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公开(公告)号：USD719535S1
公开(公告)日：2014-12-16
申请号：US29457055
申请日：2013-06-06
设计人： Takashi Iino , Kazuki Matsumura , Nodoka Oyamada
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2.发明授权Manufacturing method of light emitting device in a flip-chip configuration with reduced package size 有权具有减小的封装尺寸的倒装芯片配置的发光器件的制造方法公开(公告)号：US09490398B2
公开(公告)日：2016-11-08
申请号：US14650787
申请日：2013-11-25
发明人： Nodoka Oyamada , Kenji Imazu , Shusaku Mochizuki
CPC分类号： H01L33/50 , H01L33/36 , H01L33/486 , H01L33/60 , H01L2224/13 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058
摘要： Provided is an LED device which is compact while having good luminous efficiency and a focused light distribution. This LED device is provided with: a reflective frame around the outer periphery of the LED device; an LED die which has a transparent insulating substrate, a semiconductor layer formed on the bottom surface of the transparent insulating substrate, and an outer connection electrode disposed on the semiconductor layer; and a fluorescent member which is disposed on at least the top surface of the LED die and which converts the wavelength of the light emitted from the LED die. On the inside of the reflective frame is an inclined surface in contact with the lateral surface of the fluorescent member, and the inclined surface is formed such that the inner diameter of the reflective frame widens from the bottom surface towards the top surface of the LED die. Also provided is a manufacturing method of the LED device.
摘要翻译： 提供一种紧凑的LED装置，同时具有良好的发光效率和聚焦的光分布。 该LED装置设置有：围绕LED装置的外周的反射框架; 具有透明绝缘基板的LED管芯，形成在透明绝缘基板的底面上的半导体层和配置在半导体层上的外部连接电极; 以及荧光部件，其设置在所述LED管芯的至少顶面上，并且转换从所述LED管芯发射的光的波长。 在反射框架的内侧是与荧光部件的侧面接触的倾斜面，并且倾斜面形成为使得反射框架的内径从LED模具的底面朝向顶部表面变宽 。 还提供了LED器件的制造方法。
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3.发明授权公开(公告)号：US09224720B2
公开(公告)日：2015-12-29
申请号：US14624896
申请日：2015-02-18
发明人： Junji Miyashita , Kosuke Tsuchiya , Nodoka Oyamada
CPC分类号： H01L25/0753 , H01L24/06 , H01L33/38 , H01L33/486 , H01L33/62 , H01L2224/0603 , H01L2224/48227 , H01L2224/73265 , H01L2924/12041 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： In an aspect of the present invention, a light-emitting device includes a substrate; a first electrode and a second electrode arranged on an upper surface of the substrate with a gap between the first electrode and the second electrode, the gap being positioned at a central portion of the upper surface of the substrate; a first light-emitting diode element electrically mounted on the first electrode; and a second light-emitting diode element electrically mounted on the second electrode, wherein the first electrode includes a first inner portion and a first outer portion that are two equal area portions divided at a center line of the first electrode, and the first light-emitting diode element is mounted on the first outer portion of the first electrode, and wherein the second electrode includes a second inner portion and a second outer portion that are two equal area portions divided at a center line of the second electrode, and the second light-emitting diode element is mounted on the second outer portion of the second electrode.
摘要翻译： 在本发明的一个方面中，发光装置包括：基板; 第一电极和第二电极，其布置在所述基板的上表面上，在所述第一电极和所述第二电极之间具有间隙，所述间隙位于所述基板的上表面的中心部分; 电气安装在第一电极上的第一发光二极管元件; 以及电气安装在所述第二电极上的第二发光二极管元件，其中，所述第一电极包括第一内部部分和第一外部部分，所述第一内部部分和所述第一外部部分是在所述第一电极的中心线处划分的两个相等的面积部分， 发光二极管元件安装在第一电极的第一外部部分上，并且其中第二电极包括第二内部部分和第二外部部分，该第二内部部分和第二外部部分是在第二电极的中心线处划分的两个等面积部分，第二光 发光二极管元件安装在第二电极的第二外部部分上。
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公开(公告)号：USD724548S1
公开(公告)日：2015-03-17
申请号：US29484695
申请日：2014-03-12
设计人： Takashi Iino , Nodoka Oyamada
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公开(公告)号：US08987774B2
公开(公告)日：2015-03-24
申请号：US14076176
申请日：2013-11-09
发明人： Nodoka Oyamada
CPC分类号： H01L33/505 , H01L33/56 , H01L2224/16225 , H01L2224/97 , H01L2933/0033
摘要： An object of the present invention is to provide an LED device that can achieve a large total luminance flux while also achieving a structure, using a phosphor sheet, that is compact in size and easy to produce and whose color emission is easy to manage, and a method for producing such an LED device. A semiconductor light-emitting device including a semiconductor light-emitting element which includes a transparent insulating substrate and a semiconductor layer formed on a lower surface of the transparent insulating substrate, a phosphor resin which covers a side face of the transparent insulating substrate, and which wavelength-converts a portion of light emitted from the semiconductor light-emitting element, and a phosphor sheet which covers an upper surface of the phosphor resin and is bonded to the transparent insulating substrate, wherein the phosphor sheet has a top plan shape that is identical with an outer peripheral shape of the phosphor resin, and the top plan shape of the phosphor sheet defines an overall outer plan shape of the device.
