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公开(公告)号:US20170207205A1
公开(公告)日:2017-07-20
申请号:US15406925
申请日:2017-01-16
申请人: Jichul KIM , Jae Choon KIM , Hansung RYU , KyongSoon CHO , YoungSang CHO , Yeo-Hoon YOON
发明人: Jichul KIM , Jae Choon KIM , Hansung RYU , KyongSoon CHO , YoungSang CHO , Yeo-Hoon YOON
IPC分类号: H01L25/10 , H01L21/56 , H01L23/00 , H01L23/498 , H01L21/48 , H01L23/538
CPC分类号: H01L25/105 , H01L21/4857 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/49816 , H01L23/5383 , H01L23/5384 , H01L23/5389 , H01L24/16 , H01L24/19 , H01L24/20 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L24/96 , H01L24/97 , H01L25/50 , H01L29/0657 , H01L2224/04105 , H01L2224/08146 , H01L2224/12105 , H01L2224/16227 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/73267 , H01L2224/83005 , H01L2224/92244 , H01L2224/94 , H01L2224/95001 , H01L2224/97 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2225/1088 , H01L2225/1094 , H01L2924/00014 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2224/83 , H01L2224/32225 , H01L2924/00012 , H01L2224/45099
摘要: A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.
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公开(公告)号:US20160044790A1
公开(公告)日:2016-02-11
申请号:US14714531
申请日:2015-05-18
申请人: KyongSoon CHO , Yungcheol KONG
发明人: KyongSoon CHO , Yungcheol KONG
IPC分类号: H05K1/18 , H01L23/31 , H01L25/16 , H01L23/498
CPC分类号: H05K1/189 , H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/49811 , H01L23/49816 , H01L23/49822 , H01L23/562 , H01L24/06 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/73 , H01L24/92 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/165 , H01L25/50 , H01L2224/0401 , H01L2224/06181 , H01L2224/16227 , H01L2224/1703 , H01L2224/17181 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2224/97 , H01L2225/06517 , H01L2225/06572 , H01L2225/1023 , H01L2225/1058 , H01L2924/14 , H01L2924/1431 , H01L2924/1434 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/15331 , H01L2924/19106 , H01L2924/3511 , H05K1/028 , H05K1/181 , H05K3/4697 , H05K2201/09845 , H05K2201/10515 , H05K2201/10522 , H05K2201/1053 , H05K2201/10734 , H05K2201/10977 , H01L2224/83 , H01L2224/81
摘要: Provided are semiconductor modules and semiconductor packages. The semiconductor module may include a module substrate and a semiconductor package mounted on the module substrate. The semiconductor package may include a substrate with a top surface and a bottom surface. Here, the top surface of the substrate may be flat and the bottom surface of the substrate may include a first region and a second region positioned at a lower level than the first region. The semiconductor package may further include connecting portions which are provided on the bottom surface of the substrate and electrically connected to the module substrate.
摘要翻译: 提供半导体模块和半导体封装。 半导体模块可以包括安装在模块基板上的模块基板和半导体封装。 半导体封装可以包括具有顶表面和底表面的衬底。 这里,衬底的顶表面可以是平坦的,并且衬底的底表面可以包括位于比第一区域低的水平的第一区域和第二区域。 半导体封装还可以包括设置在基板的底表面上并电连接到模块基板的连接部分。
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公开(公告)号:US20160111299A1
公开(公告)日:2016-04-21
申请号:US14967490
申请日:2015-12-14
申请人: Jeong-Kyu HA , Youngshin KWON , KwanJai LEE , Jae-Min JUNG , KyongSoon CHO , Sang-Uk HAN
发明人: Jeong-Kyu HA , Youngshin KWON , KwanJai LEE , Jae-Min JUNG , KyongSoon CHO , Sang-Uk HAN
CPC分类号: H01L21/486 , H01L21/4853 , H01L21/563 , H01L21/78 , H01L23/145 , H01L23/49524 , H01L23/49827 , H01L23/4985 , H01L24/50 , H01L2924/12042 , H05K1/114 , H05K1/115 , H05K1/189 , H05K3/0052 , H05K3/107 , H05K3/42 , H05K2203/1545 , Y10T156/1052 , H01L2924/00
摘要: A tape film package is provided including an insulating pattern; a via contact in a via hole in the insulating pattern; first interconnection patterns extending from the via contact to a cutting surface of the insulating pattern; and second interconnection patterns connected to the via contact below the insulating pattern. The second interconnection patterns are parallel to the first interconnection patterns and spaced apart from the cutting surface of the insulating pattern.
摘要翻译: 提供包括绝缘图案的胶带包装; 绝缘图案中的通孔中的通孔接触; 从所述通孔接触延伸到所述绝缘图案的切割表面的第一互连图案; 以及连接到绝缘图案下方的通孔接点的第二互连图案。 第二互连图案平行于第一互连图案并与绝缘图案的切割表面间隔开。
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