C2045/169 , B29C2793/009 , B29C2793/0009 , B29C2793/0027 , B29K2063/00 , H01F2027/2809 , H05K1/0209 , H05K2201/0183 , H05K2201/066 , H05K2201/10303 , H05K2201/10545 , H05K2203/1316 , H05K2203/1327 , H05K2203/167 , Y10T29/4913 , Y10T29/49117 , Y10T29/49126 , Y10T29/49133 , Y10T29/49144 , Y10T29/49155 , Y10T29/49158
摘要： A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector.
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公开(公告)号：US11736014B1
公开(公告)日：2023-08-22
申请号：US17092062
申请日：2020-11-06
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
CPC分类号： H02M3/1584 , H02M1/4241 , H02M3/33523 , H02M3/33569 , H02M1/0003 , H02M1/0058
摘要： An isolated, power factor corrected, converter, for operation from a three-phase AC source, comprises three power processors, each power processor connected to one of the three phases. Each power processor comprises a cascade of a first and a second power conversion stage. At least one of the first and second power converters in each power processor is configured to provide galvanic isolation through a DC Transformer between the power processor input and output. At least one of the first and second power converters in each power processor is configured to provide power factor correction at the AC source. Substantially all of the bulk energy storage and low frequency filtering is provided by storage elements at the output of the power system. Low voltage semiconductor devices may be cascaded to implement low output capacitance high voltage switches in a multi-cell resonant converter for high voltage applications.
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公开(公告)号：US11682980B1
公开(公告)日：2023-06-20
申请号：US17572691
申请日：2022-01-11
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
CPC分类号： H02M7/003 , H01F27/2804 , H01F27/40 , H05K1/165 , H01F2027/2809 , H05K1/18 , H05K2201/08 , H05K2201/10015 , H05K2201/10053
摘要： An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.
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公开(公告)号：US20230058665A1
公开(公告)日：2023-02-23
申请号：US17407430
申请日：2021-08-20
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
摘要： The system response time of a factorized power architecture may be reduced using a high bandwidth accelerator connected in parallel with a low bandwidth switching regulator to feed one or more downstream high bandwidth current multipliers, e.g. at the point of load. The accelerator may use a high speed linear amplifier to drive the factorized bus using stored energy derived from the bus or a low voltage bias supply. The accelerator may alternatively be connected in series between the switching regulator and the downstream current multipliers.
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公开(公告)号：US11271490B1
公开(公告)日：2022-03-08
申请号：US16535480
申请日：2019-08-08
申请人： Vicor Corporation
发明人： Patrizio Vinciarelli
摘要： An improved distributed-output multi-cell-element power converter utilizes a multiplicity of magnetic core elements, switching elements, capacitor elements and terminal connections in a step and repeat pattern. Stepped secondary-winding elements reduce converter output resistance and improve converter efficiency and scalability to support the high current requirements of very large scale integrated (“VLSI”) circuits.
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