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公开(公告)号:US20250033990A1
公开(公告)日:2025-01-30
申请号:US18912849
申请日:2024-10-11
Applicant: ASM IP Holding B.V.
Inventor: Charles Dezelah , Eric James Shero
Abstract: Methods of stabilizing a vanadium compound in a solution, compositions including a vanadium compound and a stabilizing agent, apparatus including the composition, systems that use the composition, and methods of using the compositions, apparatus, and systems are disclosed. Use of the stabilizing agent allows for use of desired precursors, while mitigating unwanted decomposition of the precursors.
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公开(公告)号:US12087586B2
公开(公告)日:2024-09-10
申请号:US17227621
申请日:2021-04-12
Applicant: ASM IP Holding B.V.
Inventor: Qi Xie , Eric James Shero , Charles Dezelah , Giuseppe Alessio Verni , Petri Raisanen
IPC: H01L21/28 , C23C16/34 , C23C16/455 , C23C16/52 , H01L29/49
CPC classification number: H01L21/28088 , C23C16/34 , C23C16/45544 , C23C16/52 , H01L29/4966
Abstract: Methods and systems for depositing chromium nitride layers onto a surface of the substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a deposition process, depositing a chromium nitride layer onto a surface of the substrate. The deposition process can include providing a chromium precursor to the reaction chamber and separately providing a nitrogen reactant to the reaction chamber. The deposition process may be a thermal cyclical deposition process.
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公开(公告)号:US20240209505A1
公开(公告)日:2024-06-27
申请号:US18423969
申请日:2024-01-26
Applicant: ASM IP Holding B.V.
Inventor: William Petro , Venkata Motupalli , Pawan Sharma , Ankit Kimtee , Eric James Shero , Todd Robert Dunn
IPC: C23C16/52 , C23C16/455
CPC classification number: C23C16/52 , C23C16/45544
Abstract: A precursor monitoring assembly for use in reactor systems to provide real-time and direct measurements of the availability of source materials from a source vessel. The assembly includes one or more force or load sensors, such as load cells, positioned between a bottom wall of an interior tray and an exterior wall (e.g., a base of a source vessel) and/or outside the source vessel. A signal conditioning element processes the output electrical signals from the sensors, then a controller processes the output signals from the signal conditioning components with a conversion factor, for example, to determine a current weight of source material stored in the source vessel. The controller uses this weight to calculate the amount of available source material or chemistry in the source vessel.
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公开(公告)号:US20240209501A1
公开(公告)日:2024-06-27
申请号:US18596144
申请日:2024-03-05
Applicant: ASM IP Holding B.V.
Inventor: Mohith Verghese , Eric James Shero , Carl Louis White , Kyle Fondurulia , Herbert Terhorst
IPC: C23C16/448 , C23C16/455
CPC classification number: C23C16/4481 , C23C16/45544
Abstract: Herein disclosed are systems and methods related to solid source chemical vaporizer vessels and multiple chamber deposition modules. In some embodiments, a solid source chemical vaporizer includes a housing base and a housing lid. Some embodiments also include a first and second tray configured to be housed within the housing base, wherein each tray defines a first serpentine path adapted to hold solid source chemical and allow gas flow thereover. In some embodiments, a multiple chamber deposition module includes first and second vapor phase reaction chambers and a solid source chemical vaporizer vessel to supply each of the first and second vapor phase reaction chambers.
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公开(公告)号:US20240165681A1
公开(公告)日:2024-05-23
申请号:US18509375
申请日:2023-11-15
Applicant: ASM IP Holding B.V.
Inventor: Jereld Lee Winkler , Paul Ma , Eric James Shero , Shubham Garg , Jonathan Bakke , Todd Dunn , Jacqueline Wrench , Shuaidi Zhang
CPC classification number: B08B9/0813 , B08B9/46 , B08B2209/08
Abstract: Various embodiments of the present technology may provide methods and apparatus for cleaning a source vessel. The source vessel may be filled or partially filled with a solvent to form a solution. The solution is removed from the source vessel and contained in a waste vessel that is connected to the source vessel. The waste vessel may have a bellow or other mechanism inside of it to create a negative pressure in the waste vessel to pull the solution out of the source vessel and into the waste vessel. Alternatively, a liquid pump may be used to pull the solution from the source vessel to the waste vessel.
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公开(公告)号:US11976361B2
公开(公告)日:2024-05-07
申请号:US17714383
申请日:2022-04-06
Applicant: ASM IP Holding B.V.
