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公开(公告)号：US20080003402A1
公开(公告)日：2008-01-03
申请号：US11717587
申请日：2007-03-13
申请人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae Park
发明人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae Park
CPC分类号： H01L24/14 , H01L21/4828 , H01L21/4853 , H01L21/563 , H01L23/49811 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/73203 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H05K3/061 , H05K3/4007 , H05K2201/0367 , H05K2203/0369 , H05K2203/0597 , H05K2203/1476 , Y10T29/49126 , Y10T428/24174 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.
摘要翻译： 一种方法包括将最终的耐蚀刻材料施加到工艺衬底，使得最终耐蚀刻材料至少部分地覆盖与衬底成一体的第一微接触部分并从衬底的表面向上突出，并且蚀刻表面 衬底，以便将第二微接触部分留在第一微接触部分下方并与之成一体，最后的抗蚀刻材料在另外的蚀刻步骤期间至少部分地保护第一微接触部分免受蚀刻。 微电子单元包括衬底以及从衬底沿垂直方向突出的多个微接点，每个微接触器包括邻近衬底的基极区域和远离衬底的尖端区域，每个微接触体具有作为第一功能的水平尺寸 在基部区域中垂直位置，并且其是尖端区域中垂直位置的第二函数。
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公开(公告)号：US20050284658A1
公开(公告)日：2005-12-29
申请号：US11166982
申请日：2005-06-24
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae Park , Belgacem Haba
IPC分类号： H01L23/13 , H01L23/31 , H01L23/498 , H01L25/065 , H05K1/11 , H05K3/06 , H05K3/40
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。
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公开(公告)号：US08604348B2
公开(公告)日：2013-12-10
申请号：US13155825
申请日：2011-06-08
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。
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公开(公告)号：US08046912B2
公开(公告)日：2011-11-01
申请号：US12321210
申请日：2009-01-16
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K3/02
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。
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公开(公告)号：US07453157B2
公开(公告)日：2008-11-18
申请号：US11140312
申请日：2005-05-27
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of etched conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes an encapsulating mold material in contact with the microelectronic element and the compliant layer, whereby the encapsulating mold material overlies the outer region of the flexible substrate.
摘要翻译： 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括多个蚀刻的导电柱，其暴露在所述柔性基板的表面处并与所述微电子元件电互连，其中所述导电柱中的至少一个设置在所述柔性基板的外部区域中，并且设置柔性层 在微电子元件的第一面和柔性基板之间，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的封装模具材料，由此封装模具材料覆盖在柔性基板的外部区域上。
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公开(公告)号：US08329581B2
公开(公告)日：2012-12-11
申请号：US13183122
申请日：2011-07-14
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
IPC分类号： H01L21/44
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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公开(公告)号：US20090133254A1
公开(公告)日：2009-05-28
申请号：US12321210
申请日：2009-01-16
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H05K3/02
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。
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公开(公告)号：US08641913B2
公开(公告)日：2014-02-04
申请号：US11717587
申请日：2007-03-13
申请人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae M. Park
发明人： Belgacem Haba , Yoichi Kubota , Teck-Gyu Kang , Jae M. Park
IPC分类号： H01L21/302
CPC分类号： H01L24/14 , H01L21/4828 , H01L21/4853 , H01L21/563 , H01L23/49811 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13099 , H01L2224/16225 , H01L2224/73203 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01084 , H01L2924/01322 , H01L2924/014 , H05K3/061 , H05K3/4007 , H05K2201/0367 , H05K2203/0369 , H05K2203/0597 , H05K2203/1476 , Y10T29/49126 , Y10T428/24174 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method includes applying a final etch-resistant material to an in-process substrate so that the final etch-resistant material at least partially covers first microcontact portions integral with the substrate and projecting upwardly from a surface of the substrate, and etching the surface of the substrate so as to leave second microcontact portions below the first microcontact portions and integral therewith, the final etch-resistant material at least partially protecting the first microcontact portions from etching during the further etching step. A microelectronic unit includes a substrate, and a plurality of microcontacts projecting in a vertical direction from the substrate, each microcontact including a base region adjacent the substrate and a tip region remote from the substrate, each microcontact having a horizontal dimension which is a first function of vertical location in the base region and which is a second function of vertical location in the tip region.
摘要翻译： 一种方法包括将最终的耐蚀刻材料施加到工艺衬底，使得最终耐蚀刻材料至少部分地覆盖与衬底成一体的第一微接触部分并从衬底的表面向上突出，并且蚀刻表面 衬底，以便将第二微接触部分留在第一微接触部分下方并与之成一体，最后的抗蚀刻材料在另外的蚀刻步骤期间至少部分地保护第一微接触部分免受蚀刻。 微电子单元包括衬底以及从衬底沿垂直方向突出的多个微接点，每个微接触器包括邻近衬底的基极区域和远离衬底的尖端区域，每个微接触体具有作为第一功能的水平尺寸 在基部区域中垂直位置，并且其是尖端区域中垂直位置的第二函数。
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公开(公告)号：US20110260320A1
公开(公告)日：2011-10-27
申请号：US13155825
申请日：2011-06-08
申请人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
发明人： Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
IPC分类号： H01L23/498
CPC分类号： H05K1/0366 , H01L23/13 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/48091 , H01L2224/4824 , H01L2224/49175 , H01L2225/0651 , H01L2225/0652 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/12042 , H01L2924/15311 , H01L2924/1532 , H05K3/06 , H05K3/4007 , H05K2201/0355 , H05K2201/0367 , H05K2201/09481 , H05K2203/063 , H05K2203/0733 , Y10T29/49126 , Y10T29/49156 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
摘要翻译： 封装的微电子元件包括连接部件，其包括承载远离外表面（26）的迹线（58）的介电层（22），从该迹线延伸并突出超过电介质外表面的柱（48） ）暴露在介电层的外表面处，焊盘通过迹线连接到柱。 电介质元件覆盖在微电子元件的前表面上，暴露在微电子元件的前表面上的触点（74）通过诸如引线键的细长引线（76）连接到焊盘。 还公开了制造连接部件的方法。
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公开(公告)号：US07999397B2
公开(公告)日：2011-08-16
申请号：US12789683
申请日：2010-05-28
申请人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
发明人： Belgacem Haba , Masud Beroz , Teck-Gyu Kang , Yoichi Kubota , Sridhar Krishnan , John B. Riley, III , Ilyas Mohammed
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/3677 , H01L23/4985 , H01L24/48 , H01L25/105 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/4824 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01004 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15311 , H01L2924/15312 , H01L2924/181 , H01L2924/19041 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.
摘要翻译： 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。
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