公开(公告)号：US06295724B1

公开(公告)日：2001-10-02

申请号：US09428750

申请日：1999-10-28

申请人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

发明人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC分类号： B23P1900

CPC分类号： H05K3/3436 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0047 ,  H05K3/225 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

公开(公告)号：US6018866A

公开(公告)日：2000-02-01

申请号：US23552

申请日：1998-02-13

申请人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

发明人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC分类号： H01L23/12 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  B23P19/00

CPC分类号： H05K3/3436 ,  H05K3/225 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  H05K3/0047 ,  H05K3/341 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

公开(公告)号：US5809641A

公开(公告)日：1998-09-22

申请号：US637947

申请日：1996-04-25

申请人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

发明人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC分类号： H01L23/12 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/3436 ,  H05K3/225 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  H05K3/0047 ,  H05K3/341 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

公开(公告)号：US06437254B1

公开(公告)日：2002-08-20

申请号：US09938402

申请日：2001-08-24

申请人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

发明人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC分类号： H01R909

CPC分类号： H05K3/3436 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K3/0047 ,  H05K3/225 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。

公开(公告)号：US6115912A

公开(公告)日：2000-09-12

申请号：US428751

申请日：1999-10-28

申请人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

发明人： Alan Harris Crudo ,  John Gillette Davis ,  Christian Robert Le Coz ,  Mark Vincent Pierson ,  Amit Kumar Sarkhel ,  Ajit Kumar Trivedi

IPC分类号： H01L23/12 ,  H05K3/00 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/3436 ,  H05K3/225 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2201/0949 ,  H05K2201/10287 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/175 ,  H05K3/0047 ,  H05K3/341 ,  H05K3/429 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49723 ,  Y10T29/49726 ,  Y10T29/49728 ,  Y10T29/4973 ,  Y10T29/49734 ,  Y10T29/49815 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53274

摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.

公开(公告)号：US06759738B1

公开(公告)日：2004-07-06

申请号：US09250524

申请日：1999-02-16

申请人： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

发明人： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

IPC分类号： H01L2348

CPC分类号： H01L24/12 ,  B23K1/0016 ,  B23K2101/40 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05624 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2924/01004

摘要： A substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

摘要翻译： 衬底设置有与表面接触或凸起连通的通孔。 连接材料糊料被迫通过筛网上的孔到基板上的触点的区域阵列上，然后当膏被加热和冷却以将接合材料转移到触点上时，屏幕被偏压到基板上。 或者，将接合材料糊剂强制进入筛网，然后将基板放置在具有与焊膏接触的基板的凸起接触的区域阵列的屏幕上，然后将该浆料加热并冷却以将材料转移到 颠簸 接合材料可以是焊膏，导电粘合剂糊或瞬态液体粘合膏。 衬底可以是半导体芯片衬底，柔性或刚性有机衬底或涂覆以形成电介质表面的金属衬底。 此外，基板可以是计算机芯片，芯片载体基板或电路板基板。 该过程可用于制造包括信息处理系统的前述组件的倒装芯片，球栅阵列模块，列网格阵列模块，电路板和附接结构。

公开(公告)号：US5872051A

公开(公告)日：1999-02-16

申请号：US510401

申请日：1995-08-02

申请人： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

发明人： Kenneth Michael Fallon ,  Christian Robert Le Coz ,  Mark Vincent Pierson

IPC分类号： B23K1/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/34 ,  H01L21/288 ,  H01L21/58

CPC分类号： H01L24/12 ,  B23K1/0016 ,  H01L21/4867 ,  H01L21/563 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H05K3/3484 ,  B23K2201/40 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/05184 ,  H01L2224/05572 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1182 ,  H01L2224/1184 ,  H01L2224/13006 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/742 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3463

摘要： A process within substrate is provided with vias communicating with surface contacts or bumps. Joining material paste is forced through holes in a screen onto an area array of the contacts on the substrate then the screen is biased against the substrate as the paste is heated and cooled to transfer the joining material onto the contacts. Alternately, joining material paste is forced into the screen and then a substrate is placed onto the screen with an area array of bump contacts of the substrate in contact with the solder paste, and then the paste is heated and cooled to transfer the material onto the bumps. The joining material may be a solder paste, conductive adhesive paste, or transient liquid bond paste. The substrate may be a semiconductor chip substrate, flexible or rigid organic substrate, or a metal substrate coated to form a dielectric surface. Also, the substrate may be a computer chip, chip carrier substrate or a circuit board substrate. The process may be used to produce flip chips, ball grid array modules, column grid array modules, circuit boards, and attachment structures of the preceding components including information handling systems.

