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公开(公告)号：US06295724B1
公开(公告)日：2001-10-02
申请号：US09428750
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： B23P1900
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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2.发明授权Method for producing circuit board assemblies using surface mount components with finely spaced leads 失效使用具有精细间隔引线的表面贴装元件生产电路板组件的方法公开(公告)号：US06167615A
公开(公告)日：2001-01-02
申请号：US09056101
申请日：1998-04-06
申请人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
发明人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
IPC分类号： H05K334
CPC分类号： H05K3/3421 , H01L2224/48247 , H01L2924/181 , H05K1/111 , H05K3/1216 , H05K3/1225 , H05K3/3484 , H05K2201/09427 , H05K2201/10689 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012
摘要： Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
摘要翻译： 在基板上的电路和具有非常精细间隔的引线的部件之间需要电连接的情况下，在要与电路形成这种连接的点处，在基板上形成焊盘。 使用具有特定公差的具有厚度和孔径的特定描述的模板来沉积焊膏。 该部件定位成使得其连接的引线与相应的焊盘相邻，并且通过回流形成焊料合金的一致且可靠的电接头的焊膏来完成电连接。
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3.发明授权Method for producing circuit board assemblies using surface mount components with finely spaced leads 失效使用具有精细间隔引线的表面贴装元件生产电路板组件的方法公开(公告)号：US06545229B1
公开(公告)日：2003-04-08
申请号：US09639621
申请日：2000-08-15
申请人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
发明人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
IPC分类号： H01R1204
CPC分类号： H05K3/3421 , H01L2224/48247 , H01L2924/181 , H05K1/111 , H05K3/1216 , H05K3/1225 , H05K3/3484 , H05K2201/09427 , H05K2201/10689 , H05K2203/043 , H05K2203/0465 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , H01L2924/00012
摘要： Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
摘要翻译： 在基板上的电路和具有非常精细间隔的引线的部件之间需要电连接的情况下，在要与电路形成这种连接的点处，在基板上形成焊盘。 使用具有特定公差的具有厚度和孔径的特定描述的模板来沉积焊膏。 该部件定位成使得其连接的引线与相应的焊盘相邻，并且通过回流形成焊料合金的一致且可靠的电接头的焊膏来完成电连接。
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公开(公告)号：US5874043A
公开(公告)日：1999-02-23
申请号：US768907
申请日：1996-12-17
CPC分类号： H05K3/3463 , B23K35/262 , C22C13/00 , B23K35/025 , H01L2224/16225 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311
摘要： A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.
摘要翻译： 高固态温度，高使用温度，高强度三元焊料合金，焊膏和方法。 该合金含有至少约70重量％的锡的主要比例，约6.5至约7.5重量％的选择性限制量的银，余量为铟。
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公开(公告)号：US5742483A
公开(公告)日：1998-04-21
申请号：US627806
申请日：1996-04-10
申请人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
发明人： Bao-Tong Ma , Amit Kumar Sarkhel , Ping Kwong Seto
CPC分类号： H05K3/3421 , H05K3/3484 , H01L2224/48247 , H01L2924/181 , H05K1/111 , H05K2201/09427 , H05K2201/10689 , H05K2203/043 , H05K2203/0465 , H05K3/1216 , H05K3/1225 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： Where an electrical connection is needed between an electric circuit on a substrate and a component with very finely spaced leads, pads are formed on the substrate at points where such connections to the circuit are to be made. A solder paste is deposited using a particular, described stencil having a thickness and apertures with specific tolerances. The component is positioned so that its leads to be attached are contiguous with corresponding pads, and the electrical connections are completed by reflowing the solder paste forming consistent and reliable electrical joints of solder alloy.
