公开(公告)号：US20110207266A1

公开(公告)日：2011-08-25

申请号：US12938534

申请日：2010-11-03

Applicant: Yong-kwan LEE ,  Tae-sung Park ,  Won-keun Kim

Inventor： Yong-kwan LEE ,  Tae-sung Park ,  Won-keun Kim

IPC: H01L21/56 ,  H05K3/00

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19107 ,  Y10T29/4916 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012

Abstract: A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.

Abstract translation: 印刷电路板（PCB）包括通过简化PCB的结构而具有低处理成本和高产量的导线图案，并且当进行倒装芯片接合处理时可以增加微小凸块的接合特性和可靠性。 PCB包括具有下表面和上表面的主体树脂层，在主体树脂层的上表面和下表面之一上或之一上的线图形，至少一个从线图形延伸通过主体树脂层的通孔接触， 以及在主体树脂层的上表面和下表面上的阻焊剂，焊料防护层的开口对应于焊球焊盘和凸块焊盘中的至少一个，焊球焊盘和焊盘焊盘被配置为将PCB 到半导体芯片。 如果焊锡球焊盘位于单层导线图案上，则凸起焊盘在通孔接触处，如果焊盘焊盘位于焊丝图案上，则焊球焊盘位于通孔接触处。

公开(公告)号：US20110072447A1

公开(公告)日：2011-03-24

申请号：US12622412

申请日：2009-11-19

Applicant: Yong Kwan Lee ,  Nam Seok Kim ,  Sun Kim

Inventor： Yong Kwan Lee ,  Nam Seok Kim ,  Sun Kim

IPC: G11B17/028

CPC classification number: G11B17/0282 ,  G11B19/2018

Abstract: Disclosed herein is a disk drive motor which can prevent a disk from wobbling despite having a simple structure. The disk drive motor includes a turntable which is rotated by a drive unit and supports a disk thereon, and a disk support which is attached onto the turntable to support the disk thereon. Grooves are formed in the disk support. Each groove is inclined based on the radial direction of the turntable in the direction opposite to the direction in which the disk rotates. In the present invention, when a disk rotates, air which has been in a space between the turntable and the disk is discharged outside through the grooves, so that adsorption force is generated by a difference in pressure between the air and the space between the turntable and the disk. Therefore, the disk can be prevented from wobbling when rotating.

Abstract translation: 这里公开了尽管具有简单的结构，但是可以防止盘摆动的盘驱动马达。 磁盘驱动电动机包括由驱动单元旋转并支撑其上的盘的转盘和附接到转盘上以支撑盘的盘支撑件。 槽形成在磁盘支架中。 每个凹槽基于转盘的径向在与盘旋转方向相反的方向上倾斜。 在本发明中，当盘旋转时，已经在转盘和盘之间的空间中的空气通过槽排出到外部，从而通过空气与转台之间的空间的压力差产生吸附力 和磁盘。 因此，当旋转时可以防止盘摆动。

公开(公告)号：US07442273B2

公开(公告)日：2008-10-28

申请号：US10892259

申请日：2004-07-14

Applicant: Gi-Chung Kwon ,  Hong-Young Chang ,  Yong-Kwan Lee

Inventor： Gi-Chung Kwon ,  Hong-Young Chang ,  Yong-Kwan Lee

IPC: C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC classification number: H01J37/32174 ,  H01J37/32082 ,  H01J37/321

Abstract: A hybrid coupled plasma type apparatus includes: a chamber having a gas-injecting unit; an electrostatic chuck in the chamber; an insulating plate over the gas-injecting unit; a high frequency generator; an impedance matching circuit connected to the high frequency generator; first and second antennas connected to the impedance matching circuit in parallel, a power of the high frequency generator being supplied to the first and second antennas; an electrode of a plate shape connected to one of the first and second antennas in serial, the power of the high frequency generator being supplied to the electrode; and a power distributor between the high frequency generator and one of the first and second antennas.

