公开(公告)号：US07099139B2

公开(公告)日：2006-08-29

申请号：US10803789

申请日：2004-03-17

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H01G4/228

CPC分类号： H05K1/162 ,  H01L23/49822 ,  H01L23/642 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/09309 ,  H01L2224/05599

摘要： A base structure is formed from a green material having first and second opposing sides and having a plurality of via openings therein. The green material is then sintered so that the green material becomes a sintered ceramic material and the base structure becomes a sintered ceramic base structure having the via openings. A conductive via is formed in each via opening of the sintered ceramic base structure. First and second capacitor structures are formed on the sintered ceramic base structure, each on a respective side of the sintered ceramic base structure. The power and ground planes of the capacitor structure are connected to the vias. As such, a capacitor structure can be formed and connected to the vias without the need to drill via openings in brittle substrates such as silicon substrates. Capacitor structures on opposing sides provide more capacitance without manufacturing complexities associated with the manufacture of one capacitor structure having a large number of power and ground planes.

摘要翻译： 基部结构由具有第一和第二相对侧并且其中具有多个通孔的绿色材料形成。 然后将生坯材料烧结，使得生坯成为烧结陶瓷材料，并且基体结构变成具有通路孔的烧结陶瓷基体结构。 导电通孔形成在烧结陶瓷基体结构的每个通孔中。 第一和第二电容器结构形成在烧结陶瓷基体结构上，每个在烧结陶瓷基体结构的相应侧上。 电容器结构的电源和接地平面连接到通孔。 因此，可以形成电容器结构并连接到通孔，而不需要在诸如硅衬底的脆性衬底中钻通孔。 相对侧的电容器结构提供更多的电容，而不需要制造与具有大量电源和接地层的一个电容器结构相关联的复杂性。

公开(公告)号：US20090284944A1

公开(公告)日：2009-11-19

申请号：US12509666

申请日：2009-07-27

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H05K1/14

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01L23/49822 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15312 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted. The microprocessor may use a lower voltage power supply level for minimum sized fast transistors in the fast core logic portions of the microprocessor, and a more normal voltage power supply voltage level for the cache memory and I/O transistor portions of the microprocessor. Thus a compact capacitor with multiple power and reference supply levels may be needed to provide the required power for a high frequency IC.

摘要翻译： 一种用于形成用于向诸如集成电路的电气设备提供多个功率和参考电源电压电平的分离薄膜电容器的装置和方法可用于空间受限的应用中，并且在需要非常紧密的电连接的应用中 电力消费者和电源。 空间限制应用和紧密耦合应用的示例可以是诸如微处理器的集成电路（IC）。 要向微处理器供电和调节功率需要紧密耦合，以便响应在高时钟速率微处理器中可能发现的瞬时功率需求，并且微处理器封装内的空间是非常有限的。 微处理器可以在微处理器的快速核心逻辑部分中为最小尺寸的快速晶体管使用较低电压电源电平，以及用于微处理器的高速缓冲存储器和I / O晶体管部分的更正常的电压电源电压电平。 因此，可能需要具有多个功率和参考电源电平的紧凑型电容器来为高频IC提供所需的功率。

公开(公告)号：US07242073B2

公开(公告)日：2007-07-10

申请号：US10925428

申请日：2004-08-24

申请人： Larry E. Mosley ,  Cengiz A. Palanduz

发明人： Larry E. Mosley ,  Cengiz A. Palanduz

IPC分类号： H01L29/00

CPC分类号： H01G4/10 ,  H01L23/50 ,  H01L23/642 ,  H01L28/90 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/19103 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0231

摘要： In one embodiment, a structure and method including an anodic metal oxide substrate used to form a capacitor are described herein.

摘要翻译： 在一个实施例中，本文描述了包括用于形成电容器的阳极金属氧化物衬底的结构和方法。

公开(公告)号：US07176575B2

公开(公告)日：2007-02-13

申请号：US10955944

申请日：2004-09-30

申请人： Larry E. Mosley ,  Cengiz A. Palanduz ,  Victor Prokofiev

发明人： Larry E. Mosley ,  Cengiz A. Palanduz ,  Victor Prokofiev

IPC分类号： H01L23/48

CPC分类号： H01L23/50 ,  H01L23/49805 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/162 ,  H05K2201/0187 ,  H05K2201/10378 ,  H01L2224/0401

摘要： An electronic device includes a material having a first dielectric constant (K) value, and a material having a second dielectric constant (K) value. The first dielectric constant (K) value is lower than the second dielectric constant (K) value. The electronic device also includes input/output connection conductors for transmitting signals to and from a die. The input/output connection conductors are routed through the material of the interposer having the first dielectric constant. The electronic device also includes power connection conductors for delivering power to the die, and ground connection conductors. The power and ground connection conductors are routed through the material having the second dielectric constant.

