摘要:
Light-emitting devices are described herein. Some embodiments relate to light-emitting diodes with light-emitting sections that are independently electrically addressable. The devices may be used in a variety of applications including illumination and general lighting.
摘要:
Light-emitting devices can include a package that supports one or more light-emitting die (e.g., light-emitting diode die, laser diode die) and which can ensure mechanically stability, can facilitate electrical and/or thermal coupling with light-emitting die, and can manipulate the manner by which light generated by the die is emitted out of the light-emitting device. The package can also facilitate the integration of the light-emitting devices in various components and systems. For example, suitable packages may facilitate the use of light-emitting devices in components and systems such as light-emitting panel assemblies, LCD back lighting, general lighting, decorative or display lighting, automotive lighting, and other types of lighting components and systems.
摘要:
Illumination systems, which include at least one light source (e.g., LED and/or laser diode), light sensor, and a power source are described. In certain embodiments, a light sensor and a microprocessor are used to detect light emitted by a light source and to adjust the power signal provided to the light source at least partially based on the detected light. Some embodiments may enable the color point and/or brightness of the emitted light to be controlled at least partially based on the detected light. The illumination systems may be designed to be used as a liquid crystal display (LCD), general lighting apparatus, or any other illumination device.
摘要:
Light emitting diode systems are disclosed. An optical display system that includes a light emitting diode (LED) and a cooling system is disclosed. The cooling system is configured so that, during use, the cooling system regulates a temperature of the light emitting diode.
摘要:
The embodiments described herein are drawn generally towards illumination assemblies including light emitting devices. In some embodiments, the illumination assemblies including chip-scale packaged light-emitting devices and optical elements.
摘要:
Methods of forming light-emitting structures, as well as related devices and/or systems are described. In some cases, the methods utilize a layer transfer and/or layer separation step(s) used to form such structures.