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公开(公告)号：US20170207205A1
公开(公告)日：2017-07-20
申请号：US15406925
申请日：2017-01-16
申请人： Jichul KIM , Jae Choon KIM , Hansung RYU , KyongSoon CHO , YoungSang CHO , Yeo-Hoon YOON
发明人： Jichul KIM , Jae Choon KIM , Hansung RYU , KyongSoon CHO , YoungSang CHO , Yeo-Hoon YOON
IPC分类号： H01L25/10 , H01L21/56 , H01L23/00 , H01L23/498 , H01L21/48 , H01L23/538
CPC分类号： H01L25/105 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2224/04105 , H01L2224/08146 , H01L2224/12105 , H01L2224/16227 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/83005 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00014 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2224/83 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099
摘要： A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.
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公开(公告)号：US20100102432A1
公开(公告)日：2010-04-29
申请号：US12580306
申请日：2009-10-16
申请人： YoungSang CHO , Donghan KIM , Daewoo SON , Kyoungsei CHOI , Yechung CHUNG
发明人： YoungSang CHO , Donghan KIM , Daewoo SON , Kyoungsei CHOI , Yechung CHUNG
IPC分类号： H01L23/48
CPC分类号： H01L23/50 , H01L23/49838 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package has an interconnection substrate including a first conductive lead and a second longer conductive lead, and a semiconductor chip including a first cell region, a second cell region, a first conductive pad electrically connected to the first cell region and a second conductive pad electrically connected to the second cell region. The semiconductor chip is mounted to the interconnection substrate with the first and second conductive pads both disposed on and connected to the second conductive lead.
摘要翻译： 半导体封装具有包括第一导电引线和第二较长导电引线的互连基板，以及包括第一单元区域，第二单元区域，电连接到第一单元区域的第一导电焊盘和第二导电焊盘的半导体芯片 电连接到第二单元区域。 半导体芯片安装到互连基板上，其中第一和第二导电焊盘都设置在第二导电引线上并连接到第二导电引线。
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公开(公告)号：US08198722B2
公开(公告)日：2012-06-12
申请号：US12580306
申请日：2009-10-16
申请人： Youngsang Cho , Donghan Kim , Daewoo Son , Kyoungsei Choi , Yechung Chung
发明人： Youngsang Cho , Donghan Kim , Daewoo Son , Kyoungsei Choi , Yechung Chung
CPC分类号： H01L23/50 , H01L23/49838 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor package has an interconnection substrate including a first conductive lead and a second longer conductive lead, and a semiconductor chip including a first cell region, a second cell region, a first conductive pad electrically connected to the first cell region and a second conductive pad electrically connected to the second cell region. The semiconductor chip is mounted to the interconnection substrate with the first and second conductive pads both disposed on and connected to the second conductive lead.
摘要翻译： 半导体封装具有包括第一导电引线和第二较长导电引线的互连基板，以及包括第一单元区域，第二单元区域，电连接到第一单元区域的第一导电焊盘和第二导电焊盘的半导体芯片 电连接到第二单元区域。 半导体芯片安装到互连基板上，其中第一和第二导电焊盘都设置在第二导电引线上并连接到第二导电引线。
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