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公开(公告)号：US06295724B1
公开(公告)日：2001-10-02
申请号：US09428750
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： B23P1900
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US6018866A
公开(公告)日：2000-02-01
申请号：US23552
申请日：1998-02-13
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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公开(公告)号：US5809641A
公开(公告)日：1998-09-22
申请号：US637947
申请日：1996-04-25
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US06437254B1
公开(公告)日：2002-08-20
申请号：US09938402
申请日：2001-08-24
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01R909
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US6115912A
公开(公告)日：2000-09-12
申请号：US428751
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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