Abstract translation: 混合耦合等离子体型装置包括：具有气体注入单元的室; 腔室中的静电卡盘; 气体注入单元上的绝缘板; 高频发生器; 连接到高频发生器的阻抗匹配电路; 第一和第二天线并联连接到阻抗匹配电路，高频发生器的功率被提供给第一和第二天线; 连接到第一和第二天线中的一个的板状电极，高频发生器的功率被提供给电极; 以及高频发生器与第一和第二天线之一之间的功率分配器。

公开(公告)号：US07411148B2

公开(公告)日：2008-08-12

申请号：US11356947

申请日：2006-02-16

Applicant: Gi-Chung Kwon ,  Sang-Won Lee ,  Sae-Hoon Uhm ,  Jae-Hyun Kim ,  Bo-Han Hong ,  Yong-Kwan Lee

Inventor： Gi-Chung Kwon ,  Sang-Won Lee ,  Sae-Hoon Uhm ,  Jae-Hyun Kim ,  Bo-Han Hong ,  Yong-Kwan Lee

IPC: B23K9/00 ,  B23K9/02

CPC classification number: H01J37/32935 ,  H01J37/321 ,  H05H1/46

Abstract: A plasma generation apparatus includes: a chamber having a chamber lid and defining an airtight reaction region; a susceptor in the chamber; a gas supplier supplying a process gas to the chamber; and a toroidal core vertically disposed with respect to the susceptor through the chamber lid, including: a toroidal ferromagnetic core combined with the chamber, the toroidal ferromagnetic core having a first portion outside the chamber and a second portion inside the chamber, the second portion having an opening portion; a radio frequency (RF) power supply connected to the chamber; an induction coil electrically connected to the RF power supply, the induction coil rolling the first portion; and a matching circuit matching an impedance between the RF power supply and the induction coil.

Abstract translation: 等离子体产生装置包括：具有室盖并限定气密反应区域的室; 室内的一个感受器; 供应处理气体的气体供应器; 以及相对于所述基座通过所述室盖垂直设置的环形芯，包括：与所述室结合的环形铁磁芯，所述环形铁磁芯具有在所述室外部的第一部分和所述室内的第二部分，所述第二部分具有 开口部; 连接到所述室的射频（RF）电源; 感应线圈，其电连接到所述RF电源，所述感应线圈滚动所述第一部分; 以及与RF电源和感应线圈之间的阻抗匹配的匹配电路。

公开(公告)号：US20060255471A1

公开(公告)日：2006-11-16

申请号：US11404756

申请日：2006-04-17

Applicant: Yong-Kwan Lee ,  Tae-Duk Nam

Inventor： Yong-Kwan Lee ,  Tae-Duk Nam

IPC: H01L23/48

CPC classification number: H01L23/562 ,  H01L23/4334 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The flip chip package includes a semiconductor chip electrically connected to a circuit substrate. A protective cap is disposed over the semiconductor chip, and includes at least one portion extending beyond an edge of the semiconductor chip.

Abstract translation: 倒装芯片封装包括电连接到电路基板的半导体芯片。 保护帽设置在半导体芯片的上方，并且包括延伸超出半导体芯片的边缘的至少一个部分。

公开(公告)号：US06288493B1

公开(公告)日：2001-09-11

申请号：US09562902

申请日：2000-05-02

Applicant: Yong-Kwan Lee ,  Nam-Sik Yoon ,  Sung-Sik Kim ,  Pyung-Woo Lee ,  Hong-Young Chang

Inventor： Yong-Kwan Lee ,  Nam-Sik Yoon ,  Sung-Sik Kim ,  Pyung-Woo Lee ,  Hong-Young Chang

IPC: H05H124

CPC classification number: H01J37/321 ,  H05H1/46

Abstract: The invention relates to an antenna device of a low impedance for generating a large quantity of inductively coupled plasma to process a large size of a specimen with adjustment for a uniform distribution in the density of plasma, comprising: a high frequency power source; a first antenna for receiving the high frequency power supplied from the high frequency power source; and a second antenna connected in parallel with the first antenna for receiving the high frequency power supplied from the high frequency power source, wherein a resonant state is kept between the first and second antennas.

Abstract translation: 本发明涉及一种用于产生大量电感耦合等离子体的低阻抗天线装置，用于对等离子体密度进行调整以调整大尺寸样品，包括：高频电源; 用于接收从高频电源提供的高频电力的第一天线; 以及与第一天线并联连接的第二天线，用于接收从高频电源提供的高频电力，其中谐振状态保持在第一和第二天线之间。

公开(公告)号：US09041180B2

公开(公告)日：2015-05-26

申请号：US14295577

申请日：2014-06-04

Applicant: Yong-Kwan Lee

Inventor： Yong-Kwan Lee

IPC: H01L23/02 ,  H01L25/11 ,  H01L21/00 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/564 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/70 ,  H01L24/73 ,  H01L24/89 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package.