摘要翻译： 电子器件包括具有第一介电常数（K）值的材料和具有第二介电常数（K）值的材料。 第一介电常数（K）值低于第二介电常数（K）值。 电子设备还包括用于向模具传送信号和从模具传送信号的输入/输出连接导体。 输入/输出连接导体通过具有第一介电常数的插入件的材料布线。 电子设备还包括用于向模具输送功率的电力连接导体和接地连接导体。 电源和接地连接导体穿过具有第二介电常数的材料。

公开(公告)号：US07586756B2

公开(公告)日：2009-09-08

申请号：US11463130

申请日：2006-08-08

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01L23/49822 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15312 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted. The microprocessor may use a lower voltage power supply level for minimum sized fast transistors in the fast core logic portions of the microprocessor, and a more normal voltage power supply voltage level for the cache memory and I/O transistor portions of the microprocessor. Thus a compact capacitor with multiple power and reference supply levels may be needed to provide the required power for a high frequency IC.

摘要翻译： 一种用于形成用于向诸如集成电路的电气设备提供多个功率和参考电源电压电平的分离薄膜电容器的装置和方法可用于空间受限的应用中，并且在需要非常紧密的电连接的应用中 电力消费者和电源。 空间限制应用和紧密耦合应用的示例可以是诸如微处理器的集成电路（IC）。 要向微处理器供电和调节功率需要紧密耦合，以便响应在高时钟速率微处理器中可能发现的瞬时功率需求，并且微处理器封装内的空间是非常有限的。 微处理器可以在微处理器的快速核心逻辑部分中为最小尺寸的快速晶体管使用较低电压电源电平，以及用于微处理器的高速缓冲存储器和I / O晶体管部分的更正常的电压电源电压电平。 因此，可能需要具有多个功率和参考电源电平的紧凑型电容器来为高频IC提供所需的功率。

公开(公告)号：US07986532B2

公开(公告)日：2011-07-26

申请号：US12509666

申请日：2009-07-27

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01L23/49822 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15312 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus includes a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits. Such capacitor may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted. The microprocessor may use a lower voltage power supply level for minimum sized fast transistors in the fast core logic portions of the microprocessor, and a more normal voltage power supply voltage level for the cache memory and I/0 transistor portions of the microprocessor. Thus a compact capacitor with multiple power and reference supply levels may be needed to provide the required power for a high frequency IC.

摘要翻译： 一种装置包括用于向诸如集成电路的电气装置提供多个功率和参考电源电压电平的分裂薄膜电容器。 这种电容器可能在空间受限的应用中以及在电力消耗器和电源之间需要非常紧密的电连接的应用中是有用的。 空间限制应用和紧密耦合应用的示例可以是诸如微处理器的集成电路（IC）。 要向微处理器供电和调节功率需要紧密耦合，以便响应在高时钟速率微处理器中可能发现的瞬时功率需求，并且微处理器封装内的空间是非常有限的。 微处理器可以在微处理器的快速核心逻辑部分中使用较低电压电源电平用于最小尺寸的快速晶体管，以及微处理器的高速缓冲存储器和I / O晶体管部分的更正常的电压电源电压电平。 因此，可能需要具有多个功率和参考电源电平的紧凑型电容器来为高频IC提供所需的功率。

公开(公告)号：US07810234B2

公开(公告)日：2010-10-12

申请号：US11733266

申请日：2007-04-10

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H05K3/30 ,  H01G4/28

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01L23/49822 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15312 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： An apparatus, and a method for forming, a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit (IC) such as a microprocessor. The capacitor supplying and moderating power to the microprocessor needs to be closely coupled in order to respond to instantaneous power demands that may be found in high clock rate microprocessors, and the space inside a microprocessor package is very restricted. The microprocessor may use a lower voltage power supply level for minimum sized fast transistors in the fast core logic portions of the microprocessor, and a more normal voltage power supply voltage level for the cache memory and I/O transistor portions of the microprocessor. Thus a compact capacitor with multiple power and reference supply levels may be needed to provide the required power for a high frequency IC.

