公开(公告)号：US07582167B2

公开(公告)日：2009-09-01

申请号：US11866505

申请日：2007-10-03

申请人： Andrzej Kaszuba ,  Sophia M. Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario David Silvetti ,  Tom K. Cho ,  Indrajit Lahiri ,  Surinder S. Bedi

发明人： Andrzej Kaszuba ,  Sophia M. Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario David Silvetti ,  Tom K. Cho ,  Indrajit Lahiri ,  Surinder S. Bedi

IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67126 ,  C23C16/4401

摘要： In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.

摘要翻译： 在一个实施例中，本发明是用于减少沿基板支撑件的可移动轴的颗粒捕获的保护环。 在一个实施例中，保护环包括大致环形的保护环，其定位在形成在套筒内的步骤中，该套筒环绕轴。 保护环被定位成基本上密封将轴与套筒分开的间隙，使得在间隙内行进或被捕获在间隙中的颗粒和异物的量显着减少。 在另一个实施例中，保护环包括具有内周边和外周边的基部，连接到内周边的第一凸缘，联接到外周边的第二凸缘和将第一凸缘与第二凸缘分开的连续通道 。 第一凸缘适于用作容纳轴的位移的弹簧。

公开(公告)号：US07279049B2

公开(公告)日：2007-10-09

申请号：US10775769

申请日：2004-02-05

申请人： Andrzej Kaszuba ,  Sophia M. Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario David Silvetti ,  Tom K. Cho ,  Indrajit Lahiri ,  Surinder S. Bedi

发明人： Andrzej Kaszuba ,  Sophia M. Velastegui ,  Visweswaren Sivaramakrishnan ,  Pyongwon Yim ,  Mario David Silvetti ,  Tom K. Cho ,  Indrajit Lahiri ,  Surinder S. Bedi

IPC分类号： C23C16/00 ,  C23F1/00 ,  H01L21/306

CPC分类号： H01L21/67126 ,  C23C16/4401

摘要： In one embodiment, the invention is a guard ring for reducing particle entrapment along a moveable shaft of a substrate support. In one embodiment, the guard ring comprises a substantially annular guard ring positioned within a step formed in a sleeve that circumscribes the shaft. The guard ring is positioned to substantially seal a gap separating the shaft from the sleeve, so that the amount of particles and foreign matter that travel within or become trapped in the gap is substantially reduced. In another embodiment, a guard ring comprises a base portion having an inner perimeter and an outer perimeter, a first flange coupled to the inner perimeter, a second flange coupled to the outer perimeter, and a continuous channel separating the first flange from the second flange. The first flange is adapted to function as a spring that accommodates displacement of the shaft.

摘要翻译： 在一个实施例中，本发明是用于减少沿基板支撑件的可移动轴的颗粒捕获的保护环。 在一个实施例中，保护环包括大致环形的保护环，其定位在形成在套筒内的步骤中，该套筒环绕轴。 保护环被定位成基本上密封将轴与套筒分开的间隙，使得在间隙内行进或被捕获在间隙中的颗粒和异物的量显着减少。 在另一个实施例中，保护环包括具有内周边和外周边的基部，连接到内周边的第一凸缘，联接到外周边的第二凸缘和将第一凸缘与第二凸缘分开的连续通道 。 第一凸缘适于用作容纳轴的位移的弹簧。

公开(公告)号：US20100145513A1

公开(公告)日：2010-06-10

申请号：US12712091

申请日：2010-02-24

申请人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

发明人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

IPC分类号： G05B15/00 ,  G06F19/00 ,  H01L21/67

CPC分类号： H01L21/67259 ,  H01L21/67766 ,  H01L21/681

摘要： A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.

摘要翻译： 提供了与传感系统配合以校正机器人运动的机器人定位系统。 感测系统与常规用于控制机器人运动的传感器分离，从而提供机器人真实位置的可重复检测。 在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。 机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。 马达传感器为控制器提供用于移动基板支架的马达驱动信息。 解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

公开(公告)号：US07107125B2

公开(公告)日：2006-09-12

申请号：US10697731

申请日：2003-10-29

申请人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

发明人： Pyongwon Yim ,  Satish Sundar ,  Vinay Shah ,  Mario David Silvetti ,  Douglas Kitajima ,  Venkatesh Babu ,  Visweswaren Sivaramakrishnan ,  Indrajit Lahiri ,  Surinder Bedi

IPC分类号： G05B15/00 ,  G05B19/00

CPC分类号： H01L21/67259 ,  H01L21/67766 ,  H01L21/681

摘要： A robotic positioning system that cooperates with a sensing system to correct robot motion is provided. The sensing system is decoupled from the sensors used conventionally to control the robot's motion, thereby providing repeatable detection of the robot's true position. In one embodiment, the positioning system includes a robot, a controller, a motor sensor and a decoupled sensor. The robot has at least one motor for manipulating a linkage controlling the displacement of a substrate support coupled thereto. The motor sensor is provides the controller with motor actuation information utilized to move the substrate support. The decoupled sensor provides information indicative of the true position the substrate support that may be utilized to correct the robot's motion.