Abstract translation: 堆叠封装包括第一半导体封装和第二半导体封装。 第一半导体封装包括具有第一模数的第一衬底和安装在第一衬底上的至少一个半导体芯片。 第二半导体封装堆叠在第一半导体封装上并且包括具有第二模量的第二衬底和安装在第二衬底上的至少一个半导体芯片。 第二模量小于第一模数。 即使第一半导体封装由于温度变化而处于严重翘曲的情况下，第二半导体封装的包括例如聚酰亚胺或聚对苯二甲酸乙二醇酯的柔性第二衬底对温度变化可能较不敏感，从而改善 堆栈包的可靠性。

公开(公告)号：US20130024878A1

公开(公告)日：2013-01-24

申请号：US13299516

申请日：2011-11-18

Applicant: Yong Kwan Lee ,  Sun Kim ,  Dae Hyun Kwon ,  Hyun Su Kim

Inventor： Yong Kwan Lee ,  Sun Kim ,  Dae Hyun Kwon ,  Hyun Su Kim

IPC: G11B17/03

CPC classification number: G11B19/2009

Abstract: Disclosed herein is a spindle motor including: a turn table made of a deformable iron based material; a turn table inner diameter part provided at the center of the turn table, having a hollow part, and including a coupling part formed in an inner peripheral surface thereof; and a shaft inserted into the hollow part of the turn table inner diameter part to thereby contact the coupling part and rotate in an axial direction.

Abstract translation: 本文公开了一种主轴电动机，包括：由可变形铁基材料制成的转台; 转台内径部分设置在转台的中心，具有中空部分，并且包括形成在其内周表面中的联接部分; 以及插入转台内径部分的中空部分中的轴，从而接触联接部并沿轴向旋转。

公开(公告)号：US09282624B2

公开(公告)日：2016-03-08

申请号：US13990840

申请日：2011-09-16

Applicant: Yong Kwan Lee

Inventor： Yong Kwan Lee

IPC: H01Q1/26 ,  H05H1/46 ,  H01J37/32

CPC classification number: H05H1/46 ,  H01J37/3211 ,  H01J2237/327 ,  H05H2001/4667

Abstract: An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded.

Abstract translation: 天线结构包括具有相同结构的四个感应天线，并联连接并重叠。 感应天线包括布置在第一层的第一象限上的外部上部，连接到外部上部并且布置在第一层的第二象限上的内部上部，连接到内部上部的内部下部， 布置在布置在第一层的下部的第二层的第三象限上，以及外部下部，连接到内部下部并且布置在第二层的第四象限上。 向外部上部的一端供给RF电力，外部下部的另一端接地。

公开(公告)号：US20130278136A1

公开(公告)日：2013-10-24

申请号：US13990840

申请日：2011-09-16

Applicant: Yong Kwan Lee

Inventor： Yong Kwan Lee

IPC: H05H1/46

CPC classification number: H05H1/46 ,  H01J37/3211 ,  H01J2237/327 ,  H05H2001/4667

Abstract: An antenna structure includes four induction antennas which have the same structure, are connected in parallel and are disposed to be overlapped. The induction antennas include an external upper section arranged on a first quadrant of a first layer, an internal upper section connected to the external upper section and arranged on a second quadrant of the first layer, an internal lower section connected to the internal upper section and arranged on a third quadrant of a second layer arranged on a lower part of the first layer, and an external lower section connected to the internal lower section and arranged on a fourth quadrant of the second layer. An RF power is supplied to one end of the external upper section, and the other end of the external lower section is grounded.

Abstract translation: 天线结构包括具有相同结构的四个感应天线，并联连接并重叠。 感应天线包括布置在第一层的第一象限上的外部上部，连接到外部上部并且布置在第一层的第二象限上的内部上部，连接到内部上部的内部下部， 布置在布置在第一层的下部的第二层的第三象限上，以及外部下部，连接到内部下部并且布置在第二层的第四象限上。 向外部上部的一端供给RF电力，外部下部的另一端接地。