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公开(公告)号：US06437254B1
公开(公告)日：2002-08-20
申请号：US09938402
申请日：2001-08-24
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
IPC分类号： H01R909
CPC分类号： H05K3/3436 , H01L2224/16225 , H01L2924/15311 , H05K3/0047 , H05K3/225 , H05K3/341 , H05K3/429 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
摘要翻译： 一种用于有效地修复或重新加工具有焊球栅格阵列的印刷电路板的方法和装置，其有效和最小的成本包括以下步骤：钻出电镀通孔以切断在一个表面上的球栅阵列垫之间的电连接 印刷电路板和印刷电路板的相对表面上的内部电路和电路; 将具有围绕其一部分的绝缘套筒的销插入钻出孔中，该销已经在一端附接有用于连接到印刷电路板的一个表面上的球栅阵列的导线，另一端的柱 用于将电线附接到柱的销; 该销具有沿其长度的止动件，以控制销在钻孔中的垂直定位，该引脚被称为通孔更换（VR）引脚。 或者，在电镀通孔被钻出之后，绝缘电线可以插入孔中，绝缘体从延伸超出印刷电路板的一个表面的导线的长度去除。 线的裸露长度平行于印刷电路板的表面弯曲并通过焊料回流工艺附着在其上。 在狗骨构造中，线形成在接收焊球的印刷电路板的表面上的焊盘周围。
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公开(公告)号：US6115912A
公开(公告)日：2000-09-12
申请号：US428751
申请日：1999-10-28
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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公开(公告)号：US5729440A
公开(公告)日：1998-03-17
申请号：US784796
申请日：1997-01-16
IPC分类号： B23K1/00 , B23K35/00 , B23K35/26 , H01L21/56 , H01L21/60 , H05K3/34 , H05K7/02 , H05K1/11 , H01L23/48
CPC分类号： H01L24/81 , B23K1/0016 , B23K35/26 , B23K35/262 , B23K35/268 , H01L21/563 , H05K3/3463 , B23K2201/40 , B23K35/001 , H01L2224/13111 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H05K2201/094 , H05K3/3431 , Y10T29/49144
摘要： The method for soldering a chip to a substrate to form a module and then soldering the module to a circuit board includes selecting a three level hierarchy of solders by the temperature required to melt. By this method, a module can be soldered to and de-soldered from a circuit board without affecting adversely the solder between the chip and the substrate. The package formed by this method is free of faults that are caused frequently during both manufacture and service.
摘要翻译： 将芯片焊接到基板以形成模块，然后将模块焊接到电路板的方法包括通过熔化所需的温度来选择焊料的三级层级。 通过该方法，可以将模块焊接到电路板上并从其中去除焊接，而不会不利地影响芯片和衬底之间的焊料。 通过该方法形成的包装在制造和服务期间都不会产生频繁的故障。
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公开(公告)号：US6018866A
公开(公告)日：2000-02-01
申请号：US23552
申请日：1998-02-13
申请人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
发明人： Alan Harris Crudo , John Gillette Davis , Christian Robert Le Coz , Mark Vincent Pierson , Amit Kumar Sarkhel , Ajit Kumar Trivedi
CPC分类号： H05K3/3436 , H05K3/225 , H01L2224/16225 , H01L2924/15311 , H05K2201/0949 , H05K2201/10287 , H05K2201/10734 , H05K2201/10992 , H05K2203/041 , H05K2203/175 , H05K3/0047 , H05K3/341 , H05K3/429 , Y02P70/613 , Y10T29/49124 , Y10T29/49139 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49153 , Y10T29/49156 , Y10T29/49165 , Y10T29/49723 , Y10T29/49726 , Y10T29/49728 , Y10T29/4973 , Y10T29/49734 , Y10T29/49815 , Y10T29/53174 , Y10T29/53178 , Y10T29/53274
摘要： A method and apparatus for efficiently repairing or reworking a printed circuit board having a solder ball grid array thereon efficiently and at minimum cost includes the steps of drilling out a plated-through hole to sever electrical connections between a ball grid array pad on one surface of the printed circuit board and internal circuits and circuits on an opposite surface of the printed circuit board; inserting a pin having an insulated sleeve surrounding a portion thereof into the drilled-out hole, the pin having attached to one end a wire for attachment to the ball grid array on one surface of the printed circuit board and a post at the other end of the pin for attachment of a wire to the post; the pin having a stop along its length to control vertical positioning of the pin in the drilled-out hole, the pin referred to as a via replacement (VR) pin. Alternately, after the plated through hole is drilled out, an insulated wire may be inserted into the hole with insulation removed from the length of the wire which extends beyond one surface of the printed circuit board. The bare length of wire is bent parallel to the surface of the printed circuit board and attached thereto by a solder reflow process. In a dog bone configuration, the wire is formed around a pad on the surface of the printed circuit board which receives the solder ball.
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公开(公告)号：US6010060A
公开(公告)日：2000-01-04
申请号：US54375
申请日：1998-04-02
CPC分类号： H05K3/3463 , B23K35/262 , C22C13/00 , B23K35/025 , H01L2224/16225 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311
摘要： A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.
摘要翻译： 高固态温度，高使用温度，高强度三元焊料合金，焊膏和方法。 该合金含有至少约70重量％的锡的主要比例，约6.5至约7.5重量％的选择性限制量的银，余量为铟。
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