摘要:
A circuit that receives input signals from a transmitter via proximity communication, such as capacitively coupled proximity communication, is described. Because proximity communication may block DC content, the circuit may restore the DC content of input signals. In particular, a refresh circuit in the circuit may short inputs of the circuit to each other at least once per clock cycle (which sets a null value). Furthermore, a feedback circuit ensures that, if there is a signal transition in the input signals during a current clock cycle, it is passed through to an output node of the circuit. On the other hand, if there is no signal transition in the input signals during the current clock cycle, the feedback circuit may select the appropriate output value on the output node based on the output value during the immediately preceding clock cycle.
摘要:
A circuit that receives input signals from a transmitter via proximity communication, such as capacitively coupled proximity communication, is described. Because proximity communication may block DC content, the circuit may restore the DC content of input signals. In particular, a refresh circuit in the circuit may short inputs of the circuit to each other at least once per clock cycle (which sets a null value). Furthermore, a feedback circuit ensures that, if there is a signal transition in the input signals during a current clock cycle, it is passed through to an output node of the circuit. On the other hand, if there is no signal transition in the input signals during the current clock cycle, the feedback circuit may select the appropriate output value on the output node based on the output value during the immediately preceding clock cycle.
摘要:
A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要:
A semiconductor die is described. This semiconductor die includes a driver, and a spatial alignment transducer that is electrically coupled to the driver and which is proximate to a surface of the semiconductor die. The driver establishes a spatially varying electric charge distribution in at least one direction in the spatial alignment transducer, thereby facilitating determination of a spatial alignment in more than one direction between the semiconductor die and another semiconductor die. In particular, a spatial alignment sensor proximate to the surface of the other semiconductor die may detect an electrical field (or an associated electrostatic potential) associated with the spatially varying electric charge distribution. This detected electric field may allow the vertical spacing between the surfaces of the semiconductor dies and/or an angular alignment of the semiconductor dies to be determined.
摘要:
Embodiments of a circuit for use with an inter-chip connection that has a variable complex impedance (which can be conductive, capacitive or both), a system that includes the circuit, and a communication technique are described. This inter-chip connection may be formed between a microspring or an anisotropic film and a metal connector on or proximate to a surface of a chip. Moreover, the circuit may mitigate signal distortion associated with the variable complex impedance. For example, the circuit may include an internal impedance that is electrically coupled in series with the metal connector, and that has an impedance which dominates the variable complex impedance over a range of operating frequencies. Separately or additionally, the circuit may be adapted to correct for the signal distortion.
摘要:
A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad.
摘要:
A multiple access Proximity Communication system in which electrical elements on an integrated circuit chip provide the multiplexing of multiple signals to a single electrical receiving element on another chip. Multiple pads formed on one chip and receiving separate signals may be capacitively coupled to one large pad on the other chip. Multiple inductive coils on one chip may be magnetically coupled to one large coil on another chip or inductive coils on three or more chips may be used for either transmitting or receiving. The multiplexing may be based on time, frequency, or code.
摘要:
One embodiment of the present invention provides a system that facilitates reducing the power needed for proximity communication. This system includes an integrated circuit with an array of transmission pads that transmit a signal using proximity communication. A layer of fill metal is located in proximity to this array of transmission pads, wherein the layer of fill metal is “floating” (e.g., not connected to any signal). Leaving this layer of fill metal floating reduces the parasitic capacitance for the array of transmission pads, which can reduce the amount of power needed to transmit the signal.
摘要:
A system of protecting a proximity communication system against electrostatic discharge (ESD). The proximity communication system includes two chips, each having an array of electrical pads at its surface and covered by a thin dielectric layer such that capacitive coupling circuits are formed between the chips when they are joined together. In at least one of the chips, an additional protection pad is formed away from the array, and heavy protection circuitry is connected to it. Its surface is exposed through the dielectric surface over it such that, when an ESD aggressor approaches, the discharge occurs to the protection pad.
摘要:
A diversity proximity communication system formed on two juxtaposed chips, one having a two-dimensional array of transmit elements, the other having a two-dimensional array of receive elements. The receive and transmit elements need not be aligned and may have nominal alignment of one transmit element overlapping the corners of four receive elements. The elements may be electrical pads capacitively coupled across the interface. Signals of four different multiplexing groups, e.g., time-multiplexed, are supplied to transmitting elements in a 2×2 array. Signals from four receive elements in a 2×2 array are amplified, combined, and demultiplexed for the selected multiplexing group. The gains for the four signals to be combined are differentially controlled to increase the signal-to-noise ratio. The amplification may be determined by the overlap between each of the receive elements and the transmit element of the selected multiplexing group.