公开(公告)号：US20120248631A1

公开(公告)日：2012-10-04

申请号：US13495603

申请日：2012-06-13

申请人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

发明人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

IPC分类号： H01L23/15 ,  H01L21/78

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/02122 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03848 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/3223 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10335 ,  H01L2924/10338 ,  H01L2924/10351 ,  H01L2924/10373 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer.

摘要翻译： 公开了半导体器件的制造方法。 提供了具有与第一表面相对的第一表面和第二表面的半导体晶片。 提供了在接合表面处具有至少一个空腔和开口的第一玻璃基板。 将第一玻璃基板接合到半导体晶片的第一表面，使得金属焊盘被布置在第一玻璃基板的相应空腔或开口内。 加工半导体晶片的第二表面。 在半导体晶片的加工的第二表面上形成至少一个金属化区域。

公开(公告)号：US08546934B2

公开(公告)日：2013-10-01

申请号：US13495603

申请日：2012-06-13

申请人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

发明人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

IPC分类号： H01L23/12 ,  H01L23/06

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/02122 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03848 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/3223 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10335 ,  H01L2924/10338 ,  H01L2924/10351 ,  H01L2924/10373 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer.

摘要翻译： 公开了半导体器件的制造方法。 提供了具有与第一表面相对的第一表面和第二表面的半导体晶片。 提供了在接合表面处具有至少一个空腔和开口的第一玻璃基板。 将第一玻璃基板接合到半导体晶片的第一表面，使得金属焊盘被布置在第一玻璃基板的相应空腔或开口内。 对半导体晶片的第二表面进行加工。 在半导体晶片的加工的第二表面上形成至少一个金属化区域。

公开(公告)号：US20120012994A1

公开(公告)日：2012-01-19

申请号：US12837155

申请日：2010-07-15

申请人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

发明人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

IPC分类号： H01L23/15 ,  H01L21/50

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/02122 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03848 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/3223 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10335 ,  H01L2924/10338 ,  H01L2924/10351 ,  H01L2924/10373 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer.

公开(公告)号：US08202786B2

公开(公告)日：2012-06-19

申请号：US12837155

申请日：2010-07-15

申请人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

发明人： Carsten Von Koblinski ,  Gerald Lackner ,  Karin Schrettlinger ,  Markus Ottowitz

IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01L23/49811 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3135 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L29/7802 ,  H01L29/8611 ,  H01L2224/02122 ,  H01L2224/03015 ,  H01L2224/03019 ,  H01L2224/0332 ,  H01L2224/0345 ,  H01L2224/0346 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03848 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05166 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/32225 ,  H01L2224/3223 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/4823 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10335 ,  H01L2924/10338 ,  H01L2924/10351 ,  H01L2924/10373 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallization region is formed on the machined second surface of the semiconductor wafer.

摘要翻译： 公开了半导体器件的制造方法。 提供了具有与第一表面相对的第一表面和第二表面的半导体晶片。 提供了在接合表面处具有至少一个空腔和开口的第一玻璃基板。 将第一玻璃基板接合到半导体晶片的第一表面，使得金属焊盘被布置在第一玻璃基板的相应空腔或开口内。 加工半导体晶片的第二表面。 在半导体晶片的加工的第二表面上形成至少一个金属化区域。

公开(公告)号：US08857805B2

公开(公告)日：2014-10-14

申请号：US11851976

申请日：2007-09-07

申请人： Gerald Lackner ,  Christian Maier ,  Francisco Javier Santos Rodriguez

发明人： Gerald Lackner ,  Christian Maier ,  Francisco Javier Santos Rodriguez

IPC分类号： B23Q3/00 ,  H01L21/304 ,  H01L21/683 ,  H01L21/687 ,  H01L21/268 ,  H01L21/02 ,  H01L21/306 ,  H01L21/3065

CPC分类号： H01L21/683 ,  H01L21/02104 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/6875 ,  H01L2221/6834

摘要： Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.

摘要翻译： 所讨论的一些实施例涉及一种用于保持衬底的装置，包括具有用于半导体晶片的表面的主体的主体，所述表面具有第一表面区域，半导体晶片的第一区域可以在该第一表面区域上，第二表面 半导体晶片的第二区域可以在其上放置的区域，其中第二表面区域相对于第一表面区域突出。

公开(公告)号：US20110169290A1

公开(公告)日：2011-07-14

申请号：US12823293

申请日：2010-06-25

申请人： Mohammad Hossein Sheikhha ,  Gerald Lackner ,  Frank Seifert

发明人： Mohammad Hossein Sheikhha ,  Gerald Lackner ,  Frank Seifert

IPC分类号： B62D33/08

CPC分类号： B62D31/006 ,  B60J5/06 ,  B60J5/08 ,  B62D21/14 ,  B62D25/00 ,  B62D31/003 ,  B62D47/003

摘要： A motor vehicle includes a body having an enclosed passenger cell which is accessible by a door and forms a component of a front body part and a rear body part. The front and rear parts are movable in length direction of the motor vehicle relative to one another to change a length dimension of the motor vehicle. A covering module covers a gap in the passenger cell between the front and rear body parts.