摘要翻译： 本发明的目的是提供一种能够实现大的总亮度通量的LED器件，同时还实现使用尺寸紧凑且易于制造并且颜色发射易于管理的荧光体片材的结构，以及 一种用于制造这种LED器件的方法。 一种半导体发光装置，包括：半导体发光元件，其包括透明绝缘基板和形成在所述透明绝缘基板的下表面上的半导体层;覆盖所述透明绝缘基板的侧面的荧光体树脂， 将从半导体发光元件发射的光的一部分进行波长转换，以及覆盖荧光体树脂的上表面并与透明绝缘基板接合的荧光体片，其中，荧光体片具有相同的顶部平面形状 具有荧光体树脂的外周形状，并且荧光体片的顶部平面形状限定了该装置的整体外部平面形状。
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公开(公告)号：US08853934B2
公开(公告)日：2014-10-07
申请号：US13651805
申请日：2012-10-15
发明人： Nodoka Oyamada
CPC分类号： H01L33/505 , F21K9/64 , H01L27/322 , H01L33/508 , H01L33/54 , H01L51/5036 , H01L2224/14 , H01L2224/16225 , H01L2924/18161 , H01L2933/0041
摘要： A light-emitting device includes a phosphor plate including an upper surface, a lower surface opposite to the upper surface, a peripheral side surface extending between a peripheral edge of the upper surface and a peripheral edge of the lower surface of the phosphor plate, a light-emitting element including an upper surface, a lower surface opposite to the upper surface, a peripheral side surface extending between a peripheral edge of the upper surface and a peripheral edge of the lower surface of the light-emitting element. The lower surface of the phosphor plate includes a concave that is filled with an adhesive and the lower surface of the phosphor plate is disposed on the upper surface of the light-emitting element. The phosphor plate may contain a first phosphor, and the adhesive filled in the concave that is provided at the lower surface of the phosphor plate may include a second phosphor.
摘要翻译： 发光装置包括：荧光体板，包括上表面，与上表面相对的下表面，在上表面的周边边缘和荧光体板的下表面的周缘之间延伸的周边表面， 发光元件包括上表面，与上表面相对的下表面，在上表面的周边边缘和发光元件的下表面的周边边缘之间延伸的周边侧表面。 荧光体板的下表面包括填充有粘合剂的凹部，并且荧光体板的下表面设置在发光元件的上表面上。 荧光体板可以包含第一荧光体，并且填充在设置在荧光体板的下表面处的凹部中的粘合剂可以包括第二荧光体。
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7.发明授权公开(公告)号：US09293674B2
公开(公告)日：2016-03-22
申请号：US14176375
申请日：2014-02-10
CPC分类号： H01L33/62 , H01L24/96 , H01L33/38 , H01L33/382 , H01L33/46 , H01L33/505 , H01L33/54 , H01L2224/04105 , H01L2924/12036 , H01L2924/181 , H01L2924/3511 , H01L2924/00
摘要： A semiconductor device has a light emitting element, and a resin layer; the light emitting element includes a semiconductor laminated body in which a first semiconductor layer and a second semiconductor layer are laminated in sequence, a second electrode connected to the second semiconductor layer on an upper surface of the second semiconductor layer that forms an upper surface of the semiconductor laminated body, and a first electrode connected to the first semiconductor layer on an upper surface of the first semiconductor layer in which a portion of the second semiconductor layer on one surface of the semiconductor laminated body is removed and a portion of the first semiconductor layer is exposed; and the resin layer is configured to cover at least a side surface of the light emitting element, and an upper surface of the resin layer is lower than the upper surface of the semiconductor laminated body.
摘要翻译： 半导体器件具有发光元件和树脂层; 发光元件包括依次层叠有第一半导体层和第二半导体层的半导体层叠体，在形成第二半导体层的上表面的第二半导体层的上表面上连接到第二半导体层的第二电极 半导体层叠体以及在第一半导体层的上表面与第一半导体层连接的第一电极，其中半导体层叠体的一个表面上的第二半导体层的一部分被去除，并且第一半导体层的一部分 被暴露 并且所述树脂层被构造成覆盖所述发光元件的至少一个侧表面，并且所述树脂层的上表面低于所述半导体层叠体的上表面。
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公开(公告)号：USD724039S1
公开(公告)日：2015-03-10
申请号：US29484696
申请日：2014-03-12
设计人： Takashi Iino , Nodoka Oyamada
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公开(公告)号：USD780134S1
公开(公告)日：2017-02-28
申请号：US29513011
申请日：2014-12-24
设计人： Takashi Iino , Nodoka Oyamada
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公开(公告)号：US11145795B2
公开(公告)日：2021-10-12
申请号：US16095586
申请日：2017-05-30
发明人： Koki Hirasawa , Nodoka Oyamada , Yuji Omori
IPC分类号： H01L33/54 , H01L25/075 , H01L33/58 , H01L33/64 , H05K1/02 , H05K1/18 , H01L33/56 , H01L23/31 , H01L21/56 , H01L25/13 , H01L33/48
摘要： A light-emitting apparatus and a method for manufacturing the same are provided in which heat dissipation from an LED package to a heat sinking substrate is improved while electrical insulation therebetween is ensured. The light-emitting apparatus includes a circuit board having an opening, an LED package inserted into the opening from the back side of the circuit board and having an edge connected to the back side of the circuit board, and a heat sinking substrate disposed on the back side of the circuit board so as to be in contact with the LED package. The LED package includes: an LED device; a lead frame including a mounting part having an upper surface on which the LED device is mounted and a back surface being in contact with the heat sinking substrate, and an electrode part being thinner than the mounting part and electrically connected to the LED device and the circuit board; an insulating resin filled between the mounting part and the electrode part and between the electrode part and the heat sinking substrate; and a sealing resin filled into a region on the mounting part to seal the LED device.
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