Organic aluminum precursor and method of manufacturing a metal wiring using the same
    4.
    发明申请

    公开(公告)号:US20070071893A1

    公开(公告)日:2007-03-29

    申请号:US11524295

    申请日:2006-09-21

    IPC分类号: C23C16/00 C07F5/06

    CPC分类号: C07F5/066 C07F5/062 C23C16/20

    摘要: In a method of manufacturing a metal wiring, an organic aluminum precursor that includes aluminum as a central metal is applied to a substrate. The organic aluminum precursor applied to the substrate is thermally decomposed to form aluminum. The aluminum is deposited on the substrate to form an aluminum wiring having a low resistance. The organic aluminum precursor includes a chemical structure in accordance with one of the chemical formulae: wherein R1, R2, R3, R4 and R5 are independently H or a C1-C5 alkyl functional group, n is an integer of 1 to 5, x is 1 or 2, and y is 0 or 1, or wherein R1, R2, R3, R4 R5, R6, R7 and R8 are independently H or a C1-C5 alkyl functional group, and Y is boron.

    摘要翻译: 在制造金属布线的方法中,将包含铝作为中心金属的有机铝前体施加到基板上。 施加到基材上的有机铝前体热分解形成铝。 铝沉积在基板上以形成具有低电阻的铝布线。 有机铝前体包括根据以下化学式之一的化学结构:其中R 1,R 2,R 3,R 3, R 4和R 5独立地是H或C 1 -C 5烷基官能团,n是整数 1至5,x为1或2,y为0或1,或其中R 1,R 2,R 3,R R 5,R 6,R 7和R 8独立地是H 或C 1 -C 5烷基官能团,Y是硼。

    SEMICONDUCTOR DEVICES INCLUDING CAPACITORS AND METHODS FOR MANUFACTURING THE SAME
    6.
    发明申请
    SEMICONDUCTOR DEVICES INCLUDING CAPACITORS AND METHODS FOR MANUFACTURING THE SAME 有权
    包括电容器的半导体器件及其制造方法

    公开(公告)号:US20160197136A1

    公开(公告)日:2016-07-07

    申请号:US14967956

    申请日:2015-12-14

    摘要: The inventive concepts provide semiconductor devices and methods for manufacturing the same in which the method includes forming a capacitor including a bottom electrode, a dielectric layer and a top electrode sequentially stacked on a substrate, and also where formation of the top electrode includes forming a first metal nitride layer on the dielectric layer, and forming a second metal nitride layer on the first metal nitride layer, in which the first metal nitride layer is disposed between the dielectric layer and the second metal nitride layer, and the first metal nitride layer is formed at a temperature lower than a temperature at which the second metal nitride layer is formed.

    摘要翻译: 本发明构思提供了半导体器件及其制造方法,其中该方法包括形成电容器,该电容器包括依次层叠在基板上的底部电极,电介质层和顶部电极,并且上部电极的形成包括形成第一 金属氮化物层,并且在第一金属氮化物层上形成第二金属氮化物层,其中第一金属氮化物层设置在电介质层和第二金属氮化物层之间,并且形成第一金属氮化物层 在比形成第二金属氮化物层的温度低的温度下进行。

    Method of forming a thin film and methods of manufacturing a gate structure and a capacitor using same
    10.
    发明申请
    Method of forming a thin film and methods of manufacturing a gate structure and a capacitor using same 审中-公开
    形成薄膜的方法和使用其制造栅极结构和电容器的方法

    公开(公告)号:US20080057224A1

    公开(公告)日:2008-03-06

    申请号:US11790445

    申请日:2007-04-25

    IPC分类号: C23C8/00

    CPC分类号: C23C8/80 C23C4/123 C23C8/02

    摘要: A method of manufacturing a thin film includes providing a metal organic precursor onto a substrate where the metal organic precursor is heated to a temperature of about 60° C. to about 95° C. and has a saturated vapor pressure of about 1 Torr to about 5 Torr. An oxidizing agent including oxygen for oxidizing the metal organic precursor is provided onto the substrate. The metal organic precursor and the oxidizing agent are chemically reacted to form the thin film including metal oxide. The thin film is easily available in a gate insulation layer of a gate structure, a dielectric layer of a capacitor, and similar circuit components.

    摘要翻译: 制造薄膜的方法包括将金属有机前体提供到基底上,其中将金属有机前体加热至约60℃至约95℃的温度,并具有约1托至约 5乇 将包含用于氧化金属有机前体的氧的氧化剂提供到基底上。 金属有机前体和氧化剂在化学上反应以形成包括金属氧化物的薄膜。 该薄膜可容易地用于栅极结构的栅极绝缘层,电容器的介电层和类似的电路部件。