公开(公告)号：US20130003322A1

公开(公告)日：2013-01-03

申请号：US13407612

申请日：2012-02-28

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： H05K1/00

CPC分类号： H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

摘要翻译： 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US20130081568A1

公开(公告)日：2013-04-04

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05C5/02 ,  B05C13/02 ,  B05C11/00

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

公开(公告)号：US09155203B2

公开(公告)日：2015-10-06

申请号：US13463580

申请日：2012-05-03

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： B05B7/06 ,  B05C13/02 ,  H01L21/4763 ,  H05K3/02 ,  H05K3/40 ,  H05K1/18 ,  H05K3/28

CPC分类号： H05K3/022 ,  H05K1/189 ,  H05K3/0091 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/0191 ,  Y10T156/10

摘要： According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

摘要翻译： 根据一个实施例，一种装置包括：被配置为部分地在第一导体层的表面上提供第二导体层的器件; 配置为在所述第一导体层的表面上部分地提供第一绝缘层的器件; 在第一导体层和设置在第一导体层的表面上的第一绝缘层的状态下，将第一导体层，第二导体层，第一绝缘层和第三导体层集成的器件为 从与第一导体层相对的一侧覆盖第三导体层; 通过以通过积分获得的结构部分地去除第一导体层和第三导体层中的至少一个而形成导体图案的装置; 以及被配置为覆盖所述结构的两侧的装置。

公开(公告)号：US08742264B2

公开(公告)日：2014-06-03

申请号：US13407612

申请日：2012-02-28

申请人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

发明人： Akihiko Happoya ,  Yasuki Torigoshi ,  Sadahiro Tamai

IPC分类号： H05K1/11

CPC分类号： H04N5/64 ,  H05K1/0393 ,  H05K3/281 ,  H05K3/4069 ,  H05K2201/1034 ,  H05K2203/0278

摘要： According to one embodiment, an electronic apparatus includes a housing and a flexible printed wiring board in the housing. The flexible printed wiring board includes a via, an insulator, a first conductive pattern, and a second conductive pattern. The insulator around the via includes a first surface and a second surface opposite to the first surface. The first conductive pattern is connected to the via on the first surface. The second conductive pattern is connected to the via on the second surface.

摘要翻译： 根据一个实施例，电子设备包括壳体和壳体中的柔性印刷线路板。 柔性印刷布线板包括通孔，绝缘体，第一导电图案和第二导电图案。 通孔周围的绝缘体包括第一表面和与第一表面相对的第二表面。 第一导电图案连接到第一表面上的通孔。 第二导电图案连接到第二表面上的通孔。

公开(公告)号：US20090188702A1

公开(公告)日：2009-07-30

申请号：US12334413

申请日：2008-12-12

申请人： Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

发明人： Kiyomi Muro ,  Akihiko Happoya ,  Yasuki Torigoshi

IPC分类号： H05K1/00

CPC分类号： H05K1/0218 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0393 ,  H05K1/095 ,  H05K3/281 ,  H05K3/4664 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09618

摘要： An embodiment of a flexible printed wiring board includes: a base layer comprising one surface and the other surface, the one surface being exposed; a signal layer formed on the other surface of the base layer; a cover layer stacked on the base layer to cover the signal layer; and a ground layer coated on the cover layer to cover the signal layer, the ground layer comprising a conductive paste in which metal powder and metal nanoparticles are mixed.

摘要翻译： 柔性印刷布线板的一个实施例包括：基底层，其包括一个表面和另一个表面，该一个表面被暴露; 形成在所述基底层的另一个表面上的信号层; 层叠在所述基底层上以覆盖所述信号层的覆盖层; 以及涂覆在覆盖层上以覆盖信号层的接地层，所述接地层包括其中混合金属粉末和金属纳米颗粒的导电浆料。

公开(公告)号：US20100025085A1

公开(公告)日：2010-02-04

申请号：US12421411

申请日：2009-04-09

申请人： Yasuki Torigoshi ,  Kiyomi Muro

发明人： Yasuki Torigoshi ,  Kiyomi Muro

IPC分类号： H05K1/00 ,  B44C1/22

CPC分类号： H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K3/16 ,  H05K3/243 ,  H05K3/281 ,  H05K2201/0317 ,  H05K2201/09681 ,  H05K2201/09736 ,  H05K2201/09745 ,  H05K2203/0369

摘要： According to one embodiment, an electronic apparatus includes a casing and a flexible printed wiring board contained in the casing. The flexible printed wiring board includes an insulating layer, which is sheet-like, a signal line formed on a first surface of the insulating layer, and a ground layer, which is conductive and formed on a second surface of the insulating layer opposite to the first surface. The ground layer includes a mesh portion having a mesh structure and a thin film portion which fills cells in the mesh structure of the mesh portion.

摘要翻译： 根据一个实施例，电子设备包括壳体和容纳在壳体中的柔性印刷线路板。 柔性印刷电路板包括片状的绝缘层，形成在绝缘层的第一表面上的信号线和接地层，导电并形成在绝缘层的与该绝缘层相反的第二表面上 第一表面。 接地层包括具有网状结构的网状部分和填充网格部分的网格结构中的单元的薄膜部分。

公开(公告)号：US20090055846A1

公开(公告)日：2009-02-26

申请号：US12107523

申请日：2008-04-22

申请人： Yasuki Torigoshi

发明人： Yasuki Torigoshi

IPC分类号： G11B17/03

CPC分类号： G11B17/0407 ,  G11B17/056 ,  G11B33/122

摘要： According to one embodiment, an optical disk drive apparatus has a case, a disk tray, a first connector, a second connector, and a positioning mechanism. The first connector is provided on the case. The second connector is provided on the disk tray, has a conduction with the first connector when the disk tray is in a first position, and is separated from the first connector when the disk tray is in a second position. The positioning mechanism is provided between the case and the disk tray, and positions the second connector with respect to the first connector when the disk tray moves from the second position to the first position.

摘要翻译： 根据一个实施例，光盘驱动装置具有壳体，盘托架，第一连接器，第二连接器和定位机构。 第一个连接器设置在外壳上。 第二连接器设置在盘托盘上，当盘托盘处于第一位置时与第一连接器导通，并且当盘托盘处于第二位置时与第一连接器分离。 定位机构设置在壳体和盘托架之间，并且当盘托盘从第二位置移动到第一位置时，将第二连接器相对于第一连接器定位。