Inventor: Eric James Shero , Robert Brennan Milligan , William George Petro , Eric Wang , Fred Alokozai , Dong Li , Hao Wang , Melvin Verbaas , Luping Li
IPC: C23C16/455 , C23C16/34 , C23C16/44 , C23C16/46 , C23C16/52
CPC classification number: C23C16/45565 , C23C16/34 , C23C16/4401 , C23C16/45544 , C23C16/46 , C23C16/52
Abstract: An apparatus and method for depositing a transition metal nitride film on a substrate by atomic layer deposition in a reaction space defined by an at least one chamber wall and showerhead is disclosed. The apparatus may include, a substrate support disposed within the reaction space, the substrate support configured for supporting at least one substrate and a temperature control system for controlling a temperature of the at least one chamber wall at those portions of the at least one chamber wall that is exposed to a vapor phase reactant. The apparatus may also include a temperature control system for controlling a temperature of the showerhead, wherein the temperature control system for controlling a temperature of the showerhead is configured to control the temperature of the showerhead to a temperature of between approximately 80° C. and approximately 160° C. The method may include, providing at least one substrate on a substrate support within the reaction space and controlling a temperature of the at least one chamber wall at least at those portions of the at least one chamber wall that is exposed to a vapor phase reactant and controlling a temperature of a showerhead. The method may also include, alternatively and sequentially feeding at least two vapor phase reactants into the reaction space, wherein the temperature of the showerhead is controlled to a temperature between approximately 80° C. and approximately 160° C.
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公开(公告)号:US11967488B2
公开(公告)日:2024-04-23
申请号:US17744902
申请日:2022-05-16
Applicant: ASM IP Holding B.V.
Inventor: Suvi Haukka , Eric James Shero , Fred Alokozai , Dong Li , Jereld Lee Winkler , Xichong Chen
CPC classification number: H01J37/32495 , C23C16/32 , C23C16/4404 , C23C16/4405
Abstract: A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
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公开(公告)号:US11959168B2
公开(公告)日:2024-04-16
申请号:US17239768
申请日:2021-04-26
Applicant: ASM IP Holding B.V.
Inventor: Jianqiu Huang , Ankit Kimtee , Sudhanshu Biyani , Jonathan Robert Bakke , Eric James Shero
IPC: C23C16/455 , C23C16/44 , C23C16/448 , C23C16/50
CPC classification number: C23C16/448 , C23C16/44 , C23C16/4408 , C23C16/45525 , C23C16/50
Abstract: The present disclosure is generally directed to a solid source precursor delivery system. More specifically, the present disclosure is directed to a solid source precursor vessel that can be utilized to vaporize a supply of solid precursor stored within the vessel. The disclosed source vessel utilizes a plurality of individual cavities or pockets within the interior of the vessel. Each individual pocket may be loaded with precursor. In an arrangement, the pockets may be loaded with pre-formed blocks of compressed precursor material that typically have a higher density than was previously achieved when packing solid precursor within a source vessel. The increased density of the solid precursor material increases a capacity of the source vessel resulting in longer intervals between replacement and/or refilling the source vessel.
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公开(公告)号:US11873557B2
公开(公告)日:2024-01-16
申请号:US17504839
申请日:2021-10-19
Applicant: ASM IP Holding B.V.
Inventor: Charles Dezelah , Eric James Shero , Qi Xie , Giuseppe Alessio Verni , Petro Deminskyi
IPC: C23C16/06 , C23C16/455 , C23C16/52
CPC classification number: C23C16/45534 , C23C16/45553 , C23C16/52
Abstract: The manufacture of semiconductor devices may include methods of forming vanadium metal on a substrate. The methods comprise providing a substrate in a reaction chamber, providing a vanadium precursor to the reaction chamber in a vapor phase and providing a reducing agent to the reaction chamber in a vapor phase to form vanadium metal on the substrate.
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公开(公告)号:US20240014012A9
公开(公告)日:2024-01-11
申请号:US17744902
申请日:2022-05-16
Applicant: ASM IP Holding B.V.
Inventor: Suvi Haukka , Eric James Shero , Fred Alokozai , Dong Li , Jereld Lee Winkler , Xichong Chen
CPC classification number: H01J37/32495 , C23C16/4405 , C23C16/4404 , C23C16/32
Abstract: A system and method for treating a deposition reactor are disclosed. The system and method remove or mitigate formation of residue in a gas-phase reactor used to deposit doped metal films, such as aluminum-doped titanium carbide films or aluminum-doped tantalum carbide films. The method includes a step of exposing a reaction chamber to a treatment reactant that mitigates formation of species that lead to residue formation.
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