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公开(公告)号：US06295724B1
公开(公告)日：2001-10-02
申请号：US09428750
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： B23P1900
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US6018866A
公开(公告)日：2000-02-01
申请号：US23552
申请日：1998-02-13
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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公开(公告)号：US5809641A
公开(公告)日：1998-09-22
申请号：US637947
申请日：1996-04-25
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US06437254B1
公开(公告)日：2002-08-20
申请号：US09938402
申请日：2001-08-24
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01R909
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US6115912A
公开(公告)日：2000-09-12
申请号：US428751
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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公开(公告)号：US5685070A
公开(公告)日：1997-11-11
申请号：US374979
申请日：1995-01-19
IPC分类号： H01L23/12 , H01L23/50 , H01L23/538 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/42 , H05K3/46 , H05K3/34
CPC分类号： H05K1/112 , H01L23/50 , H01L23/5383 , H01L23/5384 , H01L23/5385 , H05K3/4602 , H01L2224/16 , H01L2924/01046 , H01L2924/01078 , H01L2924/01087 , H01L2924/15173 , H05K2201/09472 , H05K2201/09509 , H05K2201/09518 , H05K2201/09536 , H05K2201/10674 , H05K2203/0207 , H05K2203/1394 , H05K2203/1581 , H05K3/0023 , H05K3/0044 , H05K3/0047 , H05K3/0094 , H05K3/4644 , H05K3/4652 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165
摘要： A printed circuit board or card for direct chip attachment that includes at least one power core, at least one signal plane that is adjacent to the power core, and plated through holes for electrical connection is provided. In addition, a layer of dielectric material is adjacent the power core and a circuitized conductive layer is adjacent the dielectric material, followed by a layer of photosensitive dielectric material adjacent the conductive layer. Photodeveloped blind vias for subsequent connection to the power core and drilled blind vias for subsequent connection to the signal plane are provided. Also provided is process for fabricating the printed circuit board or card for direct chip attachment.
摘要翻译： 提供了一种用于直接芯片附接的印刷电路板或卡，其包括至少一个电源核心，与功率核心相邻的至少一个信号平面以及用于电连接的电镀通孔。 此外，电介质材料层与功率芯相邻，并且电路化的导电层与电介质材料相邻，随后是与导电层相邻的一层光敏电介质材料。 提供用于随后连接到电源核心的盲孔和用于后续连接到信号平面的钻孔盲孔。 还提供了用于制造用于直接芯片附接的印刷电路板或卡的工艺。
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公开(公告)号：US6034875A
公开(公告)日：2000-03-07
申请号：US98977
申请日：1998-06-17
IPC分类号： H01L21/60 , H01L23/367 , H05K3/22 , H05K3/34 , H05K7/20
CPC分类号： H01L24/81 , H01L23/3672 , H01L24/75 , H05K3/3494 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2224/75 , H01L2224/755 , H01L2224/75745 , H01L2224/7999 , H01L2224/81801 , H01L2224/98 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H05K2201/0116 , H05K2201/10522 , H05K2201/10674 , H05K2201/10734 , H05K2203/0195 , H05K2203/0776 , H05K2203/081 , H05K2203/1121 , H05K2203/176 , H05K2203/304 , H05K3/225 , Y10T29/4913 , Y10T29/4973 , Y10T29/49815 , Y10T29/49821 , Y10T29/53174
摘要： A method and apparatus for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.
摘要翻译： 一种用于在返工过程中冷却基板上的电气部件的方法和设备。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。
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公开(公告)号：US06453537B1
公开(公告)日：2002-09-24
申请号：US09431751
申请日：1999-11-10
IPC分类号： B23P1902
CPC分类号： H01L24/81 , H01L23/3672 , H01L24/75 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2224/75 , H01L2224/755 , H01L2224/75745 , H01L2224/7999 , H01L2224/81801 , H01L2224/98 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/014 , H01L2924/14 , H01L2924/3025 , H05K3/225 , H05K3/3494 , H05K2201/0116 , H05K2201/10522 , H05K2201/10674 , H05K2201/10734 , H05K2203/0195 , H05K2203/0776 , H05K2203/081 , H05K2203/1121 , H05K2203/176 , H05K2203/304 , Y10T29/4913 , Y10T29/4973 , Y10T29/49815 , Y10T29/49821 , Y10T29/53174 , H01L2224/0401
摘要： A method for cooling electrical components on a substrate during a rework process. A block of a porous, thermally conductive material, saturated with a liquid, is positioned on an electrical component to be cooled. During the rework processing of an adjacent electrical component, the liquid in the porous, thermally conductive block vaporizes, thereby maintaining the temperature of the electrical component below its reflow temperature. A second thermally conductive block, in thermal contact with the porous, thermally conductive block, and the substrate on which the electronic component to be cooled is attached, is positioned between the electronic component to be cooled and the electronic component undergoing rework. A supply of liquid is provided to the porous, thermally conductive block to maintain the temperature of the electronic component to be cooled at a predetermined level for a specified period of time.
摘要翻译： 一种在返工过程中冷却基板上的电气部件的方法。 用液体饱和的多孔导热材料块被定位在待冷却的电气部件上。 在相邻电气部件的返工处理期间，多孔导热块中的液体蒸发，从而将电气部件的温度保持在其回流温度以下。 与多孔导热块热接触的第二导热块以及待冷却的电子部件所附接的基板位于待冷却的电子部件和正在进行返工的电子部件之间。 向多孔导热块提供液体供应，以将待冷却的电子部件的温度保持在预定水平一段指定的时间。
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