摘要翻译： 机动车辆包括具有封闭的乘客舱的主体，其可由门接近并形成前主体部分和后主体部件的部件。 前部和后部可相对于彼此在机动车辆的长度方向上移动以改变机动车辆的长度尺寸。 覆盖模块覆盖前身和后身部分之间的乘客舱中的间隙。

公开(公告)号：US20080064184A1

公开(公告)日：2008-03-13

申请号：US11851976

申请日：2007-09-07

申请人： Gerald Lackner ,  Christian Maier ,  Francisco Javier Santos Rodriguez

发明人： Gerald Lackner ,  Christian Maier ,  Francisco Javier Santos Rodriguez

IPC分类号： H01L21/461 ,  B23Q3/00

CPC分类号： H01L21/683 ,  H01L21/02104 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/3065 ,  H01L21/6835 ,  H01L21/6838 ,  H01L21/68735 ,  H01L21/6875 ,  H01L2221/6834

摘要： Some embodiments discussed relates to an apparatus for holding a substrate, comprising a body with a surface for a semiconductor wafer to rest on, with the surface having a first surface area on which a first area of the semiconductor wafer can rest, and a second surface area on which a second area of the semiconductor wafer can rest, wherein the second surface area protrudes with respect to the first surface area.

摘要翻译： 所讨论的一些实施例涉及一种用于保持衬底的装置，包括具有用于半导体晶片的表面的主体的主体，所述表面具有第一表面区域，半导体晶片的第一区域可以在该第一表面区域上，第二表面 半导体晶片的第二区域可以在其上放置的区域，其中第二表面区域相对于第一表面区域突出。

公开(公告)号：US4791808A

公开(公告)日：1988-12-20

申请号：US124586

申请日：1987-11-24

申请人： Gerald Lackner ,  Karl Simb/u/ rger

发明人： Gerald Lackner ,  Karl Simb/u/ rger

IPC分类号： F02P17/00 ,  F02P17/02 ,  F02P17/12 ,  G01M15/04 ,  G01M15/00

CPC分类号： G01M15/044

摘要： For allocating to the respective cylinders cylinder-specific measured val taken from an internal combustion engine under test with the ignition suppressed the measured values are continuously numbered while the ignition is suppressed. After the suppression of the ignition has ceased the numbering is continued at least until the occurrence of the measured value from a cylinder determined by the ignition, after which, bearing in mind the known firing order of the engine, all the measured values can be allocated to the respective individual cylinders.

摘要翻译： 为了分配到各个气缸，在点火抑制下从被测试的内燃机取出的气缸专用的测量值在点火被抑制的同时连续地被编号。 在点火停止之后停止编号至少直到由点火确定的气缸的测量值发生，之后考虑到发动机的已知点火顺序，可以分配所有测量值 到各个气瓶。

公开(公告)号：US08226144B2

公开(公告)日：2012-07-24

申请号：US12823293

申请日：2010-06-25

申请人： Mohammad Hossein Sheikhha ,  Gerald Lackner ,  Frank Seifert

发明人： Mohammad Hossein Sheikhha ,  Gerald Lackner ,  Frank Seifert

IPC分类号： B62D27/00

CPC分类号： B62D31/006 ,  B60J5/06 ,  B60J5/08 ,  B62D21/14 ,  B62D25/00 ,  B62D31/003 ,  B62D47/003

摘要： A motor vehicle includes a body having an enclosed passenger cell which is accessible by a door and forms a component of a front body part and a rear body part. The front and rear parts are movable in length direction of the motor vehicle relative to one another to change a length dimension of the motor vehicle. A covering module covers a gap in the passenger cell between the front and rear body parts.

摘要翻译： 机动车辆包括具有封闭的乘客舱的主体，其可由门接近并形成前主体部分和后主体部件的部件。 前部和后部可相对于彼此在机动车辆的长度方向上移动以改变机动车辆的长度尺寸。 覆盖模块覆盖前身和后身部分之间的乘客舱中的间隙。

公开(公告)号：US06443195B2

公开(公告)日：2002-09-03

申请号：US09822702

申请日：2001-03-30

申请人： Sandor Palvoelgyi ,  Günther Pozgainer ,  Gerald Lackner ,  Bernhard Maier

发明人： Sandor Palvoelgyi ,  Günther Pozgainer ,  Gerald Lackner ,  Bernhard Maier

IPC分类号： B65B104

CPC分类号： B60K15/0406 ,  B60K15/04 ,  E05B77/42 ,  E05B83/34

摘要： A filler neck for the fuel tank of a motor vehicle with a shutter which is mounted inside the filler neck and which can be actuated by the pump nozzle into an open position for filling the fuel tank and into a closed position via an actuating mechanism. The actuating mechanism of the shutter cooperates with a damping device during the closing movement in such a way that the shutter can be closed with a time delay.

摘要翻译： 一种用于具有快门的机动车辆的燃料箱的填充颈部，其安装在填充管颈内部，并且可由泵喷嘴致动到用于通过致动机构填充燃料箱并进入关闭位置的打开位置。 快门的致动机构在关闭运动期间与阻尼装置配合，使得快门能够以时间延迟关闭。