摘要翻译： 衬底内的工艺设有与表面接触或凸块连通的通孔。 连接材料糊料被迫通过筛网上的孔到基板上的触点的区域阵列上，然后当膏被加热和冷却以将接合材料转移到触点上时，屏幕被偏压到基板上。 或者，将接合材料糊剂强制进入筛网，然后将基板放置在具有与焊膏接触的基板的凸起接触的区域阵列的屏幕上，然后将该浆料加热并冷却以将材料转移到 颠簸 接合材料可以是焊膏，导电粘合剂糊或瞬态液体粘合膏。 衬底可以是半导体芯片衬底，柔性或刚性有机衬底或涂覆以形成电介质表面的金属衬底。 此外，基板可以是计算机芯片，芯片载体基板或电路板基板。 该过程可用于制造包括信息处理系统的前述组件的倒装芯片，球栅阵列模块，列网格阵列模块，电路板和附接结构。

公开(公告)号：US5735450A

公开(公告)日：1998-04-07

申请号：US669902

申请日：1996-06-21

申请人： Craig Grant Heim ,  Christian Robert Le Coz ,  Russell H. Lewis

发明人： Craig Grant Heim ,  Christian Robert Le Coz ,  Russell H. Lewis

IPC分类号： B23K1/012 ,  B23K1/018

CPC分类号： B23K1/012 ,  B23K2201/42

摘要： An apparatus for heating a module mounted on a card includes a heating chamber adapted to receive the card and module, a nozzle adapted to surround the module and provide a flow of heated gas thereover, and a heated support surface for heating a bottom surface of a card immediately underlying the module. The method of removing and replacing a module on a card includes preheating the card and module prior to heating the contact sites to a solder reflow temperature and also preheating a card and a replacement module to an equilibrium temperature prior to increasing the temperature of the contact sites to the reflow temperature. The apparatus and method embodying the present invention effectively addresses the problem of providing a faster heating cycle, and a more even temperature distribution across the contact sites of the module and card.

摘要翻译： 用于加热安装在卡上的模块的装置包括适于接收卡和模块的加热室，适于包围模块并在其上提供加热气体流的喷嘴，以及加热支撑表面，用于加热 立即在模块底下的卡。 移除和更换卡上的模块的方法包括在将接触部位加热到回流焊温度之前预热卡和模块，并且在增加接触部位的温度之前将卡和替换模块预热到平衡温度 到回流温度。 体现本发明的装置和方法有效地解决了提供更快的加热循环以及跨模块和卡的接触位置更均匀的温度分布的问题。

公开(公告)号：US5762258A

公开(公告)日：1998-06-09

申请号：US686241

申请日：1996-07-23

申请人： Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

发明人： Christian Robert Le Coz ,  Donald Ivan Mead ,  Roger James Stockholm

IPC分类号： B23K3/06 ,  H05K3/34 ,  B23K3/00

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K2201/42 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10S269/903 ,  Y10T29/49144 ,  Y10T29/53191

摘要： A method of precisely positioning a quantity of conductive spacers (e.g., spherically shaped solder balls) on respective conductive pads (e.g., copper pads) of an underlying substrate (e.g., an FR4 printed circuit board or flexible circuit member) wherein the spacers are forcibly retained within a suitable holder and, when engaged with the respective pads, reflowed to effect a plurality of positive electrical connections between the spacers and pads. Such forcible retention allows for partial extension of the spacers from the invention's carrier, which is also disclosed.

公开(公告)号：US06574780B2

公开(公告)日：2003-06-03

申请号：US09845395

申请日：2001-04-30

申请人： Christian Robert Le Coz

发明人： Christian Robert Le Coz

IPC分类号： G06F1750

CPC分类号： G06F17/5068 ,  G06F2217/40

摘要： For a mulitlayer chip carrier module a computer program receives a large plurality of module design parameters and provides as output a graphical representation of the design together with text files that rate module wireability, including die pad position, attachment of each die pad to its BGA pad, and net cross-over; and quantifies the number of redistribution layers; summarizes input parameters; creates a truth table for rating wireability and thermal requirements; and provides cost sensitive parameters.

摘要翻译： 对于多层芯片载体模块，计算机程序接收大量多个模块设计参数，并提供设计的图形表示以及评估模块可线性的文本文件（包括管芯焊盘位置），将每个管芯焊盘附接到其BGA焊盘 ，和网络交叉; 并量化再分配层的数量; 总结输入参数; 创建一个用于评估线性和热要求的真值表; 并提供成本敏感的参数。