摘要翻译： 一种用于形成用于向诸如集成电路的电气设备提供多个功率和参考电源电压电平的分离薄膜电容器的装置和方法可用于空间受限的应用中，并且在需要非常紧密的电连接的应用中 电力消费者和电源。 空间限制应用和紧密耦合应用的示例可以是诸如微处理器的集成电路（IC）。 要向微处理器供电和调节功率需要紧密耦合，以便响应在高时钟速率微处理器中可能发现的瞬时功率需求，并且微处理器封装内的空间是非常有限的。 微处理器可以在微处理器的快速核心逻辑部分中为最小尺寸的快速晶体管使用较低电压电源电平，以及用于微处理器的高速缓冲存储器和I / O晶体管部分的更正常的电压电源电压电平。 因此，可能需要具有多个功率和参考电源电平的紧凑型电容器来为高频IC提供所需的功率。

公开(公告)号：US07216406B2

公开(公告)日：2007-05-15

申请号：US10954644

申请日：2004-09-29

申请人： Cengiz A. Palanduz ,  Larry E. Mosley

发明人： Cengiz A. Palanduz ,  Larry E. Mosley

IPC分类号： H04R17/00 ,  H01G4/06

CPC分类号： H01G4/33 ,  H01G4/228 ,  H01L23/49822 ,  H01L23/5223 ,  H01L27/016 ,  H01L28/40 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15312 ,  Y10T29/42 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for forming a split thin film capacitor for providing multiple power and reference supply voltage levels to electrical devices such as integrated circuits, may be useful in space restricted applications, and in applications that require very close electrical connections between the power consumer and the power supply. An example of both a space restricted application and a close coupling application may be an integrated circuit such as a microprocessor, that may need a closely coupled capacitor supplying and moderating power to the microprocessor in order to quickly respond to instantaneous power demands that may be found in high clock rate devices. The method may supply a lower voltage power supply level for minimum sized transistors in the fast core logic portions of the microprocessor, and a higher voltage power supply level for the cache memory and I/O transistors.

摘要翻译： 用于形成用于向电气设备（例如集成电路）提供多个功率和参考电源电压电平的分裂薄膜电容器的方法可用于空间受限的应用中，并且在需要电力消耗器和功率之间非常紧密的电连接的应用中 供应。 空间限制应用和紧密耦合应用的示例可以是诸如微处理器的集成电路，其可能需要紧密耦合的电容器向微处理器供电和调节电力，以便快速响应可能发现的瞬时功率需求 在高速时钟设备。 该方法可以为微处理器的快速核心逻辑部分中的最小尺寸的晶体管提供较低电压电源电平，以及用于高速缓冲存储器和I / O晶体管的较高电压电源电平。

公开(公告)号：US20080157343A1

公开(公告)日：2008-07-03

申请号：US11648220

申请日：2006-12-29

申请人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

发明人： Sriram Dattaguru ,  Larry Binder ,  Cengiz A. Palanduz ,  Chris Jones ,  Dave Bach ,  Kaladhar Radhakrishnan ,  Timothe Litt

IPC分类号： H01L23/13

CPC分类号： H05K1/0262 ,  H01L23/642 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10545 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/0401

摘要： In some embodiments, a ceramic interposer with silicon voltage regulator and array capacitor combination for integrated circuit packages is presented. In this regard, an apparatus is introduced having a bowl-shaped ceramic interposer containing conductive traces, one or more silicon voltage regulator(s) coupled with contacts on a first surface of the ceramic interposer, and one or more array capacitor(s) coupled with contacts on a second surface of the ceramic interposer. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，提供了具有用于集成电路封装的硅电压调节器和阵列电容器组合的陶瓷插入器。 在这方面，引入了一种装置，其具有包含导电迹线的碗形陶瓷插入器，与陶瓷插入件的第一表面上的触点耦合的一个或多个硅电压调节器，以及一个或多个耦合的阵列电容器 在陶瓷插入件的第二表面上具有触点。 还公开并要求保护其他实施例。

公开(公告)号：US07372126B2

公开(公告)日：2008-05-13

申请号：US11096235

申请日：2005-03-31

申请人： John S. Guzek ,  Cengiz A. Palanduz ,  Victor Prokofiev

发明人： John S. Guzek ,  Cengiz A. Palanduz ,  Victor Prokofiev

IPC分类号： H01L29/00

CPC分类号： H01L23/49822 ,  H01G4/236 ,  H01G4/33 ,  H01L21/4857 ,  H01L23/50 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/15312 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09718 ,  Y10T29/435 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A thin-film capacitor assembly includes two plates that are accessed through deep and shallow vias. The thin-film capacitor assembly is able to be coupled with a spacer and an interposer. The thin-film capacitor assembly is also able to be stacked with a plurality of thin-film capacitor assemblies. The thin-film capacitor assembly is also part of computing system.

摘要翻译： 薄膜电容器组件包括通过深和浅通孔访问的两个板。 薄膜电容器组件能够与间隔件和插入件耦合。 薄膜电容器组件也能够与多个薄膜电容器组件堆叠。 薄膜电容器组件也是计算系统的一部分。