INSPECTION METHOD, LITHOGRAPHIC APPARATUS, MASK AND SUBSTRATE
    2.
    发明申请
    INSPECTION METHOD, LITHOGRAPHIC APPARATUS, MASK AND SUBSTRATE 有权
    检验方法,光刻设备,掩模和基板

    公开(公告)号:US20160313656A1

    公开(公告)日:2016-10-27

    申请号:US15104212

    申请日:2014-11-20

    IPC分类号: G03F7/20

    CPC分类号: G03F7/70641 G03F7/70683

    摘要: A method and apparatus for obtaining focus information relating to a lithographic process. The method includes illuminating a target, the target having alternating first and second structures, wherein the form of the second structures is focus dependent, while the form of the first structures does not have the same focus dependence as that of the second structures, and detecting radiation redirected by the target to obtain for that target an asymmetry measurement representing an overall asymmetry of the target, wherein the asymmetry measurement is indicative of focus of the beam forming the target. An associated mask for forming such a target, and a substrate having such a target.

    摘要翻译: 一种用于获得与光刻工艺相关的焦点信息的方法和装置。 该方法包括照亮目标,目标具有交替的第一和第二结构,其中第二结构的形式是聚焦依赖的,而第一结构的形式不具有与第二结构相同的焦点依赖性,并且检测 由目标重定向的辐射以为该目标获得表示目标的总体不对称性的不对称测量,其中不对称测量指示形成目标的波束的焦点。 用于形成这种靶的相关掩模和具有这种靶的基片。

    Method of Determining Focus, Inspection Apparatus, Patterning Device, Substrate and Device Manufacturing Method
    3.
    发明申请
    Method of Determining Focus, Inspection Apparatus, Patterning Device, Substrate and Device Manufacturing Method 有权
    确定焦点的方法,检查装置,图案化装置,基板和装置的制造方法

    公开(公告)号:US20150338749A1

    公开(公告)日:2015-11-26

    申请号:US14410496

    申请日:2013-06-03

    IPC分类号: G03F7/20

    摘要: A method of determining focus of a lithographic apparatus has the following steps. Using the lithographic process to produce first and second structures on the substrate, the first structure has features which have a profile that has an asymmetry that depends on the focus and an exposure perturbation, such as dose or aberration. The second structure has features which have a profile that is differently sensitive to focus than the first structure and which is differently sensitive to exposure perturbation than the first structure. Scatterometer signals are used to determine a focus value used to produce the first structure. This may be done using the second scatterometer signal, and/or recorded exposure perturbation settings used in the lithographic process, to select a calibration curve for use in determining the focus value using the first scatterometer signal or by using a model with parameters related to the first and second scatterometer signals.

    摘要翻译: 确定光刻设备的焦点的方法具有以下步骤。 使用光刻工艺在衬底上产生第一和第二结构,第一结构具有特征,其具有取决于焦点和曝光扰动(例如剂量或像差)的不对称性的轮廓。 第二结构具有这样的特征,其具有与第一结构不同的焦点敏感性,并且与第一结构不同的曝光扰动敏感度。 散射仪信号用于确定用于产生第一结构的聚焦值。 这可以使用第二散射仪信号和/或在光刻处理中使用的记录的曝光扰动设置来完成,以使用第一散射仪信号来选择用于确定聚焦值的校准曲线,或者通过使用具有与 第一和第二散射仪信号。

    Inspection Apparatus, Inspection Method, Lithographic Apparatus and Manufacturing Method
    7.
    发明申请
    Inspection Apparatus, Inspection Method, Lithographic Apparatus and Manufacturing Method 有权
    检验仪器,检验方法,平版印刷设备及制造方法

    公开(公告)号:US20170023867A1

    公开(公告)日:2017-01-26

    申请号:US15214067

    申请日:2016-07-19

    IPC分类号: G03F7/20 G01B11/27 G01B11/02

    摘要: Disclosed is a method of monitoring a lithographic process parameter, such as focus and/or dose, of a lithographic process. The method comprises acquiring a first and a second target measurement using respectively a first measurement configuration and a second measurement configuration, and determining the lithographic process parameter from a first metric derived from said first target measurement and said second target measurement. The first metric may be difference. Also disclosed are corresponding measurement and lithographic apparatuses, a computer program and a method of manufacturing devices.

    摘要翻译: 公开了一种监测光刻工艺参数的方法,例如光刻工艺的焦点和/或剂量。 该方法包括分别采用第一测量配置和第二测量配置获取第一和第二目标测量,以及根据从所述第一目标测量和所述第二目标测量导出的第一度量来确定光刻处理参数。 第一个度量可能是不同的。 还公开了相应的测量和光刻设备,计算机程序和制造设备的方法。

    Method of Measuring a Characteristic
    8.
    发明申请
    Method of Measuring a Characteristic 审中-公开
    测量特性的方法

    公开(公告)号:US20140199634A1

    公开(公告)日:2014-07-17

    申请号:US14213649

    申请日:2014-03-14

    IPC分类号: G03F7/00

    CPC分类号: G03F7/0035 G03F7/70466

    摘要: During a multiple patterning process every nth element of the pattern is removed. The removal of the elements of the patterns happens after the pattern has been printed into the radiation sensitive material or etched into substrate. Advantageously, the original mask is not varied, and another exposure step is used to remove the elements of the pattern.

    摘要翻译: 在多次图案化处理期间,除去图案的每个第n个元素。 在将图案印刷到辐射敏感材料中或蚀刻到基底中之后,去除图案的元素。 有利地,原始掩模不变,并且使用另一曝光步骤来去除图案的元件。