摘要翻译： 提供了与传感系统配合以校正机器人运动的机器人定位系统。 感测系统与常规用于控制机器人运动的传感器分离，从而提供机器人真实位置的可重复检测。 在一个实施例中，定位系统包括机器人，控制器，马达传感器和去耦传感器。 机器人具有至少一个用于操纵联动装置的电动机，控制联接到其上的衬底支架的位移。 马达传感器为控制器提供用于移动基板支架的马达驱动信息。 解耦传感器提供指示可用于校正机器人运动的基板支撑件的真实位置的信息。

公开(公告)号：US07024105B2

公开(公告)日：2006-04-04

申请号：US10684054

申请日：2003-10-10

申请人： Mark A. Fodor ,  Sophia M. Velastegui ,  Soovo Sen ,  Visweswaren Sivaramakrishnan ,  Peter Wai-Man Lee ,  Mario David Silvetti

发明人： Mark A. Fodor ,  Sophia M. Velastegui ,  Soovo Sen ,  Visweswaren Sivaramakrishnan ,  Peter Wai-Man Lee ,  Mario David Silvetti

IPC分类号： F26B19/00

CPC分类号： C23C16/4585 ,  C23C16/46 ,  H01L21/68735

摘要： A substrate heater assembly for supporting a substrate of a predetermined standardized diameter during processing is provided. In one embodiment, the substrate heater assembly includes a body having an upper surface, a lower surface and an embedded heating element. A substrate support surface is formed in the upper surface of the body and defines a portion of a substrate receiving pocket. An annular wall is oriented perpendicular to the upper surface and has a length of at least one half a thickness of the substrate. The wall bounds an outer perimeter of the substrate receiving pocket and has a diameter less than about 0.5 mm greater than the predetermined substrate diameter.

摘要翻译： 提供了一种用于在处理期间支撑预定标准直径的基板的基板加热器组件。 在一个实施例中，基板加热器组件包括具有上表面，下表面和嵌入式加热元件的主体。 衬底支撑表面形成在主体的上表面中并且限定衬底接收袋的一部分。 环形壁垂直于上表面定向并且具有衬底的至少一半厚度的长度。 该壁限定了基板接收槽的外周边，并具有小于预定基板直径的直径小于约0.5mm的直径。

公开(公告)号：US07094313B2

公开(公告)日：2006-08-22

申请号：US10829520

申请日：2004-04-21

申请人： Eller Y. Juco ,  Visweswaren Sivaramakrishnan ,  Mario David Silvetti ,  Talex Sajoto

发明人： Eller Y. Juco ,  Visweswaren Sivaramakrishnan ,  Mario David Silvetti ,  Talex Sajoto

IPC分类号： C23F1/02 ,  C23C14/00 ,  C23C16/00

CPC分类号： H01J37/32082 ,  C23C16/5096 ,  H01J37/32183

摘要： A substrate processing system is provided with a processing chamber, an alternating voltage supply, and an impedance matching network. The processing chamber holds a substrate during processing and the alternating voltage supply is connected with the processing chamber to capacitively couple energy to a plasma formed within the processing chamber. The impedance matching network is coupled with the alternating voltage supply and has a variable resistive element and a variable reactive element, whose states respectively define distinct real and imaginary parts of an impedance.

摘要翻译： 衬底处理系统设置有处理室，交流电压源和阻抗匹配网络。 处理室在处理期间保持基板，并且交流电压供应与处理室连接以将能量电容耦合到处理室内形成的等离子体。 阻抗匹配网络与交流电源耦合，并具有可变电阻元件和可变无功元件，其状态分别定义阻抗的不同实部和虚部。

公开(公告)号：US06911403B2

公开(公告)日：2005-06-28

申请号：US10645675

申请日：2003-08-20

申请人： Lihua Li ,  Tsutomu Tanaka ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Dian Sugiarto ,  Visweswaren Sivaramakrishnan ,  Peter Wai-Man Lee ,  Mario David Silvetti

发明人： Lihua Li ,  Tsutomu Tanaka ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Dian Sugiarto ,  Visweswaren Sivaramakrishnan ,  Peter Wai-Man Lee ,  Mario David Silvetti

IPC分类号： C23C16/40 ,  C23C16/509 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L21/31

CPC分类号： C23C16/5096 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/3122 ,  H01L21/31612 ,  H01L21/31633 ,  H01L21/76801

摘要： A method for depositing an organosilicate layer on a substrate includes varying one or more processing conditions during a process sequence for depositing an organosilicate layer from a gas mixture comprising an organosilicon compound in the presence of RF power in a processing chamber. In one aspect, the distance between the substrate and a gas distribution manifold in the processing chamber is varied during processing. Preferably, the method of depositing an organosilicate layer minimizes plasma-induced damage to the substrate.

摘要翻译： 用于在衬底上沉积有机硅酸盐层的方法包括在用于在处理室中的RF功率存在下从包含有机硅化合物的气体混合物沉积有机硅酸盐层的工艺顺序期间改变一个或多个处理条件。 在一个方面，在处理过程中，衬底与处理室中的气体分配歧管之间的距离是变化的。 优选地，沉积有机硅酸盐层的方法使等离子体对衬底的损伤最小化。

公开(公告)号：US07374393B2

公开(公告)日：2008-05-20

申请号：US11398218

申请日：2006-04-05

申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B65G61/00

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

公开(公告)号：US20120034848A1

公开(公告)日：2012-02-09

申请号：US13204541

申请日：2011-08-05

申请人： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan

发明人： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan

IPC分类号： B24B1/00 ,  B24B41/06

CPC分类号： B24B41/06 ,  B24B37/32 ,  B24B41/067

摘要： A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

摘要翻译： 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和外环。 所述内环具有被配置为接触位于所述基板安装表面上的基板的上表面的下表面，外表面和从所述下表面向下延伸的面向内的表面，并且构造成周向地围绕所述基板的边缘， 所述内环可相对于所述基板安装表面垂直移动。 外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面，并且外环可相对于基板安装表面和内环而垂直地可移动。

公开(公告)号：US07374391B2

公开(公告)日：2008-05-20

申请号：US11315873

申请日：2005-12-22

申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

IPC分类号： B25J15/00

CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。